Abstract: The present disclosure provides an electronic device including a redistribution layer, a plurality of passive components, and an electronic component. The redistribution layer includes a first insulating layer, a second insulating layer, and a plurality of traces electrically connected to each other through a first opening of the first insulating layer and a second opening of the second insulating layer, wherein the first insulating layer has a first side away from the second insulating layer, and the second insulating layer has a second side away from the first insulating layer. The passive components are disposed on the first side. The electronic component is disposed on the second side. The plurality of passive components are electrically connected to the electronic component through the plurality of traces.

Abstract: A memory device is provided, including an array of bit cells and a set of tracking cells. The set of tracking cells is arranged adjacent to the array of bit cells along a first direction. The set of tracking cells includes a set of first tracking cells configured to perform a read tracking operation and a set of second tracking cells configured to perform a write tracking operation and arranged adjacent to the set of first tracking cells along a second direction. First tracking cells in the set of first tracking cells are coupled in series with each other and arranged along the second direction, and second tracking cells in the set of second tracking cells are coupled in series with each other and arranged along the second direction.

Abstract: A method of manufacturing a semiconductor device includes forming a photoresist layer over a substrate, selectively exposing the photoresist layer to an EUV radiation, and developing the selectively exposed photoresist layer. The photoresist layer has a composition including a solvent and a photo-active compound dissolved in the solvent and composed of a molecular cluster compound incorporating hexameric tin and two chloro ligands.

Abstract: A memory device includes a first group of memory cells, a second group of memory cells, a third group of memory cells, and a fourth group of memory cells. A control circuit performs a first read/write operation during a first time interval by writing a first data value to the first group while concurrently reading a second data value from the second group. The control circuit performs a second read/write operation during a second time interval, which is after the first time interval, by writing a third data value to the third group while concurrently reading a fourth data value from the fourth group. The first and third data values are collectively made up of N-bits and collectively correspond to an N-bit input data word provided onto input pins of the memory device prior to the first time interval.

Abstract: A memory device includes a first group of memory cells, a second group of memory cells, a third group of memory cells, and a fourth group of memory cells. A control circuit performs a first read/write operation during a first time interval by writing a first data value to the first group while concurrently reading a second data value from the second group. The control circuit performs a second read/write operation during a second time interval, which is after the first time interval, by writing a third data value to the third group while concurrently reading a fourth data value from the fourth group. The first and third data values are collectively made up of N-bits and collectively correspond to an N-bit input data word provided onto input pins of the memory device prior to the first time interval.

Abstract: Some embodiments of the present disclosure relate to a memory device wherein a single memory cell array is partitioned between two or more tiers which are vertically integrated on a single substrate. The memory device also includes support circuitry including a control circuit configured to read and write data to the memory cells on each tier, and a shared input/output (I/O) architecture which is connected the memory cells within each tier and configured to receive input data word prior to a write operation, and further configured to provide output data word after a read operation. Other devices and methods are also disclosed.

Abstract: A memory circuit includes a first row of memory cells, a first word line and a second word line over and electrically coupled to the first row of memory cells, a second row of memory cells aligned with the first row of memory cells along a predetermined direction, and a third word line and a fourth word line over and electrically coupled to the second row of memory cells. The first word line is aligned with the third word line, and the second word line is aligned with the fourth word line. One of the first word line or the second word line is electrically coupled with one of the third word line or the fourth word line. The other one of the first word line or the second word line is electrically decoupled from the other one of the third word line or fourth word line.

Abstract: An integrated circuit includes a plurality of metal layers of bit cells of a memory cell array disposed in a first metal layer and extending in a first direction, a plurality of word lines of the memory cell array disposed in a second metal layer and extending in a second direction that is different from the first direction, and at least two conductive traces disposed in a third metal layer substantially adjacent to each other and extending at least partially across the memory cell array, a first one of the at least two conductive traces coupled to a driving source node of a write assist circuit, and a second conductive trace of the at least two conductive traces coupled to an enable input of the write-assist circuit, where the at least two conductive traces form at least one embedded capacitor having a capacitive coupling to the bit line.

Abstract: A configuration for a bit-1 read-only memory (ROM) cell is provided. The bit-1 ROM cell comprises a first circuit connected to a second circuit. The first circuit comprises a first transistor and the second circuit comprises a second transistor. The second circuit is configured to receive a YMUX signal. The second circuit is connected to a word-line bar. The second circuit is configured to maintain a disconnection or connection between the first transistor and the word-line bar based upon the YMUX signal. The first circuit is located on a different physical layer than the second circuit.

Abstract: A method includes generating a first and a second internal clock signal from a clock signal, wherein a first internal clock signal edge of the first internal clock signal and a second internal clock signal edge of the second internal clock signal are generated from a same edge of the clock signal. A first one of the first and the second internal clock edges is used to trigger a first operation on a six-transistor (6T) Static Random Access Memory (SRAM) cell of a SRAM array. A second one of the first and the second internal clock edges is used to trigger a second operation on the 6T SRAM cell. The first and the second operations are performed on different ports of the 6T SRAM. The first and the second operations are performed within a same clock cycle of the clock signal.

Abstract: Some embodiments of the present disclosure relate to a memory device wherein a single memory cell array is partitioned between two or more tiers which are vertically integrated on a single substrate. The memory device also includes support circuitry including a control circuit configured to read and write data to the memory cells on each tier, and a shared input/output (I/O) architecture which is connected the memory cells within each tier and configured to receive input data word prior to a write operation, and further configured to provide output data word after a read operation. Other devices and methods are also disclosed.

Abstract: A configuration for a bit-1 read-only memory (ROM) cell is provided. The bit-1 ROM cell comprises a first circuit connected to a second circuit. The first circuit comprises a first transistor and the second circuit comprises a second transistor. The second circuit is configured to receive a YMUX signal. The second circuit is connected to a word-line bar. The second circuit is configured to maintain a disconnection or connection between the first transistor and the word-line bar based upon the YMUX signal. The first circuit is located on a different physical layer than the second circuit.

Abstract: An integrated circuit includes a plurality of metal layers of bit cells of a memory cell array disposed in a first metal layer and extending in a first direction, a plurality of word lines of the memory cell array disposed in a second metal layer and extending in a second direction that is different from the first direction, and at least two conductive traces disposed in a third metal layer substantially adjacent to each other and extending at least partially across the memory cell array, a first one of the at least two conductive traces coupled to a driving source node of a write assist circuit, and a second conductive trace of the at least two conductive traces coupled to an enable input of the write-assist circuit, where the at least two conductive traces form at least one embedded capacitor having a capacitive coupling to the bit line.

Abstract: Among other things, an n-bit ROM cell, such as a twin-bit ROM cell, and techniques for addressing one or more ROM cell portions of the n-bit ROM cell are provided. A twin-bit ROM cell comprises a first ROM cell portion adjacent to or substantially contiguous with a second ROM cell portion. The first ROM cell portion is associated with a first data bit value. The second ROM cell portion is associated with a second data bit value distinct from the first data bit value. Because the first ROM cell portion is adjacent to the second ROM cell portion, OD-to-OD spacing between the twin-bit ROM cell and an adjacent twin-bit ROM cell is increased to provide, for example, improved isolation, cell current, ROM speed, and VCCmin performance in comparison with single-bit ROM cells, while maintaining a substantially similar to pitch as the single-bit ROM cells.

Abstract: Among other things, an n-bit ROM cell, such as a twin-bit ROM cell, and techniques for addressing one or more ROM cell portions of the n-bit ROM cell are provided. A twin-bit ROM cell comprises a first ROM cell portion adjacent to or substantially contiguous with a second ROM cell portion. The first ROM cell portion is associated with a first data bit value. The second ROM cell portion is associated with a second data bit value distinct from the first data bit value. Because the first ROM cell portion is adjacent to the second ROM cell portion, OD-to-OD spacing between the twin-bit ROM cell and an adjacent twin-bit ROM cell is increased to provide, for example, improved isolation, cell current, ROM speed, and VCCmin performance in comparison with single-bit ROM cells, while maintaining a substantially similar to pitch as the single-bit ROM cells.

Abstract: A circuit includes a first inverter including a first PMOS transistor and a first NMOS transistor, and a second inverter including a second PMOS transistor and a second NMOS transistor. A first node is connected to gates of the first PMOS transistor and the first NMOS transistor and drains of the second PMOS transistor and the second NMOS transistor. A second node is connected to gates of the second PMOS transistor and the second NMOS transistor and drains of the first PMOS transistor and the first NMOS transistor. The circuit further includes a first capacitor having a first capacitance connected to the first node; and a second capacitor having a second capacitance connected to the second node. The second capacitance is greater than the first capacitance.

Abstract: A circuit includes a first inverter including a first PMOS transistor and a first NMOS transistor, and a second inverter including a second PMOS transistor and a second NMOS transistor. A first node is connected to gates of the first PMOS transistor and the first NMOS transistor and drains of the second PMOS transistor and the second NMOS transistor. A second node is connected to gates of the second PMOS transistor and the second NMOS transistor and drains of the first PMOS transistor and the first NMOS transistor. The circuit further includes a first capacitor having a first capacitance connected to the first node; and a second capacitor having a second capacitance connected to the second node. The second capacitance is greater than the first capacitance.

Abstract: A memory circuit includes a first memory array. The first memory array includes at least one first memory cell for storing a first datum. The at least one first memory cell is coupled with a first word line and a second word line. A second memory array is coupled with the first memory array. The second memory array includes at least one second memory cell for storing a second datum. The at least one second memory cell is coupled with a third word line and a fourth word line. The first word line is coupled with the third word line. The first word line is misaligned from the third word line in a routing direction of the first word line in the first memory array.

Abstract: A circuit includes a first inverter including a first PMOS transistor and a first NMOS transistor, and a second inverter including a second PMOS transistor and a second NMOS transistor. A first node is connected to gates of the first PMOS transistor and the first NMOS transistor and drains of the second PMOS transistor and the second NMOS transistor. A second node is connected to gates of the second PMOS transistor and the second NMOS transistor and drains of the first PMOS transistor and the first NMOS transistor. The circuit further includes a first capacitor having a first capacitance connected to the first node; and a second capacitor having a second capacitance connected to the second node. The second capacitance is greater than the first capacitance.

Abstract: A memory device includes an array of transistors, a plurality of bit lines, and a plurality of source lines. The transistors include gate, drain and source terminals. The gate terminals are electrically coupled to word lines. The plurality of bit lines connect a power source to the drain terminals of the array of transistors and the plurality of source lines connect the power source to the source terminals of the array of transistors. The connections are made active during a standby mode, thereby limiting leakage current without entailing drawbacks associated with degraded memory access/cycle time.