Patents by Inventor Kuniaki Nakamura

Kuniaki Nakamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190194628
    Abstract: The present disclosure relates to methods of producing Enterovirus C, e.g., for poliomyelitis vaccine production. In some embodiments, the methods include adding polysorbate to the cell culture medium during or prior to inoculation with the virus and/or culturing cells in a fixed bed bioreactor. Further provided herein is an Enterovirus C produced by the methods of production disclosed herein, as well as compositions, immunogenic compositions, and vaccines related thereto.
    Type: Application
    Filed: September 1, 2017
    Publication date: June 27, 2019
    Applicants: Takeda Vaccines, Inc., Takeda Pharmaceutical Company Limited
    Inventors: Raman RAO, Tatsuki SATO, Kaori ODA, Kuniaki NAKAMURA, Takeshi NISHIHAMA
  • Patent number: 10333270
    Abstract: An optical module 1 according to an embodiment includes a plurality of laser diodes (LDs) 21 to 23, a multiplexing optical system 30 combining a plurality of laser beams from the respective plurality of LDs, and a package 10 accommodating the plurality of LDs and the multiplexing optical system. The package includes a support mounted with the multiplexing optical system, and a cap having a transmissive window that allows a resultant light beam to pass through. At least one of the LDs has an oscillation wavelength of nor more than 550 nm. The package has an internal moisture content of not more than 3000 ppm. The multiplexing optical system is fixed to the support by a resin curing adhesive.
    Type: Grant
    Filed: September 26, 2017
    Date of Patent: June 25, 2019
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Takashi Kyono, Hideyuki Ijiri, Takao Nakamura, Hiromi Nakanishi, Takatoshi Ikegami, Kuniaki Ishihara, Yohei Enya, Tetsuya Kumano
  • Patent number: 9784611
    Abstract: An image sensor module includes a light source unit that emits a linear light beam elongate in a primary scanning direction to an object to be read, and a lens unit including an incidence surface and an output surface oriented opposite to each other. The lens unit is configured to receive light from the object through the incidence surface and output the light through the output surface. The module also includes a sensor IC that receives the light outputted from the output surface, a housing that holds the light source unit and the lens unit, and a support member that supports the lens unit such that the incidence surface is located more distant from the sensor IC than the output surface in a secondary scanning direction. The support member includes a reflection surface that reflects the light from the object toward the incidence surface.
    Type: Grant
    Filed: May 20, 2015
    Date of Patent: October 10, 2017
    Assignee: ROHM CO., LTD.
    Inventors: Tadatoshi Miwa, Takumi Yamade, Yasuyuki Aritaki, Kuniaki Nakamura, Naoki Sekiguchi
  • Patent number: 9756207
    Abstract: An image sensor module includes an elongated light emitting unit, a photodetector, a lens unit, a substrate with the photodetector mounted on. The substrate is spaced apart from the lens unit in a thickness direction of the substrate. The image sensor module further includes a resin case provided with a light emitting unit chamber, a lens unit chamber and a substrate chamber. The lens unit chamber has a first bottom face extending in the first direction, and the substrate chamber has a second bottom face extending in the first direction and facing opposite to the first bottom face in the thickness direction of the substrate. The first or second bottom face is formed with at least one protrusion extending in the thickness direction of the substrate.
    Type: Grant
    Filed: May 11, 2016
    Date of Patent: September 5, 2017
    Assignee: ROHM CO., LTD.
    Inventor: Kuniaki Nakamura
  • Publication number: 20160337546
    Abstract: An image sensor module includes an elongated light emitting unit, a photodetector, a lens unit, a substrate with the photodetector mounted on. The substrate is spaced apart from the lens unit in a thickness direction of the substrate. The image sensor module further includes a resin case provided with a light emitting unit chamber, a lens unit chamber and a substrate chamber. The lens unit chamber has a first bottom face extending in the first direction, and the substrate chamber has a second bottom face extending in the first direction and facing opposite to the first bottom face in the thickness direction of the substrate. The first or second bottom face is formed with at least one protrusion extending in the thickness direction of the substrate.
    Type: Application
    Filed: May 11, 2016
    Publication date: November 17, 2016
    Inventor: Kuniaki NAKAMURA
  • Publication number: 20150253186
    Abstract: An image sensor module includes a light source unit that emits a linear light beam elongate in a primary scanning direction to an object to be read, and a lens unit including an incidence surface and an output surface oriented opposite to each other. The lens unit is configured to receive light from the object through the incidence surface and output the light through the output surface. The module also includes a sensor IC that receives the light outputted from the output surface, a housing that holds the light source unit and the lens unit, and a support member that supports the lens unit such that the incidence surface is located more distant from the sensor IC than the output surface in a secondary scanning direction. The support member includes a reflection surface that reflects the light from the object toward the incidence surface.
    Type: Application
    Filed: May 20, 2015
    Publication date: September 10, 2015
    Inventors: Tadatoshi MIWA, Takumi YAMADE, Yasuyuki ARITAKI, Kuniaki NAKAMURA, Naoki SEKIGUCHI
  • Patent number: 9060092
    Abstract: An image sensor module includes a light source unit that emits a linear light beam elongate in a primary scanning direction to an object to be read, and a lens unit including an incidence surface and an output surface oriented opposite to each other. The lens unit is configured to receive light from the object through the incidence surface and output the light through the output surface. The module also includes a sensor IC that receives the light outputted from the output surface, a housing that holds the light source unit and the lens unit, and a support member that supports the lens unit such that the incidence surface is located more distant from the sensor IC than the output surface in a secondary scanning direction. The support member includes a reflection surface that reflects the light from the object toward the incidence surface.
    Type: Grant
    Filed: February 27, 2014
    Date of Patent: June 16, 2015
    Assignee: ROHM CO., LTD.
    Inventors: Tadatoshi Miwa, Takumi Yamade, Yasuyuki Aritaki, Kuniaki Nakamura, Naoki Sekiguchi
  • Patent number: 8941898
    Abstract: A sensor IC of the present invention is provided with plurality of light receiving portions arranged in a row along a primary scanning direction and including a first light receiving portion for receiving light of a first wavelength, a second light receiving portion for receiving light of a second wavelength different from the first wavelength, and a third light receiving portion for receiving light of a third wavelength different from the first wavelength and the second wavelength. The sensor IC further includes a control circuit that outputs a first electric signal corresponding to light of the first wavelength received by the first light receiving portion, a second electric signal corresponding to light of the second wavelength received by the second light receiving portion, and a third electric signal corresponding to light of the third wavelength received by the third light receiving portion.
    Type: Grant
    Filed: July 16, 2013
    Date of Patent: January 27, 2015
    Assignee: Rohm Co., Ltd.
    Inventors: Hiroaki Onishi, Kuniaki Nakamura
  • Publication number: 20140198355
    Abstract: An image sensor module includes a light source unit that emits a linear light beam elongate in a primary scanning direction to an object to be read, and a lens unit including an incidence surface and an output surface oriented opposite to each other. The lens unit is configured to receive light from the object through the incidence surface and output the light through the output surface. The module also includes a sensor IC that receives the light outputted from the output surface, a housing that holds the light source unit and the lens unit, and a support member that supports the lens unit such that the incidence surface is located more distant from the sensor IC than the output surface in a secondary scanning direction. The support member includes a reflection surface that reflects the light from the object toward the incidence surface.
    Type: Application
    Filed: February 27, 2014
    Publication date: July 17, 2014
    Applicant: ROHM CO., LTD.
    Inventors: Tadatoshi MIWA, Takumi YAMADE, Yasuyuki ARITAKI, Kuniaki NAKAMURA, Naoki SEKIGUCHI
  • Patent number: 8693066
    Abstract: An image reading device and a method for manufacturing the same are provided, where the image reading device is capable of being assembled more efficiently. The image reading device includes: an optical part, extending long in a direction; a case, having an accommodating portion for accommodating the optical part; and a light receiving component, accommodated in the case. The optical part is fixed in the accommodating portion through a first adhesive and a second adhesive with hardening time longer than that of the first adhesive.
    Type: Grant
    Filed: January 26, 2012
    Date of Patent: April 8, 2014
    Assignee: Rohm Co., Ltd.
    Inventor: Kuniaki Nakamura
  • Publication number: 20140029072
    Abstract: A sensor IC of the present invention is provided with plurality of light receiving portions arranged in a row along a primary scanning direction and including a first light receiving portion for receiving light of a first wavelength, a second light receiving portion for receiving light of a second wavelength different from the first wavelength, and a third light receiving portion for receiving light of a third wavelength different from the first wavelength and the second wavelength. The sensor IC further includes a control circuit that outputs a first electric signal corresponding to light of the first wavelength received by the first light receiving portion, a second electric signal corresponding to light of the second wavelength received by the second light receiving portion, and a third electric signal corresponding to light of the third wavelength received by the third light receiving portion.
    Type: Application
    Filed: July 16, 2013
    Publication date: January 30, 2014
    Applicant: ROHM CO., LTD.
    Inventors: Hiroaki ONISHI, Kuniaki NAKAMURA
  • Patent number: 8530911
    Abstract: A semiconductor light emitting module is provided with a supporting conductor including a die bonding pad, and with a plurality of semiconductor light emitting elements bonded to the die bonding pad. The semiconductor light emitting elements are arranged in series along an arrangement line extending in a first direction. The die bonding pad includes a portion overlapping alternative die-bonding positions which are symmetrical to positions of the bonded semiconductor light emitting elements with respect to a line of symmetry extending in a second direction different from the first direction.
    Type: Grant
    Filed: November 6, 2008
    Date of Patent: September 10, 2013
    Assignee: Rohm Co., Ltd.
    Inventors: Hideki Sawada, Kuniaki Nakamura
  • Publication number: 20120194878
    Abstract: An image reading device and a method for manufacturing the same are provided, where the image reading device is capable of being assembled more efficiently. The image reading device includes: an optical part, extending long in a direction; a case, having an accommodating portion for accommodating the optical part; and a light receiving component, accommodated in the case. The optical part is fixed in the accommodating portion through a first adhesive and a second adhesive with hardening time longer than that of the first adhesive.
    Type: Application
    Filed: January 26, 2012
    Publication date: August 2, 2012
    Applicant: ROHM CO., LTD.
    Inventor: Kuniaki Nakamura
  • Publication number: 20090127569
    Abstract: A semiconductor light emitting module is provided with a supporting conductor including a die bonding pad, and with a plurality of semiconductor light emitting elements bonded to the die bonding pad. The semiconductor light emitting elements are arranged in series along an arrangement line extending in a first direction. The die bonding pad includes a portion overlapping alternative die-bonding positions which are symmetrical to positions of the bonded semiconductor light emitting elements with respect to a line of symmetry extending in a second direction different from the first direction.
    Type: Application
    Filed: November 6, 2008
    Publication date: May 21, 2009
    Applicant: ROHM CO., LTD.
    Inventors: Hideki Sawada, Kuniaki Nakamura
  • Patent number: 4730881
    Abstract: A monitor display unit having a hologram dry plate, formed by coating a glass base plate with sensitive material, and installed in an instrument panel of a vehicle. On the hologram dry plate are multiply recorded light interference fringes of three-dimensional images of the vehicle seen from the front and the rear of the vehicle. Two image reproduction lamps for illuminating reproduction light toward the hologram dry plate are provided on the right front and the left front of the hologram dry plate. When one image reproduction lamp is lighted, one three-dimensional image is reproduced on the hologram dry plate. Light emission diodes are provided rearward of the hologram dry plate so as to correspond to the positions of lamps on the three-dimensional image. The light emission of the light emission diodes is recognized through the hologram dry plate.
    Type: Grant
    Filed: November 6, 1986
    Date of Patent: March 15, 1988
    Assignee: Nippon Soken, Inc.
    Inventors: Masahiro Taguchi, Satosi Kuwakado, Kuniaki Nakamura