Abstract: Provided herein are recombinant masking proteins and recombinant ligand proteins useful in treating cancer, neuro-degenerative disease, and cardiovascular disease. The recombinant masking proteins provided herein may, inter alia, be used as non-covalent masks of antagonists of, for example, cellular growth factors (e.g., TNF) or cell surface proteins (e.g., CTLA-4).

Abstract: A pair of moulds for moulding an optical component is disclosed. The pair of moulds includes a first mould having a first surface, and a second mould having a second surface. The first surface includes a moulding portion for moulding a first optical surface of the optical component, and an alignment portion for alignment with the second mould. The alignment portion extends around the moulding portion. The second surface includes a moulding portion for moulding a second, opposite optical surface of the optical component, and an alignment portion for alignment with the first mould via a contact with the alignment portion of the first surface. When the moulds are brought together, they self-align. A corresponding moulding apparatus and a method may use the mould pair to manufacture various optical components.

Abstract: A head mounted display system (HMD) includes an eyecup, an optical assembly, a backlit electronic display, and a heat management device. The heat management device couples to the eyecup on a first side and couples to the electronic display on a second side. The heat management device includes a heat dissipation structure to dissipate heat generated by the electronic display, as well as an insulating structure to thermally insulate the eyecup from the electronic display and the optical assembly.

Abstract: The description relates to laminated input devices, such as keyboards. One example can include a laminated light-distribution assembly and a key assembly adhered in light receiving relation to the laminated light-distribution assembly as a laminated input device having a neutral axis in the light-distribution assembly.

Abstract: Techniques disclosed herein relate to molding inserts with improved cooling performance. A mold insert includes a body and a plurality of heat sink elements coupled to the body. The body includes an area with a recessed surface that has different depths in a plurality of different regions. The plurality of heat sink elements is configured to provide different thermal resistances in the plurality of different regions of the mold insert, where a thermal resistance of the mold insert in a region with a higher recessed surface depth is lower than a thermal resistance of the mold insert in a region with a lower recessed surface depth. In some embodiments, the plurality of heat sink elements form cooling channels that are configured to conduct a cooling fluid from regions of the mold insert with higher recessed surface depths to regions of the mold insert with lower recessed surface depths.

Abstract: A method for calibrating includes obtaining a head-mounted display device that includes an electronic display having an array of display elements and an array of beam steerers located over an inner left portion and an inner right portion of the electronic display. The method also includes obtaining alignment information by selecting a first respective subset of the array of display elements and causing it to emit light, and determining whether the light is received by a first optical sensor in a first position or a second optical sensor in a second position, thereby determining whether the first respective subset of the array of display elements is aligned for the first or the second optical sensor. The method also includes repeating the selecting, causing, and determining operations for a second subset of the array of display elements, and storing the alignment information for calibrating images for presentation by the electronic display.

Abstract: A method is presented herein for manufacturing an immersed Fresnel structure. A first liquid polymer is applied to a first surface of a substrate, the substrate having a second surface that is opposite the first surface. The first liquid polymer is illuminated with light to change at least one property of the first liquid polymer and obtain a modified polymer attached to the first surface of the substrate. A second liquid polymer is applied to at least a portion of a surface of a Fresnel structure. The second surface of the substrate is applied to an outer surface of the second liquid polymer applied to the Fresnel structure to obtain a stacked Fresnel surface. The stacked Fresnel surface is illuminated with light to obtain an immersed Fresnel structure. The immersed Fresnel structure can be used as part of a near-eye display.

Abstract: A method for preparing a die for molding of a Fresnel lens includes obtaining a first die block that defines at least one or more portions of a Fresnel lens. The one or more portions defined in the first die block correspond to a plurality of slope facets and a plurality of draft facets. The method also includes adding textures to one or more portions of the first die block that correspond to at least a portion of the plurality of draft facets. A method of making a Fresnel lens includes obtaining the first die block, obtaining a second die block, and coupling the first and the second die blocks. The method also includes providing a molding material into a space defined between the first and the second die blocks, curing the molding material, and removing the Fresnel lens from the first and/or the second die block.

Abstract: Provided herein are recombinant masking proteins and recombinant ligand proteins useful in treating cancer, neurodegenerative disease, and cardiovascular disease. The recombinant masking proteins provided herein may, inter alia, be used as non-covalent masks of antagonists of, for example, cellular growth factors (e.g., TNF) or cell surface proteins (e.g., CTLA-4).

Abstract: The description relates to devices. One example device can involve a mesh structure with a density profile varying from a first end of the mesh structure to a second end of the mesh structure.

Abstract: Described herein is a display module for an electronic device having a thermal management structure integrated on a backside of the display module. Also described herein are techniques for manufacturing a display module with an integrated thermal management structure. By integrating the thermal management structure on the backside of the display module, the display module itself becomes a passive thermal management solution for an electronic device. Accordingly, the thermal management structure described herein can be considered a part of the display component stack.

Abstract: In one or more embodiments, micro light guides are constructed that include a wall and one or more features extending from or protruding into one or more surfaces of the wall. The microstructure light guide is defined by a mold and formed as a single article with uniform internal stresses. In at least some embodiments, the mold that defines the microstructure light guide employs pixelated mold portions that enable selective temperature adjustment of discrete regions of the mold portions to form the microstructure light guide.

Abstract: The description relates to devices, such as computing devices. One example can include a sandwich structured composite housing. The example can also include a set of electronic components positioned over the sandwich structured composite housing. The set of electronic components can have a profile against the sandwich structured composite housing. The sandwich structured composite housing can have a corresponding negative profile.

Abstract: 3D printed thermal management devices and corresponding methods of manufacturing are described herein. A thermal management device includes a single contiguous component including at least a portion of a first heat exchanger and at least a portion of a second heat exchanger. The second heat exchanger is of a different type than the first heat exchanger.

Abstract: Thermal management devices and systems, and corresponding manufacturing methods are described herein. A thermal management device includes a plate having a first surface. The first surface partially defines a chamber of the thermal management device. The thermal management device also includes capillary features disposed on the plate, and walls having a first end and a second end. The walls are disposed on the plate and extend away from the first surface of the plate, at the first end, to the second end. The walls partially define the chamber of the thermal management device. The thermal management device also includes a layer of material disposed on the walls, at the second end of the wall. The layer of material partially defines the chamber.

Abstract: Thermal management devices and systems, and corresponding manufacturing methods are described herein. A thermal management device includes a plate having a first surface. The first surface partially defines a chamber of the thermal management device. The thermal management device also includes capillary features disposed on the plate, and walls having a first end and a second end. The walls are disposed on the plate and extend away from the first surface of the plate, at the first end, to the second end. The walls partially define the chamber of the thermal management device. The thermal management device also includes a layer of material disposed on the walls, at the second end of the wall. The layer of material partially defines the chamber.

Abstract: Thermal management devices and systems, and corresponding manufacturing methods are described herein. A phase change thermal management device is manufactured with a method that includes forming a volume of a first material. The volume of the first material defines a chamber of the thermal management device and an inner surface of a port. A layer of a second material is electroplated on the volume of the first material. The volume of the first material is melted or dissolved, such that the electroplated layer of the second material forms the chamber and the port. The melted volume of the first material is removed via the port.

Abstract: Thermal management devices and systems, and corresponding manufacturing methods are described herein. A thermal management device includes a plate having a first surface. The first surface partially defines a chamber of the thermal management device. The thermal management device also includes capillary features disposed on the plate, and walls having a first end and a second end. The walls are disposed on the plate and extend away from the first surface of the plate, at the first end, to the second end. The walls partially define the chamber of the thermal management device. The thermal management device also includes a layer of material disposed on the walls, at the second end of the wall. The layer of material partially defines the chamber.

Abstract: Examples of structurally supportive backlight systems and devices incorporating such backlight systems are disclosed. One disclosed example provides a backlight system comprising a reflector, a light guide comprising a glass sheet, the glass sheet being adhered to the reflector with adhesive light extracting features, and a light source positioned to direct light into the light guide.

Abstract: Structures include a substrate having a base surface. The base surface includes a plurality of protrusions extending from the base surface and/or a plurality of depressions extending into the base surface. The structures include a molded liner. The molded liner encapsulates the plurality of protrusions and/or the molded liner extends into at least a portion of the plurality of depressions.