Abstract: Systems, assemblies, and methods for detecting changes in polarization states are described. Example systems may include a light receiving unit including a sensor and a receiving polarizer. The sensor is configured to sense light from a polarized light source deflected through the receiving polarizer by a light directing article. The sensor is configured to generate a signal indicative a received polarization state of light deflected by the light directing articles. Such systems may be coupled to vehicles and may be useful for sensor-detectable signs, indicia, and markings to facilitate automated or assisted vehicular transport.

Abstract: Optical constructions are disclosed. A disclosed optical construction includes a reflective polarizer layer, and an optical film that is disposed on the reflective polarizer layer. The optical film has an optical haze that is not less than about 50%. Substantial portions of each two neighboring major surfaces in the optical construction are in physical contact with each other. The optical construction has an axial luminance gain that is not less than about 1.2.

Abstract: In a method of manufacturing a semiconductor device, a first source/drain structure is formed over a substrate, one or more first insulating layers are formed over the first source/drain structure, a first opening is formed in the one or more first insulating layers, the first opening is filled with a first conductive material to form a first lower contact in contact with the first source/drain structure, one or more second insulating layers are formed over the first lower contact, a second opening is formed in the one or more second insulating layers to at least partially expose the first lower contact, a first liner layer is formed on at least a part of an inner side face of the second opening, and the second opening is filled with a second conductive material to form a first upper contact in contact with the first lower contact without the first liner layer.

Abstract: The present invention provides a system for real-time pain detection, which comprises a means for acquiring biomedical signals relating to pain in a subject in need thereof, a computing means for transforming the acquired biomedical signals during a given period of time into the signal data for measurement of pain, analyzing the data to divide into two or more models, including at least a pain model which is defined by the data showing a peak-shaped profile and a non-pain model which is defined by the data showing a flat profile, whereby the pain status of the subject is measured based on the results of the analysis, a process means for generating an index of pain using the results of the analysis depending on the subject's demands or sensation, and a display showing the pain status of the subject.

Abstract: Optical constructions are disclosed. A disclosed optical construction includes a reflective polarizer layer, and an optical film that is disposed on the reflective polarizer layer. The optical film has an optical haze that is not less than about 50%. Substantial portions of each two neighboring major surfaces in the optical construction are in physical contact with each other. The optical construction has an axial luminance gain that is not less than about 1.2.

Abstract: A micro/nanoparticle-reinforced composite solder for low-temperature soldering and a preparation method thereof belong to the manufacturing field of lead-free low-temperature soldering solders. Micro/nanoparticle-reinforced tin-based alloy solder powder is formed by diffusely mixing micro/nano-sized Cu, Ag and Sb particles with a molten metal tin and atomizing the mixture, and then blended with low-melting-point SnBi-based alloy solder powder and a conventional flux to prepare a micro/nanoparticle-reinforced composite solder. In soldering at a temperature below 200° C.

Abstract: Retroreflecting articles are described. In particular, retroreflecting articles including a quarter wave retarder and a retroreflecting layer are described. The retarder is rotationally invariant and the retroreflecting layer is non-depolarizing. Such articles may be useful for sensor-detectable signs, labels, and garments.

Abstract: The present disclosure includes in one instance an optical article comprising a data rich plurality of retroreflective meats that are configured in a spatially defined arrangement, where the plurality of retroreflective elements comprise retroreflective elements having at least two different retroreflective properties, and where data rich means information that is readily machine interpretable. The present disclosure also includes a system comprising the previously mentioned optical article, an optical system, and an inference engine for interpreting and classifying the plurality of retroreflective elements wherein the optical system feeds data to the inference engine.

Abstract: The present disclosure provides an integrated circuit (IC) structure that includes a fin active region on a substrate; a metal gate stack on the fin active region; a source and a drain on the fin active region, wherein the metal gate stack spans from the source to the drain; an interlayer dielectric (ILD) layer disposed on the source and the drain; a first conductive feature and a second conductive feature formed in the ILD layer and being aligned on the source and the drain, respectively; and a dielectric material layer surrounding the first and second conductive features. The dielectric material layer continuously extends to a bottom surface of the first conductive feature and isolates the first conductive feature from the source and the second conductive feature contacts the drain.

Abstract: An article may include a biodata page defining a perimeter including an edge and a hinge layer attached to at least a portion of the biodata page. The hinge layer comprises a cross-linked polyurethane. In some examples, the hinge layer may include a cross-linked thermoset polyurethane.

Abstract: The present disclosure provides a method of fabricating an integrated circuit in accordance with some embodiments. The method includes forming a source and a drain on a fin active region of a semiconductor substrate; depositing an interlayer dielectric (ILD) layer on the source and drain; patterning the ILD layer to form a first contact hole and a second contact hole aligning with the source and drain, respectively; forming a dielectric material layer in the first contact hole; and forming a first conductive feature and a second conductive feature in the first and second contact holes, respectively.

Abstract: In some examples, an optically active article includes a retroreflective substrate; and at least one security element disposed at the retroreflective substrate; an article message disposed at the retroreflective substrate, and wherein the at least one security element comprises validation information that is detectable outside a visible light spectrum, and wherein a combination of the article message and the validation information of the at least one security element indicates whether the optically active article is counterfeit.

Abstract: The present disclosure provides a method of fabricating an integrated circuit in accordance with some embodiments. The method includes forming a source and a drain on a fin active region of a semiconductor substrate; depositing an interlayer dielectric (ILD) layer on the source and drain; patterning the ILD layer to form a first contact hole and a second contact hole aligning with the source and drain, respectively; forming a dielectric material layer in the first contact hole; and forming a first conductive feature and a second conductive feature in the first and second contact holes, respectively.

Abstract: A fingerprint imaging system is described comprising a film including an optically transparent self-wetting adhesive layer adhered to an imaging surface of an electronic optical image sensor. Also described is a method of use of an optical imaging system, and a film and multilayer film suitable for use with a fingerprint imaging system.

Abstract: Described herein is composite article comprising a substrate; and on at least one face of the substrate a multilayered coating disposed thereon.

Abstract: A semiconductor structure and a method for forming the same are provided. The semiconductor structure includes a substrate and a gate structure formed over the substrate. The semiconductor structure further includes a first source/drain structure and a second source/drain structure formed in the substrate adjacent to the gate structure. The semiconductor structure further includes an interlayer dielectric layer formed over the substrate to cover the gate structure, the first source/drain structure, and the second source/drain structure. The semiconductor structure further includes a first conductive structure formed in the interlayer dielectric layer over the first source/drain structure. The semiconductor structure further includes a second conductive structure formed in the interlayer dielectric layer over the second source/drain structure.

Abstract: A semiconductor structure and a method for forming the same are provided. The semiconductor structure includes a substrate and a gate structure formed over the substrate. The semiconductor structure further includes a first source/drain structure and a second source/drain structure formed in the substrate adjacent to the gate structure. The semiconductor structure further includes an interlayer dielectric layer formed over the substrate to cover the gate structure, the first source/drain structure, and the second source/drain structure. The semiconductor structure further includes a first conductive structure formed in the interlayer dielectric layer over the first source/drain structure. The semiconductor structure further includes a second conductive structure formed in the interlayer dielectric layer over the second source/drain structure.

Abstract: An arrayed waveguide grating (AWG) based multi-core and multi-wavelength interconnection network, comprising N upper-level switches, N lower-level switches, and a network intermediate stage, with each upper- and lower-level switches has N CWDM optical transceiving modules. The N optical transceiving modules of each upper-level switch is connected with n m×1 multi-core optical multiplexing modules, the N optical transceiving modules of each lower-level switch is connected with n 1×m multi-core demultiplexing modules, the network intermediate stage is comprised of n2 r×r multi-core and multi-wavelength wiring modules. The upper-level multi-core optical multiplexing modules, the lower-level multi-core demultiplexing modules, and the n2 r×r multi-core and multi-wavelength wiring modules of the network intermediate stage are connected via an m-core MPO-MPO optical fiber jumper. The wiring complexity of the interconnection network is O(N2/r), with employment of a wavelength set of ?={?0, . . . , ?k-1}.

Abstract: Laser-personalizable security articles include multi-layer security documents. The multi-layer security document includes an optically transparent cover layer, a composite image and an imagable layer adjacent to the cover layer. The first surface of the cover layer is at least partially a microstructured surface, where the microstructured surface forms microlenses or a lenticular surface. The composite image is made by a collection of complete or partial images viewed through the microstructured surface of the cover layer. The composite image is located on or within the second surface of the cover layer. The imagable layer is a laser imagable layer. When imaged, a personalized second composite three dimensional image is created on or in the imagable layer.

Abstract: Provided herein are retroreflective colored article having a predetermined pattern of beaded and unbeaded regions and at least one polymeric color layer (130) covering at least a portion of the beaded and unbeaded regions, a reflector layer (140) covering the colour layer, and a carrier (150). Also disclosed are methods for making the articles.