Abstract: An apparatus is disclosed which is used for total reflection fluorescent X-ray analysis on a liquid drop-like sample containing very small amounts of impurities. The apparatus comprises a heat-resistant thin sheet containing an element or elements, as a principal component, not detected on total reflection fluorescent X-ray analysis and an x-ray source directing an X-ray as an incident X-ray at a liquid drop-like sample put on the sheet and containing very small amounts of impurities whereby the liquid drop-like sample is evaporated to a dried solid for the total reflection fluorescent X-ray analysis to be performed there.

Abstract: Ozonizer (10) which supplies a feed gas to ozone generating cell (11) under application of a high voltage and which delivers an ozone gas through an ozone gas transport path (consisting of pipes (14) and (15)) as it has been generated in said ozone generating cell (11) is characterized in that the ozone gas transport path is furnished with means for removing at least one of NOx, HF and SOx (in the drawings, the means is for removing NOx) and that the ozone gas from the ozone generating cell (11) is passed through said removing means, whereby at least one of NOx, HF and SOx in said ozone gas is removed before it is delivered to a subsequent stage. The product ozone is not contaminated with Cr compounds at all or insufficiently contaminated to cause any practical problems in the fabrication of highly integrated semiconductor devices.

Abstract: The fluorescent X-ray generated by elements when an X-ray is total reflected from a substrate surface is detected by a fluorescent X-ray detecting circuit; the fluorescent X-ray peak generated by the substrate element and the fluorescent X-ray peaks generated by contaminative elements are separated by a peak separating circuit; an integral intensity I.sub.0 of the fluorescent X-ray peak generated by the substrate element and integral intensities I of the fluorescent X-ray peaks generated by the contaminative elements are calculated by an integral intensity calculating circuit, respectively; and contaminative element concentrations N=N.sub.0 .multidot.(.eta..sub.0 / I.sub.0).multidot.(I / .eta.) (where N.sub.0 denotes the surface concentration of the substrate; .eta..sub.0 denotes the fluorescent yield of the substrate; and .eta.

Abstract: A contaminating-element analyzing method enables precise identification of contaminating elements and precise calculation of concentrations thereof by eliminating a broad peak waveform due to Rayleigh scattering and Compton scattering and a background waveform from a measured waveform of a contaminated sample. A blank sample or samples are irradiated by an X-ray beam under a constant condition to obtain a plurality of measured waveforms of fluorescent X-rays, and the plurality of measured waveforms are averaged to obtain a blank waveform. Then a contaminated sample is irradiated by the X-ray beam under the same condition as that for the blank sample to obtain a measured waveform of fluorescent X-rays. The blank waveform is subtracted from the measured waveform of contaminated sample, and then the contaminating elements are identified and the concentrations thereof are calculated on the basis of the waveform data after the subtraction process.

Abstract: In the method and apparatus for analyzing contaminative element concentrations, a fluorescent X-ray generated by elements when an X-ray is total reflected from the surface of a substrate is detected by a fluorescent X-ray detector; a peak of the fluorescent X-ray generated by a substrate element and peaks of the fluorescent X-ray generated by other contaminative elements are separated from the detected fluorescent X-ray waveform by a peak separating circuit; and the concentrations of the detected contaminative elements are calculated on the basis of the separated peaks by a calculating circuit. In the peak detection, in particular, the peaks of the contaminative elements to be analyzed are detected from the waveform. When other peaks are present within a predetermed number of channels (energy eV) before and after each detected peak, the channel numbers and the signal intensities between the respective peaks are extracted.

Abstract: A sample is mounted on a sample base. A detector is provided on the sample base, and detects a fluorescent X-ray generated from the sample, and a scattered X-ray of an incident X-ray when the sample is irradiated with the incident X-ray. A controller controls the sample base and an operation of the detector. The controller sequentially changes an incident angle of the incident X-ray to the sample so as to detect the fluorescent X-ray generated from the sample at each incident angle, and the scattered X-ray of the incident X-ray. Next, the controller obtains the relationship between the incident angle of the incident X-ray to the sample and a standard value obtained by standardizing intensity of the fluorescent X-ray by intensity of the scattered X-ray. Then, the controller corrects the incident angle of the incident X-ray to the sample based on the obtained relationship.

Abstract: Element identification and concentration calculation can be conducted with precision by correcting waveform distortion caused by the energy resolution of a detection system. A smoothing process is effected on a measured waveform of fluorescent X-rays obtained from an object to be measured. A device function of the detection system is obtained for each analytic element, based on the energy resolution of the detection system for a fluorescent X-ray energy value of each analytic element. A deconvolution process is effected on the measured waveform thus smoothed, by using the device functions of the detection system. Analytic elements are identified and concentrations of the analytic elements are obtained from the waveform data after the deconvolution process. The measured waveform is compensated for absorption in a beryllium window prior to smoothing.

Abstract: A contaminating-element analyzing method and an apparatus of the same are disclosed. Differential smoothing process is performed for a measured waveform of a fluorescent X-ray obtained from an object to be measured so as to detect a peak of the measured waveform, the object containing a contaminating element. A model function with variables which are initial parameters with respect to each peak of the measured waveform is provided so as to constitute a model waveform. A nonlinear optimizing process is performed using the method of least squares of the model waveform and the measured waveform so as to decide initial parameters of each model function and to obtain discriminated waveforms. A contaminating element is identified corresponding to each of the discriminated waveforms and obtaining an integrated intensity of a discrete waveform of each of the identified contaminating elements.

Abstract: A polishing pad for a semiconductor wafer, which pad is made of a foamed fluorine-contained resin sheet and is highly resistant to a corrosive polishing solution such as bromine-methanol system or bromine-methanol-silica powder system.

Abstract: An effective abrasive composition is provided for polishing a plastic article, particularly a plastic lens, to give a mirror surface thereto. This abrasive composition comprises water, an aluminous abrasive and at least one polishing accelerator selected from the group consisting of aluminum oxalate and aluminum lactate, optionally with at least one sedimentation preventing agent selected from the group consisting of crystalline cellulose and colloidal alumnia.

Abstract: An abrasive composition comprising: an aluminous abrasive, preferably having an average particle size of 0.5-10 .mu.m and a concentration of 1 to 25% by weight; nickel sulfamate and/or sulfate, preferably having a concentration of 0.5 to 10% by weight; magnesium nitrate, preferably having a concentration of 0.1 to 12% by weight and water, the composition preferably having a pH of 4 to 7. This abrasive composition produces a superior effect, particularly a reduction of protrusions and pits and deep scratches when used for polishing an aluminum-based substrate for a magnetic recording disc.

Abstract: An abrasive composition particularly suitable for polishing an aluminum-based substrate for a magnetic recording disc, the composition comprising: an alumineous abrasive, preferably in an amount of 3 to 25% by weight; a polishing accelerator of gluconic and/or lactic acid, preferably in an amount of 0.1 to 3% by weight; optionally with sodium gluconate and/or sodium lactate in an amount of 0.1 to 3% by weight; colloidal alumina, preferably in an amount of 0.1 to 5% by weight; and water, the composition typically having a pH of 3 to 5.

Abstract: A composition for use in forming a hard tissue substitute comprising (A) a powder ingredient mainly comprised of Ca.sub.n+2 (PO.sub.4).sub.2 O.sub.n-1, where n is from 1.9 to 4.9 and (B) an aqueous solution of an organic acid, preferably of the TCA cycle, or a polymer of an organic acid. This composition has a good affinity with living organisms, a high compressive strength, and a low disintegration rate.

Abstract: An abrasive composition comprising: an aluminous abrasive, preferably having an average particle size of 0.5-10 .mu.m and a concentration of 1 to 25% by weight; nickel sulfamate, preferably having a concentration of 0.5 to 10% by weight; and water, the composition preferably having a pH of 4 to 7. This abrasive composition produces a superior effect when used for polishing an aluminum-based substrate for a magnetic recording disc.

Abstract: Mullite of high purity is obtained by neutralizing an aqueous solution containing a basic aluminum salt and colloidal silica thereby causing formation of a precipitate in the aqueous solution, and subsequently heating the precipitate.