Patents by Inventor Kuan-Kun TANG

Kuan-Kun TANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9459674
    Abstract: A power integration module includes a first input connector, a second input connector, an output connector, a switch unit, a determining unit. The first input connector and the second input connector are electrically connected to a first power supply and a second power supply of a power supply module. The output connector is electrically connected to an electrical load. The switch unit is coupled between the first input connector, the second input connector and the output connector. When the switch unit is turned on, the first input power supply and the second input power supply are integrated in parallel and outputted to the output connector to the electrical load. Moreover, an electronic device with a plurality of power integration modules is provided. Thus, the wrong connection is prevented and the condition that the power supplies of different electrical parameters are connected in parallel is avoided.
    Type: Grant
    Filed: November 6, 2013
    Date of Patent: October 4, 2016
    Assignee: ASUSTeK COMPUTER INC.
    Inventors: Yi-Peng Lin, Kuan-Kun Tang, Pei-Jung Lin
  • Patent number: 9310255
    Abstract: A heat-dissipation system and a matrix thermal sensing circuit are provided. The heat-dissipation is used in an electronic device. The electronic device comprises a circuit board and a plurality of load elements disposed on the circuit board. The matrix thermal sensing circuit includes a current sensing module and a calculation module. The current sensing module includes a plurality of sensing nodes. Each sensing node is electrically connected to a current feeding terminal of one corresponding load element, and senses the working current of the corresponding load element respectively. The calculation module is connected to the current sensing module and is used to determine thermal state of the location of the sensing node according to the working current respectively.
    Type: Grant
    Filed: December 30, 2013
    Date of Patent: April 12, 2016
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Chung-Wei Kuo, Kuo-Chen Huang, Kuan-Kun Tang
  • Publication number: 20140198451
    Abstract: A heat-dissipation system and a matrix thermal sensing circuit are provided. The heat-dissipation is used in an electronic device. The electronic device comprises a circuit board and a plurality of load elements disposed on the circuit board. The matrix thermal sensing circuit includes a current sensing module and a calculation module. The current sensing module includes a plurality of sensing nodes. Each sensing node is electrically connected to a current feeding terminal of one corresponding load element, and senses the working current of the corresponding load element respectively. The calculation module is connected to the current sensing module and is used to determine thermal state of the location of the sensing node according to the working current respectively.
    Type: Application
    Filed: December 30, 2013
    Publication date: July 17, 2014
    Applicant: ASUSTeK COMPUTER INC.
    Inventors: Chung-Wei KUO, Kuo-Chen HUANG, Kuan-Kun TANG
  • Publication number: 20140143571
    Abstract: A power integration module includes a first input connector, a second input connector, an output connector, a switch unit, a determining unit. The first input connector and the second input connector are electrically connected to a first power supply and a second power supply of a power supply module. The output connector is electrically connected to an electrical load. The switch unit is coupled between the first input connector, the second input connector and the output connector. When the switch unit is turned on, the first input power supply and the second input power supply are integrated in parallel and outputted to the output connector to the electrical load. Moreover, an electronic device with a plurality of power integration modules is provided. Thus, the wrong connection is prevented and the condition that the power supplies of different electrical parameters are connected in parallel is avoided.
    Type: Application
    Filed: November 6, 2013
    Publication date: May 22, 2014
    Applicant: AsusTeK Computer Inc.
    Inventors: Yi-Peng LIN, Kuan-Kun TANG, Pei-Jung LIN