Abstract: An electronic device includes a first body, a second body, two hinges, and at least one electronic assembly. The two hinges are connected between the first body and the second body, and the first body and the second body are adapted to rotate relatively through the two hinges. The electronic assembly is connected to the second body and is located between the two hinges.

Abstract: A package structure is provided. The package structure includes a first bump structure formed over a substrate, a solder joint formed over the first bump structure and a second bump structure formed over the solder joint. The first bump structure includes a first pillar layer formed over the substrate and a first barrier layer formed over the first pillar layer. The first barrier layer has a first protruding portion which extends away from a sidewall surface of the first pillar layer, and a distance between the sidewall surface of the first pillar layer and a sidewall surface of the first barrier layer is in a range from about 0.5 ?m to about 3 ?m. The second bump structure includes a second barrier layer formed over the solder joint and a second pillar layer formed over the second barrier layer, wherein the second barrier layer has a second protruding portion which extends away from a sidewall surface of the second pillar layer.

Abstract: A light-emitting device is provided. The light-emitting device comprises The light-emitting device comprises a light-emitting stack comprising a first semiconductor layer, a second semiconductor layer and an active layer between the first semiconductor layer and the second semiconductor layer; and a third semiconductor layer on the light-emitting stack and comprising a first sub-layer, a second sub-layer and a roughened surface, wherein the first sub-layer has the same composition as that of the second sub-layer, and the second sub-layer is farther from the light-emitting stack than the first sub-layer; wherein the first sub-layer and the second sub-layer each comprises a Group III element and a Group V element, and an atomic ratio of the Group III element to the Group V element of the first sub-layer is less than an atomic ratio of the Group III element to the Group V element of the second sub-layer.

Abstract: A three-dimensional (3D) integrated circuit (IC) is provided. In some embodiments, a second IC die is bonded to a first IC die by a first bonding structure. A third IC die is bonded to the second IC die by a second bonding structure. The second bonding structure is arranged between back sides of the second IC die and the third IC die opposite to corresponding interconnect structures and comprises a first TSV (through substrate via) disposed through a second substrate of the second IC die and a second TSV disposed through a third substrate of the third IC die. The second bonding structure further comprises conductive features with oppositely titled sidewalls disposed between the first TSV and the second TSV.

Abstract: A method for manufacturing three-dimensional (3D) integrated circuit (IC) is provided. In some embodiments, a second IC die is formed and bonded to a first IC die by a first bonding structure. A third IC die is formed and bonded to the second IC die by a second bonding structure. The second bonding structure is formed between back sides of the second IC die and the third IC die opposite to corresponding interconnect structures and comprises a first TSV (through substrate via) disposed through a second substrate of the second IC die and a second TSV disposed through a third substrate of the third IC die. In some further embodiments, the second bonding structure is formed by forming conductive features with oppositely titled sidewalls disposed between the first TSV and the second TSV.

Abstract: An optoelectronic device includes a semiconductor stack including a first surface and a second surface opposite to the first surface; a first contact layer on the first surface; and a second contact layer on the second surface. The second contact layer is not overlapped with the first contact layer in a vertical direction. The second contact layer includes a plurality of dots separating to each other and formed of semiconductor material.

Abstract: A light-emitting device is provided. The light-emitting device comprises a substrate; an insulating layer on the substrate, wherein the insulating layer comprises a first hole; a light-emitting stack on the insulating layer and comprising an active region comprising a top surface, wherein the top surface comprises a first part and a second part; and an opaque layer covering the first part of the top surface and exposing the second part of the top surface, wherein the second part is directly above the first hole.

Abstract: A three-dimensional (3D) integrated circuit (IC) is provided. In some embodiments, a second IC die is bonded to a first IC die by a first bonding structure. The first bonding structure contacts a first interconnect structure of the first IC die and a second interconnection structure of the second IC die, and has a first portion and a second portion hybrid bonded together. A third IC die is bonded to the second IC die by a third bonding structure. The third bonding structure comprises a second TSV (through substrate via) disposed through the second substrate of the second IC die and includes varies bonding structures according to varies embodiments of the invention.

Abstract: The present disclosure relates to a power management system. The power management system comprises a first power supply device, a second power supply device, a power supply control device, a data processing device and a load. The power supply control device is connected to the first power supply device. The data processing device is connected to the first power supply device, the second power supply device and the power supply control device. The load is connected to the first power supply device and the second power supply device. The power supply control device is configured to, when activated, provide a first signal to the data processing device. The data processing device is configured to select the first power supply device or the second power supply device to provide power to the load according to the first signal.

Abstract: A burning control system includes a capturing unit, a storing unit, a controlling unit, a processing unit, and a displaying unit. The capturing unit acquires product barcode information and burned barcode information relating to printed circuit board assembly (PCBA). The storing unit can store a program file corresponding to the burned barcode information. The controlling unit obtains product barcode information and the burned barcode information and outputs the burned barcode information to the processing unit. The processing unit writes the program file to a storage chip of the PCBA board. The displaying unit can display one of several prompts for a user's information. A burning control method is also provided.

Abstract: The present disclosure relates to a power management system. The power management system comprises a first power supply device, a second power supply device, a power supply control device, a data processing device and a load. The power supply control device is connected to the first power supply device. The data processing device is connected to the first power supply device, the second power supply device and the power supply control device. The load is connected to the first power supply device and the second power supply device. The power supply control device is configured to, when activated, provide a first signal to the data processing device. The data processing device is configured to select the first power supply device or the second power supply device to provide power to the load according to the first signal.

Abstract: A burning control system includes a capturing unit, a storing unit, a controlling unit, a processing unit, and a displaying unit. The capturing unit acquires product barcode information and burned barcode information relating to printed circuit board assembly (PCBA). The storing unit can store a program file corresponding to the burned barcode information. The controlling unit obtains product barcode information and the burned barcode information and outputs the burned barcode information to the processing unit. The processing unit writes the program file to a storage chip of the PCBA board. The displaying unit can display one of several prompts for a user's information. A burning control method is also provided.

Abstract: An optoelectronic device includes a semiconductor structure having a first side and a second side opposite to the first side, a first pad at the first side, a first finger connected to the electrode pad and having a first width, an insulating layer at the second side and comprising a first part under the first finger, the first part having a bottom surface with a second width larger than the first width and a side surface inclined to the bottom surface, and a contact layer covering the bottom surface and the side surface.

Abstract: A three-dimensional (3D) integrated circuit (IC) is provided. In some embodiments, a second IC die is bonded to a first IC die by a first bonding structure. The first bonding structure contacts a first interconnect structure of the first IC die and a second interconnection structure of the second IC die, and has a first portion and a second portion hybrid bonded together. A third IC die is bonded to the second IC die by a third bonding structure. The third bonding structure comprises a second TSV (through substrate via) disposed through the second substrate of the second IC die and includes varies bonding structures according to varies embodiments of the invention.

Abstract: A method includes forming a first dielectric layer over a wafer, etching the first dielectric layer to form an opening, filling a tungsten-containing material into the opening, and performing a Chemical Mechanical Polish (CMP) on the wafer. After the CMP, a cleaning is performed on the wafer using a weak base solution.

Abstract: An image-capturing device includes a camera module and a controller. The camera module captures an image of an object. The camera module includes a first camera and a second camera. The first camera has a first field of view (FOV) and captures an image in the first FOV, so as to produce a first image. The second camera is adjacent to the first camera and has a second FOV, in which the first FOV is wider than the second FOV. The second camera captures an image in the second FOV, so as to produce a second image. A displayer displays one of the first and second images. When a zoom ratio of the first image increases, the controller selects a display region in the first image according to an object distance, such that the display region is enlarged and then displayed on the displayer.

Abstract: A method includes forming a first dielectric layer over a wafer, etching the first dielectric layer to form an opening, filling a tungsten-containing material into the opening, and performing a Chemical Mechanical Polish (CMP) on the wafer. After the CMP, a cleaning is performed on the wafer using a weak base solution.

Abstract: A resin composition comprises a styrene-butadiene-styrene block copolymer. The resin composition further comprises a plurality of hydrated inorganic substances and/or a plurality of microcapsule particles dispersed in the styrene-butadiene-styrene block copolymer. The hydrated inorganic substances dehydration to form anhydrous inorganic substances at a dehydration temperature greater than 250 degrees Celsius. Each microcapsule particle comprises a housing and an embedded object encapsulated in the housing. The embedded object will largely volatilize from the housing at an escaping temperature greater than 250 degrees Celsius. A removable adhesive layer, an IC substrate, and an IC packaging process are also provided.

Abstract: A resin composition comprises a styrene-butadiene-styrene block copolymer. The resin composition further comprises a plurality of hydrated inorganic substances and/or a plurality of microcapsule particles dispersed in the styrene-butadiene-styrene block copolymer. The hydrated inorganic substances dehydration to form anhydrous inorganic substances at a dehydration temperature greater than 250 degrees Celsius. Each microcapsule particle comprises a housing and an embedded object encapsulated in the housing. The embedded object will largely volatilize from the housing at an escaping temperature greater than 250 degrees Celsius. A removable adhesive layer, an IC substrate, and an IC packaging process are also provided.

Abstract: An aluminum adhering process and a vacuum transfer chamber for a metal thin film plating machine. The vacuum transfer chamber includes a vacuum transfer chamber and a pre etching reacting cavity installed in a periphery of and communicated to the vacuum transfer chamber. The pre etching reacting cavity is in a very high vacuum state. The vacuum transfer chamber is installed with a robot. The aluminum adhering process includes steps of: installing a locating frame in the vacuum transfer chamber and for storing an aluminum sheet; taking the aluminum sheet from the locating sheet then transferring the aluminum sheet to the pre etching reaction chamber; plasma bombarding the aluminum sheet in the pre etching reaction chamber; and transferring the aluminum sheet back to the locating frame after a layer of aluminum is plated on an inner wall of the pre etching reacting cavity.