Abstract: A semiconductor wafer detection device detects a semiconductor wafer. The semiconductor wafer detection device includes a light sensor, a detector, and a droplet guide member. The light sensor includes a light emitter having a light emitting surface that emits light, and a light receiver having a light receiving surface that receives the light from the light emitter. The detector detects the semiconductor wafer based on the light received by the light receiver. The droplet guide member causes a droplet adhering to the light emitting surface to flow down. The droplet guide member includes a liquid guide part of a plate shape. The liquid guide part is arranged with a tip facing the center of the light emitting surface when viewed in a direction of an optical axis of the light emitting surface.

Abstract: Provided is a substrate cleaning device, an abnormality determination method of a substrate cleaning device, and an abnormality determination program of a substrate cleaning device for determining whether there is an abnormality in a roll cleaning member that is attached. A substrate cleaning device includes: a holder to which a roll cleaning member for cleaning a substrate is attached in a detachable manner; a rotation device which makes the roll cleaning member attached to the holder rotate; a sensor which measures information concerning a vibration of the roll cleaning member during rotation; and a control device which determines, based on a measurement result of the sensor, whether there is an abnormality in the roll cleaning member attached to the holder.

Abstract: Provided is a substrate cleaning device, an abnormality determination method of a substrate cleaning device, and an abnormality determination program of a substrate cleaning device for determining whether there is an abnormality in a roll cleaning member that is attached. A substrate cleaning device includes: a holder to which a roll cleaning member for cleaning a substrate is attached in a detachable manner; a rotation device which makes the roll cleaning member attached to the holder rotate; a sensor which measures information concerning a vibration of the roll cleaning member during rotation; and a control device which determines, based on a measurement result of the sensor, whether there is an abnormality in the roll cleaning member attached to the holder.

Abstract: A non-transitory computer-readable storage medium storing a program of stretching operation of an elastic membrane which can enhance elasticity of an elastic membrane in a short time without using a dummy wafer is disclosed. The non-transitory computer-readable storage medium storing a program of stretching operation of an elastic membrane in a substrate holding apparatus, the program causes a computer to perform stretching operation of supplying a pressurized fluid to a pressure chamber formed by the elastic membrane and allowing the pressure chamber to be open to the atmosphere a predetermined number of times by a pressure regulating device in a state where the substrate holding apparatus is positioned above a polishing table during standby operation of a polishing apparatus.

Abstract: A substrate processing system capable of reliably releasing a wafer without damaging the wafer is disclosed. The substrate processing system 200 includes a top ring 31, a vacuum forming mechanism 220, and a controller 5. A program causes a processer 5b to measure a height of the top ring 31, to compare the height of the top ring 31 with a suction start position, and to form a vacuum inside an elastic bag 46 based on a result of comparison between the height of the top ring 31 and the suction start position.

Abstract: Provided is a method for determining an accurate height of a polishing pad even when a dressing load applied to the polishing pad is changed. A method for determining a polishing pad height is provided. The method includes measuring a reference dresser height that is a height of a dressing surface (50a) of a dresser (50) when a polishing surface (22a) of a polishing pad (22) in an unused state is being pressed with a reference dressing load for polishing a substrate, calculating a correction amount for a dresser height corresponding to an amount of change in dressing load from the reference dressing load, measuring a current dresser height that is a current height of the dressing surface (50a) of the dresser (50) when the polishing surface (22a) of the polishing pad (22) is being pressed, and correcting the current dresser height using the correction amount.

Abstract: A non-transitory computer-readable storage medium storing a program of stretching operation of an elastic membrane which can enhance elasticity of an elastic membrane in a short time without using a dummy wafer is disclosed. The non-transitory computer-readable storage medium storing a program of stretching operation of an elastic membrane in a substrate holding apparatus, the program causes a computer to perfoini stretching operation of supplying a pressurized fluid to a pressure chamber formed by the elastic membrane and allowing the pressure chamber to be open to the atmosphere a predetermined number of times by a pressure regulating device in a state where the substrate holding apparatus is positioned above a polishing table during standby operation of a polishing apparatus.

Abstract: A CMP apparatus includes a polishing unit 3, a cleaning unit 4, a load/unload unit 2, a transfer unit, and a control section 5 configured to control transfer of a substrate in the transfer unit. When the polishing unit includes a plurality of polishing sections, or the cleaning unit includes a plurality of cleaning sections, the control section 5 can set a test mode that operates the polishing section or the cleaning section for a test to some of the plurality of polishing sections, or some of the plurality of cleaning sections, causes a substrate to be transferred to the polishing section or the cleaning section to which the test mode is not set, and causes a test substrate different from the substrate to be transferred to the polishing section or the cleaning section to which the test mode is set.

Abstract: A substrate processing method includes jetting at least one fluid from a fluid nozzle toward a rotating substrate surface while moving the fluid nozzle from a center toward a periphery of the rotating substrate. The fluid nozzle is moved from the center of the substrate to a predetermined point at a constant initial movement speed. The fluid nozzle is subsequently moved from the predetermined point at a movement speed V(r) which satisfies the following relational expression: V(r)×r?=C (constant), where V(r) represents the movement speed of the fluid nozzle when it passes a position corresponding to a position on the substrate surface at a distance “r” from the center of the substrate, and ? represents a power index.

Abstract: A CMP apparatus includes a polishing unit 3, a cleaning unit 4, a load/unload unit 2, a transfer unit, and a control section 5 configured to control transfer of a substrate in the transfer unit. When the polishing unit includes a plurality of polishing sections, or the cleaning unit includes a plurality of cleaning sections, the control section 5 can set a test mode that operates the polishing section or the cleaning section for a test to some of the plurality of polishing sections, or some of the plurality of cleaning sections, causes a substrate to be transferred to the polishing section or the cleaning section to which the test mode is not set, and causes a test substrate different from the substrate to the polishing section or the cleaning section to which the test mode is set.

Abstract: A substrate cleaning method is provided, which can clean a surface of a substrate with a roll cleaning member more uniformly over the entire surface even when a point (area) exists in the cleaning area of the surface of the substrate at which the relative speed between the rotational speed of the substrate and the rotational speed of the roll cleaning member is zero. The substrate cleaning method for scrubbing a surface of a substrate with a roll cleaning member, extending along the diametrical direction of the substrate, by rotating the substrate and the roll cleaning member while keeping the roll cleaning member in contact with the surface of the substrate, includes changing a rotational speed of at least one of the substrate and the roll cleaning member or a direction of rotation of the substrate during the scrub cleaning of the surface of the substrate.

Abstract: A substrate processing method includes jetting at least one fluid from a fluid nozzle toward a rotating substrate surface while moving the fluid nozzle from a center toward a periphery of the rotating substrate. The fluid nozzle is moved from the center of the substrate to a predetermined point at a constant initial movement speed. The fluid nozzle is subsequently moved from the predetermined point at a movement speed V(r) which satisfies the following relational expression: V(r)×r?=C (constant), where V(r) represents the movement speed of the fluid nozzle when it passes a position corresponding to a position on the substrate surface at a distance “r” from the center of the substrate, and ? represents a power index.