Patents by Inventor Kun-Tang Teng

Kun-Tang Teng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5839641
    Abstract: A solder ball placement and alignment apparatus for placing and aligning a plurality of solder balls onto solder pads on a multi-chip substrate includes a placement tray and a base seat. The placement tray includes a solder ball gate, means for controlling movement of the gate, a plurality of placement through holes that correspond to the solder pads on the substrate, and a plurality of alignment cavities disposed on the underside of the placement tray. The solder ball gate is slidably mounted to the placement tray and, when the gate is at a first position, an opening in the placement tray is uncovered thereby permitting solder balls to be removed when the placement and alignment apparatus is tilted toward the direction of the opening. When the gate is at a second position, the opening of the placement tray is covered. The movement of the gate is controlled by an electromagnet and associated control circuit means or a mechanical device.
    Type: Grant
    Filed: March 13, 1997
    Date of Patent: November 24, 1998
    Assignee: Industrial Technology Research Institute
    Inventor: Kun-Tang Teng
  • Patent number: 5710459
    Abstract: This invention is discloses a packaged integrated circuit (IC) which includes an IC chip supported and securely attached to an adapter board. The package also includes a chip cap for covering and protecting the IC chip therein. The chip cap further forms a concave, step near a lower edge of the cap for wrapping around the edge of the adapter board for increasing the contact areas between the cap and the board and for securely attaching the cap to the board. The chip cap is composed of thermal conductive materials and the chip cap further includes a heat sink for dissipating heat generated from the IC chip. The adapter board further includes a plurality of connecting vias and a plurality of conductive metal balls forming a ball grid array (BGA) underneath the adapter board. The IC chip is in electrical and thermal contact with the BGA by filling the connection vias with conductive materials.
    Type: Grant
    Filed: August 9, 1996
    Date of Patent: January 20, 1998
    Assignee: Industrial Technology Research Institute
    Inventors: Kun-Tang Teng, Shin-Tang Jian, Shu-Chen Huang