Abstract: An electronic component includes an element body, a thin film layer disposed to cover a pair of end surfaces and four side surfaces, a first external electrode and a second external electrode, and internal conductors, wherein each of the first external electrode and the second external electrode has first electrode layers disposed on the thin film layer and electrically connected to the internal conductors, and second electrode layers disposed to cover the first electrode layers, and a thermal conductivity of the second electrode layers is lower than a thermal conductivity of the first electrode layers.

Abstract: An electronic component includes an element body, a thin film layer disposed to cover a pair of end surfaces and four side surfaces, a first external electrode and a second external electrode, and internal conductors, wherein each of the first external electrode and the second external electrode has first electrode layers disposed on the thin film layer and electrically connected to the internal conductors, and second electrode layers disposed to cover the first electrode layers, and a thermal conductivity of the second electrode layers is lower than a thermal conductivity of the first electrode layers.

Abstract: An electronic component includes an element body, a thin film layer disposed to cover a pair of end surfaces and four side surfaces, a first external electrode and a second external electrode, and internal conductors, wherein each of the first external electrode and the second external electrode has first electrode layers disposed on the thin film layer and electrically connected to the internal conductors, and second electrode layers disposed to cover the first electrode layers, and a thermal conductivity of the second electrode layers is lower than a thermal conductivity of the first electrode layers.

Abstract: A chip thermistor 1 has a thermistor portion 7 comprised of a ceramic material containing respective metal oxides of Mn, Ni, and Co as major ingredients; a pair of composite portions 9, 9 comprised of a composite material of Ag—Pd, and respective metal oxides of Mn, Ni, and Co and arranged on both sides of the thermistor portion 7 so as to sandwich in the thermistor portion 7 between the composite portions 9, 9; and external electrodes 5, 5 connected to the pair of composite portions 9, 9, respectively. In this manner, the pair of composite portions 9, 9 are used as bulk electrodes and, for this reason, the resistance of the chip thermistor 1 can be adjusted mainly with consideration to the resistance in the thermistor portion 7, without need for much consideration to the distance between the external electrodes 5, 5 and other factors.

Abstract: A chip thermistor includes a thermistor element body and a pair of outer electrodes. The thermistor element body has a pair of end faces opposing each other and a main face connecting the end faces to each other. The pair of outer electrodes are arranged on the pair of end faces, respectively. The pair of outer electrodes have a width in a direction intersecting the opposing direction of the pair of end faces made narrower with distance from the thermistor element body.

Abstract: A chip thermistor is provided with a thermistor element body, a first electrode, a second electrode, and a third electrode. The thermistor element body has a first principal face and a second principal face opposed to each other in a first direction. The first electrode and the second electrode are arranged as separated from each other in a second direction perpendicular to the first direction, on the first principal face of the thermistor element body. The third electrode is arranged so as to lap over the first electrode and the second electrode, when viewed from the first direction, on the second principal face of the thermistor element body.

Abstract: A chip thermistor 1 has a thermistor portion 7 comprised of a ceramic material containing respective metal oxides of Mn, Ni, and Co as major ingredients; a pair of composite portions 9, 9 comprised of a composite material of Ag—Pd, and respective metal oxides of Mn, Ni, and Co and arranged on both sides of the thermistor portion 7 so as to sandwich in the thermistor portion 7 between the composite portions 9, 9; and external electrodes 5, 5 connected to the pair of composite portions 9, 9, respectively. In this manner, the pair of composite portions 9, 9 are used as bulk electrodes and, for this reason, the resistance of the chip thermistor 1 can be adjusted mainly with consideration to the resistance in the thermistor portion 7, without need for much consideration to the distance between the external electrodes 5, 5 and other factors.

Abstract: A chip thermistor has a thermistor portion including a ceramic material containing respective metal oxides of Mn, Ni, and Co as major ingredients; a pair of composite portions including a composite material of Ag—Pd, and respective metal oxides of Mn, Ni, and Co and arranged on both sides of the thermistor portion so as to sandwich in the thermistor portion between the composite portions; and external electrodes connected to the pair of composite portions, respectively. In this manner, the pair of composite portions are used as bulk electrodes and, for this reason, the resistance of the chip thermistor can be adjusted mainly with consideration to the resistance in the thermistor portion without need for much consideration to the distance between the external electrodes and other factors.

Abstract: A chip thermistor comprises a thermistor element body and a pair of outer electrodes. The thermistor element body has a pair of end faces opposing each other and a main face connecting the end faces to each other. The pair of outer electrodes are arranged on the pair of end faces, respectively. The pair of outer electrodes have a width in a direction intersecting the opposing direction of the pair of end faces made narrower with distance from the thermistor element body.

Abstract: A chip thermistor is provided with a thermistor element body, a first electrode, a second electrode, and a third electrode. The thermistor element body has a first principal face and a second principal face opposed to each other in a first direction. The first electrode and the second electrode are arranged as separated from each other in a second direction perpendicular to the first direction, on the first principal face of the thermistor element body. The third electrode is arranged so as to lap over the first electrode and the second electrode, when viewed from the first direction, on the second principal face of the thermistor element body.

Abstract: A chip thermistor has a thermistor portion including a ceramic material containing respective metal oxides of Mn, Ni, and Co as major ingredients; a pair of composite portions including a composite material of Ag—Pd, and respective metal oxides of Mn, Ni, and Co and arranged on both sides of the thermistor portion so as to sandwich in the thermistor portion between the composite portions; and external electrodes connected to the pair of composite portions, respectively. In this manner, the pair of composite portions are used as bulk electrodes and, for this reason, the resistance of the chip thermistor can be adjusted mainly with consideration to the resistance in the thermistor portion without need for much consideration to the distance between the external electrodes and other factors.

Abstract: A drum-type polishing apparatus for producing a flat mirror polish on an object such as a semiconductor wafer, is capable of three degrees of freedom of movement of a drum member with respect to the wafer. The relative movements can be made, successively or simultaneously, at right angles to an axis of the drum, parallel to the surface of the wafer, as well as at any desired angular orientations. Combined with a follower device to provide automatic compensation for unevenness in pressing pressure applied to the wafer during polishing, the polishing apparatus offers outstanding uniformity in polishing quality and high productivity, even for large diameter wafers, with a comparatively modest investment in both facility space and equipment cost.