Patents by Inventor Kuniyasu Matsui

Kuniyasu Matsui has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7265909
    Abstract: A lens substrate (microlens substrate 1) having a first surface and a second surface opposite to the first surface is disclosed. Light is allowed to enter the lens substrate from the first surface thereof and then exit from the second surface thereof. The lens substrate includes: a plurality of convex lenses (microlenses 21) formed on the first surface of the lens substrate from which the light is allowed to enter the lens substrate; and a colored portion 22 provided on the first surface of the lens substrate with the plurality of convex lenses. The colored portion 22 is constituted from a plurality of regions each having a different content by percentage of a coloring agent, and the plurality of regions are laminated in the thickness direction of the colored portion 22.
    Type: Grant
    Filed: October 17, 2005
    Date of Patent: September 4, 2007
    Assignee: Seiko Epson Corporation
    Inventor: Kuniyasu Matsui
  • Patent number: 7193308
    Abstract: An intermediate chip for electrically connecting semiconductor chips includes: a substrate having a first side and a second side; a trans-substrate conductive plug which projects to the first side of the substrate; a post electrode which is displaced from the trans-substrate conductive plug in plan view on the second side of the substrate; and wiring which is disposed in or on the substrate for coupling the trans-substrate conductive plug and the post electrode.
    Type: Grant
    Filed: September 22, 2004
    Date of Patent: March 20, 2007
    Assignee: Seiko Epson Corporation
    Inventor: Kuniyasu Matsui
  • Patent number: 7045443
    Abstract: A method is provided for manufacturing a semiconductor device, a semiconductor device, a circuit board, and an electronic apparatus. In such a semiconductor device, semiconductor chips can be readily aligned when they are stacked and terminals can be prevented from being short-circuited, thereby enhancing the reliability of the connection between electrodes of the semiconductor chips. According to the method, semiconductor chips are perforated, and a conductive material such as copper is filled into each perforation, thereby forming a terminal that contains the conductive material and has a recessed portion, disposed in the upper face thereof.
    Type: Grant
    Filed: December 23, 2003
    Date of Patent: May 16, 2006
    Assignee: Seiko Epson Corporation
    Inventor: Kuniyasu Matsui
  • Publication number: 20060086619
    Abstract: A method of forming a conductive pattern having superior conductivity and better adhesion with a substrate is provided, thereby enabling a thick conductive pattern to be formed. The method comprises the steps of preparing a substrate, forming a metallic core containing metallic particles on the substrate by a droplet ejecting method so that the metallic core has a pattern substantially the same as the predetermined conductive pattern, and forming a plating layer so as to cover the surface of the metallic core by carrying out at least one electroless plating to thereby obtain the conductive pattern. A wiring substrate having the conductive pattern formed by the method, an electronic device provided with the wiring substrate and electronic equipment provided with the electronic device are also provided.
    Type: Application
    Filed: October 7, 2005
    Publication date: April 27, 2006
    Inventor: Kuniyasu Matsui
  • Publication number: 20060082902
    Abstract: A lens substrate (microlens substrate 1) having a first surface and a second surface opposite to the first surface is disclosed. Light is allowed to enter the lens substrate from the first surface thereof and then exit from the second surface thereof. The lens substrate includes: a plurality of convex lenses (microlenses 21) formed on the first surface of the lens substrate from which the light is allowed to enter the lens substrate; and a colored portion 22 provided on the first surface of the lens substrate with the plurality of convex lenses. The colored portion 22 is constituted from a plurality of regions each having a different content by percentage of a coloring agent, and the plurality of regions are laminated in the thickness direction of the colored portion 22.
    Type: Application
    Filed: October 17, 2005
    Publication date: April 20, 2006
    Inventor: Kuniyasu Matsui
  • Publication number: 20050104219
    Abstract: An intermediate chip for electrically connecting semiconductor chips includes: a substrate having a first side and a second side; a trans-substrate conductive plug which projects to the first side of the substrate; a post electrode which is displaced from the trans-substrate conductive plug in plan view on the second side of the substrate; and wiring which is disposed in or on the substrate for coupling the trans-substrate conductive plug and the post electrode.
    Type: Application
    Filed: September 22, 2004
    Publication date: May 19, 2005
    Inventor: Kuniyasu Matsui
  • Publication number: 20040172813
    Abstract: A method is provided for manufacturing a semiconductor device, a semiconductor device, a circuit board, and an electronic apparatus. In such a semiconductor device, semiconductor chips can be readily aligned when they are stacked and terminals can be prevented from being short-circuited, thereby enhancing the reliability of the connection between electrodes of the semiconductor chips. According to the method, semiconductor chips are perforated, and a conductive material such as copper is filled into each perforation, thereby forming a terminal that contains the conductive material and has a recessed portion, disposed in the upper face thereof.
    Type: Application
    Filed: December 23, 2003
    Publication date: September 9, 2004
    Inventor: Kuniyasu Matsui
  • Patent number: 5705302
    Abstract: A color filter for a liquid crystal display device comprises an optically transparent substrate, a transparent conductive layer formed on the substrate, and a color layer formed on the transparent conductive layer with red, green and blue pixels arranged in a predetermined pattern. The color layer comprises pigments for coloring purpose and transparent conductive particles having a hydrophobic surface. The transparent conductive particles are included from 5% to 50% by volume of the color layer. The color layer may preferably have a specific resistivity of from 10.sup.-1 .OMEGA..multidot.cm to 10.sup.8 .OMEGA..multidot.cm. The transparent conductive particles comprise base transparent conductive particles having a hydrophobic compound bound on their surface by coupling or graft polymerization.
    Type: Grant
    Filed: June 6, 1995
    Date of Patent: January 6, 1998
    Assignee: Seiko Epson Corporation
    Inventors: Yoshihiro Ohno, Hiroshi Kiguchi, Fumiaki Matsushima, Taeko Nakano, Kuniyasu Matsui, Tsuyoshi Sunagawa, Toshiki Nakajima, Satoru Miyashita, Shigeyuki Ogino
  • Patent number: 5554466
    Abstract: A color filter formed in accordance with the invention is formed by depositing a thin film of organic pigment an on electrode by electrochemical methods. An organic pigment is included in an aqueous micellar solution that includes a surfactant that has redox reactivity. The surfactant preferably has a metallocene such as ferrocene at the hydrophobic terminal end group. A transparent substrate having a transparent electrode thereon is emersed in the micellar solution. Voltage is applied to the transparent electrode and the organic pigment will form on the transparent electrode. Conductive particles, polymer material or conductive polymer material can be included with or on the pigment. Alternatively, the polymer or conductive polymer can be layered.
    Type: Grant
    Filed: March 17, 1995
    Date of Patent: September 10, 1996
    Assignee: Seiko Epson Corporation
    Inventors: Fumiaki Matsushima, Yoshihiro Ohno, Shigeyuki Ogino, Kuniyasu Matsui
  • Patent number: 5399450
    Abstract: A color filter formed in accordance with the invention is formed by depositing a thin film of organic pigment an on electrode by electrochemical methods. An organic pigment is included in an aqueous micellar solution that includes a surfactant that has redox reactivity. The surfactant preferably has a metallocene such as ferrocene at the hydrophobic terminal end group. A transparent substrate having a transparent electrode thereon is emersed in the micellar solution. Voltage is applied to the transparent electrode and the organic pigment will form on the transparent electrode. Conductive particles, polymer material or conductive polymer material can be included with or on the pigment. Alternatively, the polymer or conductive polymer can be layered.
    Type: Grant
    Filed: January 18, 1994
    Date of Patent: March 21, 1995
    Assignee: Seiko Epson Corporation
    Inventors: Fumiaki Matsushima, Yoshihiro Ohno, Shigeyuki Ogino, Kuniyasu Matsui
  • Patent number: 5294560
    Abstract: A bidirectional nonlinear resistor for use as a nonlinear active element having a highly insulating organic film formed on a first conductor by polymerizing in an electrolytic solution containing a supporting electrolyte and a soluble organic compound, and a second conductor identical or not identical in kind with the first conductor formed on the organic film is provided. An active matrix substrate including a plurality of the bidirectional nonlinear resistor elements may be used to have a liquid crystal display panel. In a preferred embodiment, the electrolytic solution includes an alkali hydroxide as a supporting electrolyte so that dopant need not be removed after formation of the film. The electrolytic solution which is electrolytically polymerized to form the insulating organic film includes a monomer, preferably pyrrole, pyrrole derivatives, phenol or phenol derivatives, dissolved in an electrolytic solution.
    Type: Grant
    Filed: March 26, 1991
    Date of Patent: March 15, 1994
    Assignee: Seiko Epson Corporation
    Inventors: Yoshihiro Ono, Fumiaki Matsushima, Kuniyasu Matsui, Tetsuya Osaka