Patents by Inventor Kunihiro Izuno

Kunihiro Izuno has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210013385
    Abstract: A method of manufacturing a covering member includes: providing a first light-reflective member comprising a through-hole, the through-hole having first and second openings; arranging a light-transmissive resin containing a wavelength-conversion material within the through-hole; distributing the wavelength-conversion material predominantly on a side of the first opening of the through-hole within the light-transmissive resin; and after the step of distributing the wavelength-conversion material, removing a portion of the light-transmissive resin from a side of the second opening of the through-hole.
    Type: Application
    Filed: September 28, 2020
    Publication date: January 14, 2021
    Applicant: NICHIA CORPORATION
    Inventors: Tadao HAYASHI, Teruhito AZUMA, Suguru BEPPU, Kunihiro IZUNO, Tsuyoshi OKAHISA
  • Patent number: 10825967
    Abstract: A method of manufacturing a covering member includes: providing a first light-reflective member comprising a through-hole, the through-hole having first and second openings; arranging a light-transmissive resin containing a wavelength-conversion material within the through-hole; distributing the wavelength-conversion material predominantly on a side of the first opening of the through-hole within the light-transmissive resin; and after the step of distributing the wavelength-conversion material, removing a portion of the light-transmissive resin from a side of the second opening of the through-hole.
    Type: Grant
    Filed: June 20, 2019
    Date of Patent: November 3, 2020
    Assignee: NICHIA CORPORATION
    Inventors: Tadao Hayashi, Teruhito Azuma, Suguru Beppu, Kunihiro Izuno, Tsuyoshi Okahisa
  • Publication number: 20190312183
    Abstract: A method of manufacturing a covering member includes: providing a first light-reflective member comprising a through-hole, the through-hole having first and second openings; arranging a light-transmissive resin containing a wavelength-conversion material within the through-hole; distributing the wavelength-conversion material predominantly on a side of the first opening of the through-hole within the light-transmissive resin; and after the step of distributing the wavelength-conversion material, removing a portion of the light-transmissive resin from a side of the second opening of the through-hole.
    Type: Application
    Filed: June 20, 2019
    Publication date: October 10, 2019
    Applicant: NICHIA CORPORATION
    Inventors: Tadao HAYASHI, Teruhito AZUMA, Suguru BEPPU, Kunihiro IZUNO, Tsuyoshi OKAHISA
  • Patent number: 10374134
    Abstract: A light emitting device includes: a covering member including a first light-reflective member having a through-hole, and a light-transmissive resin disposed in the through-hole; a light-emitting element arranged to face the light-transmissive resin; a second light-reflective member arranged to face the first light-reflective member around the light-emitting element, the second light-reflective member covering a lateral surface of the light-emitting element; and a bonding member bonding the light-transmissive resin and the light-emitting element, the bonding member covering at least a part of the lateral surface of the light-emitting element. The light-transmissive resin contains a wavelength-conversion material distributed predominantly on either (i) a side of a lower surface of the light-transmissive resin facing the light-emitting element, or (ii) a side of an upper surface of the light-transmissive resin apart from the light-emitting element.
    Type: Grant
    Filed: May 27, 2016
    Date of Patent: August 6, 2019
    Assignee: NICHIA CORPORATION
    Inventors: Tadao Hayashi, Teruhito Azuma, Suguru Beppu, Kunihiro Izuno, Tsuyoshi Okahisa
  • Publication number: 20180040776
    Abstract: A light emitting device includes a substrate, a light emitting element, a light reflecting resin member, a sealing member, an electrically conductive wiring and a lens member. The light reflecting resin member surrounds the light emitting element. The sealing member is disposed in a region surrounded by the light reflecting resin member. The electrically conductive wiring is arranged on an upper surface of the substrate such that the substrate includes an exposed region exposed from the electrically conductive wiring with at least a part of the exposed region of the substrate being embedded in the light reflecting resin member. The lens member is disposed above the light emitting element to reach an outer edge of the substrate. The lens member is in contact with an upper surface of the sealing member and an upper surface and an outer lateral surface of the light reflecting resin member.
    Type: Application
    Filed: October 16, 2017
    Publication date: February 8, 2018
    Inventors: Motokazu YAMADA, Mototaka INOBE, Kunihiro IZUNO
  • Patent number: 9806234
    Abstract: A method of manufacturing a light emitting device includes a first step of mounting a light emitting element on a substrate having a conductor wiring and electrically connecting the light emitting element with the conductor wiring, a second step of disposing a light reflecting resin which reflects light from the light emitting element to surround the light emitting element, and a third step of disposing a sealing member after hardening the light reflecting resin to cover the light emitting element.
    Type: Grant
    Filed: January 30, 2015
    Date of Patent: October 31, 2017
    Assignee: Nichia Corporation
    Inventors: Motokazu Yamada, Mototaka Inobe, Kunihiro Izuno
  • Publication number: 20160351760
    Abstract: A method of manufacturing a covering member includes providing a first light-reflective member having a through-hole, the through-hole having first and second openings; arranging a light-transmissive resin containing a wavelength-conversion material within the through-hole; distributing the wavelength-conversion material predominantly on a side of the first opening of the through-hole within the light-transmissive resin; and after the distributing of the wavelength-conversion material, removing a portion of the light-transmissive resin from a side of the second opening of the through-hole.
    Type: Application
    Filed: May 27, 2016
    Publication date: December 1, 2016
    Applicant: NICHIA CORPORATION
    Inventors: Tadao HAYASHI, Teruhito AZUMA, Suguru BEPPU, Kunihiro IZUNO, Tsuyoshi OKAHISA
  • Publication number: 20150179891
    Abstract: A method of manufacturing a light emitting device includes a first step of mounting a light emitting element on a substrate having a conductor wiring and electrically connecting the light emitting element with the conductor wiring, a second step of disposing a light reflecting resin which reflects light from the light emitting element to surround the light emitting element, and a third step of disposing a sealing member after hardening the light reflecting resin to cover the light emitting element.
    Type: Application
    Filed: January 30, 2015
    Publication date: June 25, 2015
    Inventors: Motokazu YAMADA, Mototaka INOBE, Kunihiro IZUNO
  • Publication number: 20120007112
    Abstract: A light emitting device includes a substrate, a light emitting element, an additional light emitting element, a light reflecting resin member, an electrically conductive wire, an additional electrically conductive wire, and a sealing member. The substrate is provided with a conductor wiring. The light emitting element is mounted on the substrate. The electrically conductive wire electrically connects the conductor wiring and the light emitting element with at least a part of the electrically conductive wire being embedded in the light reflecting resin member. The additional electrically conductive wire electrically connects the light emitting element and the additional light emitting element, with the additional electrically conductive wire not being in contact with the light reflecting resin member. The sealing member is disposed in a region surrounded by the light reflecting resin member to cover the light emitting element.
    Type: Application
    Filed: September 23, 2011
    Publication date: January 12, 2012
    Applicant: NICHIA CORPORATION
    Inventors: Motokazu YAMADA, Mototaka INOBE, Kunihiro IZUNO
  • Patent number: 7923918
    Abstract: The present invention provides a reliable, long-life phosphor, or the like, which is prevented from darkening due to aging. A light emitting apparatus has a light emitting element and a phosphor layer. The phosphor layer has a phosphor excited by light from the light emitting element, and a binder which binds the phosphor. The binder is hydroxide oxide gel obtained by curing sol of a hydroxide oxide mixed with sol containing at least one metallic element selected from the group consisting of Al, Y, Gd, Lu, Sc, Ga, In, and B. Transmittance of hydroxide oxide in a gel state is higher than the transmittance in the polycrystal state where the sol-gel reaction is proceeded. In addition, the content of hydroxyl group or water of crystallization in the hydroxide oxide is 10% or less by weight.
    Type: Grant
    Filed: March 12, 2004
    Date of Patent: April 12, 2011
    Assignee: Nichia Corporation
    Inventors: Hiroto Tamaki, Shinsuke Sofue, Kunihiro Izuno, Junji Takeichi
  • Patent number: 7811946
    Abstract: The present invention provides a semiconductor device having a coating film of a predetermined thickness provided along the circumference of a semiconductor light emitting element, and provide a method for easily manufacturing the semiconductor device. A semiconductor light emitting element 2 that emits blue light is mounted face down on the top face of a pedestal 1, and a coating film 3 containing a YAG fluorescent material 6 that emits yellow light is placed so as to cover the top face and side face of the semiconductor light emitting element 2 and the top face of the pedestal 1. With the semiconductor light emitting element 2 and other elements placed between a first film 8 and a second film 9, the films are laminated in vacuum, thereby to fasten the coating film 3 onto the semiconductor light emitting element 2.
    Type: Grant
    Filed: March 27, 2009
    Date of Patent: October 12, 2010
    Assignee: Nichia Corporation
    Inventors: Kunihiro Izuno, Shinsuke Sofue
  • Patent number: 7745818
    Abstract: A light emitting device, including a light emitting element, and a resin layer that has been screen printed to coat said light emitting element is provided. The resin layer is formed from a curable silicone resin composition, which includes (i) an organopolysiloxane with a polystyrene equivalent weight average molecular weight of at least 5×103, (ii) a condensation catalyst, (iii) a solvent, and (iv) a finely powdered inorganic filler. The uniformity of the film thickness is excellent, thus resulting in little color irregularities during light emission from the light emitting element.
    Type: Grant
    Filed: April 7, 2006
    Date of Patent: June 29, 2010
    Assignee: Nichia Corporation
    Inventors: Shinsuke Sofue, Hiroto Tamaki, Kunihiro Izuno
  • Publication number: 20090239388
    Abstract: The present invention provides a semiconductor device having a coating film of a predetermined thickness provided along the circumference of a semiconductor light emitting element, and provide a method for easily manufacturing the semiconductor device. A semiconductor light emitting element 2 that emits blue light is mounted face down on the top face of a pedestal 1, and a coating film 3 containing a YAG fluorescent material 6 that emits yellow light is placed so as to cover the top face and side face of the semiconductor light emitting element 2 and the top face of the pedestal 1. With the semiconductor light emitting element 2 and other elements placed between a first film 8 and a second film 9, the films are laminated in vacuum, thereby to fasten the coating film 3 onto the semiconductor light emitting element 2.
    Type: Application
    Filed: March 27, 2009
    Publication date: September 24, 2009
    Applicant: Nichia Corporation
    Inventors: Kunihiro Izuno, Shinsuke Sofue
  • Publication number: 20090166657
    Abstract: A light emitting device includes a substrate provided with a conductor wiring, a light emitting element mounted on the substrate and a light reflecting resin member configured and arranged to reflect light emitted from the light emitting element. The light emitting device also includes at least one of an electrically conductive wire electrically connecting the conductor wiring and the light emitting element, an exposed region of the substrate on which the conductor wiring is not disposed, and a protective element mounted on the conductor wiring. At least a part of the electrically conductive wire, the exposed region or the protective element is buried in the light reflecting resin member.
    Type: Application
    Filed: December 22, 2008
    Publication date: July 2, 2009
    Applicant: NICHIA CORPORATION
    Inventors: Motokazu YAMADA, Mototaka INOBE, Kunihiro IZUNO
  • Patent number: 7528077
    Abstract: The present invention provides a semiconductor device having a coating film of a predetermined thickness provided along the circumference of a semiconductor light emitting element, and provide a method for easily manufacturing the semiconductor device. A semiconductor light emitting element 2 that emits blue light is mounted face down on the top face of a pedestal 1, and a coating film 3 containing a YAG fluorescent material 6 that emits yellow light is placed so as to cover the top face and side face of the semiconductor light emitting element 2 and the top face of the pedestal 1. With the semiconductor light emitting element 2 and other elements placed between a first film 8 and a second film 9, the films are laminated in vacuum, thereby to fasten the coating film 3 onto the semiconductor light emitting element 2.
    Type: Grant
    Filed: December 20, 2004
    Date of Patent: May 5, 2009
    Assignee: Nichia Corporation
    Inventors: Kunihiro Izuno, Shinsuke Sofue
  • Patent number: 7511424
    Abstract: A light emitting device is provided, including a light emitting element, a package comprised at least partially of metal on which said light emitting element is mounted, and a resin layer coated on said light emitting element. The light emitting element is eutectic bonded to a metal portion of said package, and the resin layer is formed of a cured product of a silicone composition. The composition includes (i) an organopolysiloxane having an average composition formula (1): R1a(OX)bSiO(4?a?b)/2 ??(1) wherein R1 is an alkyl, alkenyl or aryl group, X is a hydrogen atom, or an alkyl, alkenyl, alkoxyalkyl or acyl group, a is a number from 1.05 to 1.5, b is a number of 0<b<2, and 1.05<a+b<2, and (ii) a condensation catalyst. The device exhibits improved heat resistance and light resistance, and also exhibits improved adhesion to the resins and metal members used.
    Type: Grant
    Filed: April 7, 2006
    Date of Patent: March 31, 2009
    Assignee: Nichia Corporation
    Inventors: Shinsuke Sofue, Hiroto Tamaki, Kunihiro Izuno
  • Patent number: 7425459
    Abstract: A light emitting device and display apparatus using a plurality of light emitting devices can drastically reduce contrast loss due to light from an external source. The light emitting device has a light emitting chip(s) and a first layer covering the light emitting chip(s). A second layer including a light scattering material is provided at least over the first layer, and the surface of the second layer has a plurality of protrusions which follow the topology of the light scattering material. The display apparatus is formed by disposing these light emitting devices in an array on a substrate.
    Type: Grant
    Filed: June 21, 2006
    Date of Patent: September 16, 2008
    Assignee: Nichia Corporation
    Inventors: Yoshifumi Nagai, Yuichi Fujiwara, Kunihiro Izuno
  • Patent number: 7390684
    Abstract: A light emitting apparatus comprising a light emitting device (101) disposed on a supporting body (105), and coating layers ((108, 109) that bind a fluorescent substance that absorbs light emitted by the light emitting device (101) and emits light of a different wavelength and secures the fluorescent substance onto the surface of the light emitting device (101). The coating layers (108, 109) are made of an inorganic material including an oxide and a hydroxide, each containing at least one element selected from the group consisting of Si, Al, Ga, Ti, Ge, P, B, Zr, Y, Sn, Pb and alkali earth metals. Also an adhesive layer (110) is made of the same inorganic material as that of the coating layers (108, 109).
    Type: Grant
    Filed: July 27, 2006
    Date of Patent: June 24, 2008
    Assignee: Nichia Corporation
    Inventors: Kunihiro Izuno, Kouki Matsumoto, Shinichi Nagahama, Masahiko Sano, Tomoya Yanamoto, Keiji Sakamoto
  • Patent number: 7301175
    Abstract: A light emitting apparatus comprising a light emitting device (101) disposed on a supporting body (105), and coating layers ((108, 109) that bind a fluorescent substance that absorbs light emitted by the light emitting device (101) and emits light of a different wavelength and secures the fluorescent substance onto the surface of the light emitting device (101). The coating layers (108, 109) are made of an inorganic material including an oxide and a hydroxide, each containing at least one element selected from the group consisting of Si, Al, Ga, Ti, Ge, P, B, Zr, Y, Sn, Pb and alkali earth metals. Also an adhesive layer (110) is made of the same inorganic material as that of the coating layers (108, 109).
    Type: Grant
    Filed: September 30, 2003
    Date of Patent: November 27, 2007
    Assignee: Nichia Corporation
    Inventors: Kunihiro Izuno, Kouki Matsumoto, Shinichi Nagahama, Masahiko Sano, Tomoya Yanamoto, Keiji Sakamoto
  • Publication number: 20060267042
    Abstract: A light emitting apparatus comprising a light emitting device (101) disposed on a supporting body (105), and coating layers ((108, 109) that bind a fluorescent substance that absorbs light emitted by the light emitting device (101) and emits light of a different wavelength and secures the fluorescent substance onto the surface of the light emitting device (101). The coating layers (108, 109) are made of an inorganic material including an oxide and a hydroxide, each containing at least one element selected from the group consisting of Si, Al, Ga, Ti, Ge, P, B, Zr, Y, Sn, Pb and alkali earth metals. Also an adhesive layer (110) is made of the same inorganic material as that of the coating layers (108, 109).
    Type: Application
    Filed: July 27, 2006
    Publication date: November 30, 2006
    Applicant: Nichia Corporation
    Inventors: Kunihiro Izuno, Kouki Matsumoto, Shinichi Nagahama, Masahiko Sano, Tomoya Yanamoto, Keiji Sakamoto