Patents by Inventor Kuo-Hsien Liao

Kuo-Hsien Liao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8653633
    Abstract: Described herein are semiconductor device packages with EMI shielding and related methods. In one embodiment, a semiconductor device package includes: (1) a substrate unit including a grounding element; (2) a semiconductor device disposed adjacent to an upper surface of the substrate unit; (3) a package body disposed adjacent to the upper surface of the substrate unit and covering the semiconductor device; and (4) an EMI shield disposed adjacent to exterior surfaces of the package body and electrically connected to a connection surface of the grounding element. A lateral surface of the package body is substantially aligned with a lateral surface of the substrate unit, and the connection surface of the grounding element is electrically exposed adjacent to the lateral surface of the substrate unit. The grounding element corresponds to a remnant of an internal grounding via, and provides an electrical pathway to ground electromagnetic emissions incident upon the EMI shield.
    Type: Grant
    Filed: July 5, 2011
    Date of Patent: February 18, 2014
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Kuo-Hsien Liao, Chi-Tsung Chiu, Chih-Pin Hung
  • Publication number: 20130307128
    Abstract: Semiconductor packages and related methods. The semiconductor package includes a substrate, a semiconductor chip, a package body, a recess and a conductive layer. The substrate includes a grounding element. The semiconductor chip is disposed on the substrate and has a lateral surface and an upper surface. The package body encapsulates the lateral surface of the semiconductor chip. The recess is formed in the package body and exposes the upper surface of the semiconductor chip. The conductive layer covers an outer surface of the package body, the grounding element and the upper surface of the semiconductor chip exposed by the recess to provide both thermal dissipation and EMI shielding for the semiconductor chip.
    Type: Application
    Filed: May 15, 2012
    Publication date: November 21, 2013
    Inventors: I-Chia Lin, Yu-Chou Tseng, Jin-Feng Yang, Chi-Sheng Chung, Kuo-Hsien Liao
  • Publication number: 20130292808
    Abstract: A semiconductor package includes a substrate, a semiconductor die, a package body, an electromagnetic interference shield, a dielectric structure and an antenna element. The substrate comprises a grounding segment and a feeding point. The semiconductor die is disposed on the substrate. The package body encapsulates the semiconductor die. The electromagnetic interference shield is formed on the package body. The dielectric structure encapsulates the electromagnetic interference shield. The antenna element is formed on the dielectric structure and electrically connecting the grounding segment of the substrate and the feeding point.
    Type: Application
    Filed: May 4, 2012
    Publication date: November 7, 2013
    Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Han-Chee Yen, Chi-Sheng Chung, Kuo-Hsien Liao, Yung-I Yeh
  • Patent number: 8378466
    Abstract: Described herein are wafer-level semiconductor device packages with EMI shielding and related methods. In one embodiment, a semiconductor device package includes: (1) a semiconductor device; (2) a package body covering lateral surfaces of the semiconductor device, a lower surface of the package body and a lower surface of the semiconductor device defining a front surface; (3) a set of redistribution layers disposed adjacent to the front surface, the set of redistribution layers including a grounding element that includes a connection surface electrically exposed adjacent to at least one lateral surface of the set of redistribution layers; and (4) an EMI shield disposed adjacent to the package body and electrically connected to the connection surface of the grounding element. The grounding element provides an electrical pathway to ground electromagnetic emissions incident upon the EMI shield.
    Type: Grant
    Filed: November 19, 2009
    Date of Patent: February 19, 2013
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Chi-Tsung Chiu, Kuo-Hsien Liao, Wei-Chi Yih, Yu-Chi Chen, Chen-Chuan Fan
  • Patent number: 8247889
    Abstract: The present invention relates to a package having an inner shield and a method for making the same. The package includes a substrate, a plurality of electrical elements, a molding compound, an inner shield and a conformal shield. The electrical elements are disposed on the substrate. The molding compound is disposed on a surface of the substrate, encapsulates the electrical elements, and includes at least one groove. The groove penetrates a top surface and a bottom surface of the molding compound and is disposed between the electrical elements, and there is a gap between a short side of the groove and a side surface of the molding compound. The inner shield is disposed in the groove and electrically connected to the substrate. The conformal shield covers the molding compound and a side surface of the substrate, and electrically connects the substrate and the inner shield.
    Type: Grant
    Filed: August 13, 2010
    Date of Patent: August 21, 2012
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Kuo-Hsien Liao, Jian-Cheng Chen
  • Patent number: 8212340
    Abstract: A chip package including a shielding layer conformally covering the underlying molding compound for is provided. The shielding layer can smoothly cover the molding compound and over the rounded or blunted, top edges of the molding compound, which provides better electromagnetic interferences shielding and better shielding performance.
    Type: Grant
    Filed: July 13, 2009
    Date of Patent: July 3, 2012
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventor: Kuo-Hsien Liao
  • Patent number: 8212339
    Abstract: Described herein are semiconductor device packages with EMI shielding and related methods. In one embodiment, a semiconductor device package includes a grounding element disposed adjacent to a periphery of a substrate unit and at least partially extending between an upper surface and a lower surface of the substrate unit. The grounding element includes an indented portion that is disposed adjacent to a lateral surface of the substrate unit. The semiconductor device package also includes an EMI shield that is electrically connected to the grounding element and is inwardly recessed adjacent to the indented portion of the grounding element.
    Type: Grant
    Filed: April 29, 2010
    Date of Patent: July 3, 2012
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Kuo-Hsien Liao, Jian-Cheng Chen, Chen-Chuan Fan, Chi-Tsung Chiu, Chih-Pin Hung
  • Patent number: 8144479
    Abstract: A wireless communication module includes: amounting board including a dielectric frame and a dielectric panel that are stacked together, the frame defining a frame space; at least one electronic component mounted on the mounting board and extending into the frame space; and a plurality of conductive bodies embedded in the dielectric frame and surrounding the frame space so as to prevent electromagnetic interference resulting from the electronic component.
    Type: Grant
    Filed: December 24, 2007
    Date of Patent: March 27, 2012
    Assignee: Universal Scientific Industrial Co., Ltd.
    Inventors: Kuo-Hsien Liao, Kuan-Hsing Li
  • Publication number: 20120062439
    Abstract: A semiconductor package integrated with conformal shield and antenna is provided. The semiconductor package includes a semiconductor element, an electromagnetic interference shielding element, a dielectric structure, an antenna element and an antenna signal feeding element. The electromagnetic interference shielding element includes an electromagnetic interference shielding film and a grounding element, wherein the electromagnetic interference shielding film covers the semiconductor element and the grounding element is electrically connected to the electromagnetic interference shielding layer and a grounding segment of the semiconductor element. The dielectric structure covers a part of the electromagnetic interference shielding element and has an upper surface. The antenna element is formed adjacent to the upper surface of the dielectric structure. The antenna signal feeding element passing through the dielectric structure electrically connects the antenna element and the semiconductor element.
    Type: Application
    Filed: August 8, 2011
    Publication date: March 15, 2012
    Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Kuo-Hsien Liao, Chi-Hong Chan, Shih Fuyu
  • Publication number: 20120025356
    Abstract: The semiconductor device package includes a conformal shield layer applied to the exterior surface of the encapsulant. and an internal fence or separation structure embedded in the encapsulant. The fence separates the package into various compartments. with each compartment containing at least one die. The fence thus suppresses EMI between adjacent packages. The package further includes a ground path connected to the internal fence and conformal shield.
    Type: Application
    Filed: May 24, 2011
    Publication date: February 2, 2012
    Inventors: Kuo-Hsien Liao, Chi-Hong Chan, Jian-Cheng Chen, Chian-Her Ueng, Yu-Hsiang Sun
  • Publication number: 20110260301
    Abstract: Described herein are semiconductor device packages with EMI shielding and related methods. In one embodiment, a semiconductor device package includes: (1) a substrate unit including a grounding element; (2) a semiconductor device disposed adjacent to an upper surface of the substrate unit; (3) a package body disposed adjacent to the upper surface of the substrate unit and covering the semiconductor device; and (4) an EMI shield disposed adjacent to exterior surfaces of the package body and electrically connected to a connection surface of the grounding element. A lateral surface of the package body is substantially aligned with a lateral surface of the substrate unit, and the connection surface of the grounding element is electrically exposed adjacent to the lateral surface of the substrate unit. The grounding element corresponds to a remnant of an internal grounding via, and provides an electrical pathway to ground electromagnetic emissions incident upon the EMI shield.
    Type: Application
    Filed: July 5, 2011
    Publication date: October 27, 2011
    Inventors: Kuo-Hsien Liao, Chi-Tsung Chiu, Chih-Pin Hung
  • Patent number: 8039930
    Abstract: A package structure for a wireless communication module is disclosed and includes: a substrate having an upper surface defining a supporting region, an annular ground pad surrounding the supporting region, and at least one auxiliary ground pad formed in the supporting region; at least one chip mounted on the supporting region and electrically connected to the substrate; and a shielding lid having a receiving space for receiving the chip, a ground end surface electrically connected to the annular ground pad of the substrate, and at least one auxiliary ground portion electrically connected to the auxiliary ground pad for forming at least one auxiliary ground pathway to adjust the characteristic of the enhanced peak generated by the cavity-resonance effect of the shielding lid. Thus, the enhanced peak can be shifted out of a regulated frequency range of the EMI shielding test, so that the yield thereof can be increased.
    Type: Grant
    Filed: September 30, 2009
    Date of Patent: October 18, 2011
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Kuo-Hsien Liao, Dian-Rung Li
  • Patent number: 7989928
    Abstract: Described herein are semiconductor device packages with EMI shielding and related methods. In one embodiment, a semiconductor device package includes: (1) a substrate unit including a grounding element; (2) a semiconductor device disposed adjacent to an upper surface of the substrate unit; (3) a package body disposed adjacent to the upper surface of the substrate unit and covering the semiconductor device; and (4) an EMI shield disposed adjacent to exterior surfaces of the package body and electrically connected to a connection surface of the grounding element. A lateral surface of the package body is substantially aligned with a lateral surface of the substrate unit, and the connection surface of the grounding element is electrically exposed adjacent to the lateral surface of the substrate unit. The grounding element corresponds to a remnant of an internal grounding via, and provides an electrical pathway to ground electromagnetic emissions incident upon the EMI shield.
    Type: Grant
    Filed: June 22, 2009
    Date of Patent: August 2, 2011
    Assignee: Advanced Semiconductor Engineering Inc.
    Inventors: Kuo-Hsien Liao, Chi-Tsung Chiu, Chih-Pin Hung
  • Publication number: 20110115060
    Abstract: Described herein are wafer-level semiconductor device packages with EMI shielding and related methods. In one embodiment, a semiconductor device package includes: (1) a semiconductor device; (2) a package body covering lateral surfaces of the semiconductor device, a lower surface of the package body and a lower surface of the semiconductor device defining a front surface; (3) a set of redistribution layers disposed adjacent to the front surface, the set of redistribution layers including a grounding element that includes a connection surface electrically exposed adjacent to at least one lateral surface of the set of redistribution layers; and (4) an EMI shield disposed adjacent to the package body and electrically connected to the connection surface of the grounding element. The grounding element provides an electrical pathway to ground electromagnetic emissions incident upon the EMI shield.
    Type: Application
    Filed: November 19, 2009
    Publication date: May 19, 2011
    Inventors: Chi-Tsung Chiu, Kuo-Hsien Liao, Wei-Chi Yih, Yui-Chi Chen, Chen-Chuan Fan
  • Publication number: 20110090659
    Abstract: The present invention relates to a package having an inner shield and a method for making the same. The package includes a substrate, a plurality of electrical elements, a molding compound, an inner shield and a conformal shield. The electrical elements are disposed on the substrate. The molding compound is disposed on a surface of the substrate, encapsulates the electrical elements, and includes at least one groove. The groove penetrates a top surface and a bottom surface of the molding compound and is disposed between the electrical elements, and there is a gap between a short side of the groove and a side surface of the molding compound. The inner shield is disposed in the groove and electrically connected to the substrate. The conformal shield covers the molding compound and a side surface of the substrate, and electrically connects the substrate and the inner shield.
    Type: Application
    Filed: August 13, 2010
    Publication date: April 21, 2011
    Inventors: Kuo-Hsien Liao, Jian-Cheng Chen
  • Publication number: 20110006408
    Abstract: A chip package including a shielding layer conformally covering the underlying molding compound for is provided. The shielding layer can smoothly cover the molding compound and over the rounded or blunted, top edges of the molding compound, which provides better electromagnetic interferences shielding and better shielding performance.
    Type: Application
    Filed: July 13, 2009
    Publication date: January 13, 2011
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: KUO-HSIEN LIAO
  • Patent number: 7787250
    Abstract: A metallic cover of a miniaturization module includes a substrate, a SMD chip unit and a metallic cover, the metallic cover embracing the SMD chip unit and having at least one sizing hole and a plurality of venting holes, the venting holes being disposed around the sizing hole, and the sizing hole and the venting holes being positioned above the SMD chip unit so that glue portions fill up slits between the metallic cover and the SMD chip unit. The venting holes stop the glue portion from running over the second chip unit. The glue-filled slits between the top lid and the SMD chip unit provides a strong support to prevent any deformation of the metallic cover when the metallic cover is tested and processed.
    Type: Grant
    Filed: December 28, 2007
    Date of Patent: August 31, 2010
    Assignee: Universal Scientific Industrial (Shanghai) Co., Ltd.
    Inventors: Kuan-Hsing Li, Kuo-Hsien Liao
  • Publication number: 20100207259
    Abstract: Described herein are semiconductor device packages with EMI shielding and related methods. In one embodiment, a semiconductor device package includes a grounding element disposed adjacent to a periphery of a substrate unit and at least partially extending between an upper surface and a lower surface of the substrate unit. The grounding element includes an indented portion that is disposed adjacent to a lateral surface of the substrate unit. The semiconductor device package also includes an EMI shield that is electrically connected to the grounding element and is inwardly recessed adjacent to the indented portion of the grounding element.
    Type: Application
    Filed: April 29, 2010
    Publication date: August 19, 2010
    Inventors: Kuo-Hsien Liao, Jian-Cheng Chen, Chen-Chuan Fan, Chi-Tsung Chiu, Chih-Pin Hung
  • Publication number: 20100200965
    Abstract: A package structure for a wireless communication module is disclosed and includes: a substrate having an upper surface defining a supporting region, an annular ground pad surrounding the supporting region, and at least one auxiliary ground pad formed in the supporting region; at least one chip mounted on the supporting region and electrically connected to the substrate; and a shielding lid having a receiving space for receiving the chip, a ground end surface electrically connected to the annular ground pad of the substrate, and at least one auxiliary ground portion electrically connected to the auxiliary ground pad for forming at least one auxiliary ground pathway to adjust the characteristic of the enhanced peak generated by the cavity-resonance effect of the shielding lid. Thus, the enhanced peak can be shifted out of a regulated frequency range of the EMI shielding test, so that the yield thereof can be increased.
    Type: Application
    Filed: September 30, 2009
    Publication date: August 12, 2010
    Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: KUO-HSIEN LIAO, DIAN-RUNG LI
  • Publication number: 20090256244
    Abstract: Described herein are semiconductor device packages with EMI shielding and related methods. In one embodiment, a semiconductor device package includes: (1) a substrate unit including a grounding element; (2) a semiconductor device disposed adjacent to an upper surface of the substrate unit; (3) a package body disposed adjacent to the upper surface of the substrate unit and covering the semiconductor device; and (4) an EMI shield disposed adjacent to exterior surfaces of the package body and electrically connected to a connection surface of the grounding element. A lateral surface of the package body is substantially aligned with a lateral surface of the substrate unit, and the connection surface of the grounding element is electrically exposed adjacent to the lateral surface of the substrate unit. The grounding element corresponds to a remnant of an internal grounding via, and provides an electrical pathway to ground electromagnetic emissions incident upon the EMI shield.
    Type: Application
    Filed: June 22, 2009
    Publication date: October 15, 2009
    Inventors: Kuo-Hsien Liao, Chi-Tsung Chiu, Chih-Pin Hung