Patents by Inventor Kouji Sajiki

Kouji Sajiki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bump forming method and apparatus therefor
    Patent number: 6460755
    Abstract: There are disclosed a solder bump forming method and an apparatus therefor, which achieve a high reliability, and an electronic part, produced by this method and this apparatus, is also disclosed. For each of the step of arraying solder balls, the step of supplying a flux, and the step of mounting the solder balls on a board, it is checked whether or not any solder ball is omitted, and the process is conducted while confirming the condition of the operation, thereby enhancing the reliability and also preventing defective products from being produced.
    Type: Grant
    Filed: March 7, 1997
    Date of Patent: October 8, 2002
    Assignees: Hitachi, Ltd., Hitachi Seiko Ltd.
    Inventors: Kosuke Inoue, Takamichi Suzuki, Hitoshi Odashima, Katsuhiro Iwashita, Tatsuya Yoneda, Michiharu Honda, Katuhisa Tanaka, Tsuyoshi Yamaguchi, Tetsuo Murakami, Asahi Tsuchiya, Yoshitatsu Naito, Mitsuhiro Suzuki, Izumi Hata, Kouji Sajiki