Patents by Inventor Kuo-Hsien Liao

Kuo-Hsien Liao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090166830
    Abstract: A metallic cover of a miniaturization module includes a substrate, a SMD chip unit and a metallic cover, the metallic cover embracing the SMD chip unit and having at least one sizing hole and a plurality of venting holes, the venting holes being disposed around the sizing hole, and the sizing hole and the venting holes being positioned above the SMD chip unit so that glue portions fill up slits between the metallic cover and the SMD chip unit. The venting holes stop the glue portion from running over the second chip unit. The glue-filled slits between the top lid and the SMD chip unit provides a strong support to prevent any deformation of the metallic cover when the metallic cover is tested and processed.
    Type: Application
    Filed: December 28, 2007
    Publication date: July 2, 2009
    Inventors: Kuan-Hsing Li, Kuo-Hsien Liao
  • Publication number: 20090161334
    Abstract: A wireless communication module includes: amounting board including a dielectric frame and a dielectric panel that are stacked together, the frame defining a frame space; at least one electronic component mounted on the mounting board and extending into the frame space; and a plurality of conductive bodies embedded in the dielectric frame and surrounding the frame space so as to prevent electromagnetic interference resulting from the electronic component.
    Type: Application
    Filed: December 24, 2007
    Publication date: June 25, 2009
    Inventors: Kuo-Hsien Liao, Kuan-Hsing Li
  • Publication number: 20090162976
    Abstract: A method of manufacturing a miniaturization chip module includes steps of providing a chip module having a substrate, wherein the substrate has a plurality of bonding pads spaced on a rear surface of substrate; providing a lead frame including a plurality of spaced metallic studs, wherein the metallic studs are attached onto the bonding pads; and forming metallic blocks as I/O pins by removing a part of each metallic stud and a part of the lead frame which is not in contact with the substrate.
    Type: Application
    Filed: December 21, 2007
    Publication date: June 25, 2009
    Inventors: Kuan-Hsing Li, Kuo-Hsien Liao
  • Publication number: 20080291637
    Abstract: A small-sized communication module package mountable on a main board is of stacked structure including a carrier with an opening in which a thermal conductive layer in contact with a substrate stacked on the carrier is filled. The communication module package further includes a chip electrically bonded to the substrate, received in the opening and encapsulated by the thermal conductive layer, and a metal layer in contact with the thermal conductive layer for enhancing heat dissipation.
    Type: Application
    Filed: November 20, 2007
    Publication date: November 27, 2008
    Applicant: Universal Scientific Industrial Co., Ltd.
    Inventors: Kuan-Hsing Li, Kuo-Hsien Liao
  • Publication number: 20080291639
    Abstract: A communication module package assembly includes a main board having grounding pads, a communication module package electrically bonded on the main board and having notches corresponding in location to the grounding pads respectively, and a metal cover covering the communication module package and having mounting legs passing through the notches and electrically connected to the grounding pads respectively. The communication module package is of stacked structure including a carrier with an opening in which a thermal conductive layer in contact with a substrate stacked on the carrier is filled. The communication module package further includes a chip electrically bonded to the substrate, received in the opening and encapsulated by the thermal conductive layer, and a metal layer sandwiched between and in contact with the thermal conductive layer and the main board.
    Type: Application
    Filed: November 20, 2007
    Publication date: November 27, 2008
    Applicant: Universal Scientific Industrial Co., Ltd.
    Inventors: Kuan-Hsing Li, Kuo-Hsien Liao, Jia-Yang Chen
  • Publication number: 20080291654
    Abstract: A wireless communication module assembly includes a main board having a top surface on which a plurality of grounding pads are provided, a circuit board unit, and a metal cap. The circuit board unit has a bottom surface electrically mounted on the top surface of the main board, a top surface with a plurality of grounding pads, and a plurality of notches corresponding to the grounding pads of the main board. The metal cap covers the circuit board unit and has first mounting legs respectively and electrically connected with the grounding pads of the circuit board unit, and second mounting legs respectively passing through the notches of the circuit board unit and electrically connected with the grounding pads of the main board.
    Type: Application
    Filed: November 20, 2007
    Publication date: November 27, 2008
    Applicant: Universal Scientific Industrial Co., LTD.
    Inventors: Kuo-Hsien Liao, Kuan-Hsing Li, Jia-Yang Chen
  • Publication number: 20080207016
    Abstract: A communications module includes: a circuit board having a peripheral end; a first electronic component mounted on the circuit board; a plurality of second electronic components mounted on the circuit board and having a structural strength less than that of the first electronic component; and a metal cover secured to the peripheral end of the circuit board. The metal cover includes a top wall disposed over the first and second electronic components and formed with a protrusion protruding toward the first electronic component. The distance between the protrusion and the first electronic component is less than the distance between the top wall of the cover and the second electronic components.
    Type: Application
    Filed: February 28, 2007
    Publication date: August 28, 2008
    Inventors: Kuan-Hsing Li, Kuo-Hsien Liao, Chia-Yang Chen
  • Patent number: 7312518
    Abstract: A miniaturized multi-chip module suitable for application to wireless transmission devices includes a substrate, integrated circuit chips mounted on and connected electrically to the substrate, and an interposer mounted on one surface of the substrate. The interposer cooperates with the substrate to confine a receiving space for receiving the integrated circuit chips on the surface of the substrate to which the interposer is attached, and is provided with conductors that are connected electrically to the substrate. Therefore, when the interposer is mounted on a circuit board, the conductors serve as external electrical connections for the integrated circuit chips. A method for manufacturing the miniaturized multi-chip module is also disclosed.
    Type: Grant
    Filed: August 19, 2005
    Date of Patent: December 25, 2007
    Assignee: Universal Scientific Industrial Co., Ltd.
    Inventors: Kuo-Hsien Liao, Jia-Yang Chen, Chuei-Tang Wang
  • Publication number: 20060249838
    Abstract: A miniaturized multi-chip module suitable for application to wireless transmission devices includes a substrate, integrated circuit chips mounted on and connected electrically to the substrate, and an interposer mounted on one surface of the substrate. The interposer cooperates with the substrate to confine a receiving space for receiving the integrated circuit chips on the surface of the substrate to which the interposer is attached, and is provided with conductors that are connected electrically to the substrate. Therefore, when the interposer is mounted on a circuit board, the conductors serve as external electrical connections for the integrated circuit chips. A method for manufacturing the miniaturized multi-chip module is also disclosed.
    Type: Application
    Filed: August 19, 2005
    Publication date: November 9, 2006
    Applicant: UNIVERSAL SCIENTIFIC INDUSTRIAL CO., LTD.
    Inventors: Kuo-Hsien Liao, Jia-Yang Chen, Chuei-Tang Wang