Patents by Inventor Kurt Ulmer

Kurt Ulmer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220157790
    Abstract: A method is provided for the selective harvest of microLED devices from a carrier substrate. Defect regions are predetermined that include a plurality of adjacent defective microLED devices on a carrier substrate. A solvent-resistant binding material is formed overlying the predetermined defect regions and exposed adhesive is dissolved with an adhesive dissolving solvent. Non-defective microLED devices located outside the predetermined defect regions are separated from the carrier substrate while adhesive attachment is maintained between the microLED devices inside the predetermined defect regions and the carrier substrate. Methods are also provided for the dispersal of microLED devices on an emissive display panel by initially optically measuring a suspension of microLEDs to determine suspension homogeneity and calculate the number of microLEDs per unit volume.
    Type: Application
    Filed: February 3, 2022
    Publication date: May 19, 2022
    Inventors: Kenji Sasaki, Kurt Ulmer, Paul J. Schuele, Jong-Jan Lee
  • Publication number: 20220157791
    Abstract: A method is provided for the selective harvest of microLED devices from a carrier substrate. Defect regions are predetermined that include a plurality of adjacent defective microLED devices on a carrier substrate. A solvent-resistant binding material is formed overlying the predetermined defect regions and exposed adhesive is dissolved with an adhesive dissolving solvent. Non-defective microLED devices located outside the predetermined defect regions are separated from the carrier substrate while adhesive attachment is maintained between the microLED devices inside the predetermined defect regions and the carrier substrate. Methods are also provided for the dispersal of microLED devices on an emissive display panel by initially optically measuring a suspension of microLEDs to determine suspension homogeneity and calculate the number of microLEDs per unit volume.
    Type: Application
    Filed: February 3, 2022
    Publication date: May 19, 2022
    Inventors: Kenji Sasaki, Kurt Ulmer, Paul J. Schuele, Jong-Jan Lee
  • Publication number: 20220149254
    Abstract: Disclosed herein is a micro light emitting diode (microLED) display structure with emission from the back side of a transparent substrate, which can be manufactured by fluidic assembly. The architecture allows microLED displays or display tiles to be fabricated simply, with processing and interconnection only on one side of the backplane. The structure may incorporate reflectors in the fluidic assembly structures to direct substantially all of the emitted light toward the viewer. Also disclosed are microLEDs and emission backplanes designed to support a back emission display.
    Type: Application
    Filed: May 21, 2021
    Publication date: May 12, 2022
    Inventors: Paul J. Schuele, Kurt Ulmer, Kenji Sasaki, Jong-Jan Lee
  • Patent number: 11315910
    Abstract: A method is provided for the selective harvest of microLED devices from a carrier substrate. Defect regions are predetermined that include a plurality of adjacent defective microLED devices on a carrier substrate. A solvent-resistant binding material is formed overlying the predetermined defect regions and exposed adhesive is dissolved with an adhesive dissolving solvent. Non-defective microLED devices located outside the predetermined defect regions are separated from the carrier substrate while adhesive attachment is maintained between the microLED devices inside the predetermined defect regions and the carrier substrate. Methods are also provided for the dispersal of microLED devices on an emissive display panel by initially optically measuring a suspension of microLEDs to determine suspension homogeneity and calculate the number of microLEDs per unit volume.
    Type: Grant
    Filed: May 16, 2020
    Date of Patent: April 26, 2022
    Assignee: eLux, Inc.
    Inventors: Kenji Sasaki, Kurt Ulmer, Paul J. Schuele, Jong-Jan Lee
  • Patent number: 11296059
    Abstract: A method is provided for the selective harvest of microLED devices from a carrier substrate. Defect regions are predetermined that include a plurality of adjacent defective microLED devices on a carrier substrate. A solvent-resistant binding material is formed overlying the predetermined defect regions and exposed adhesive is dissolved with an adhesive dissolving solvent. Non-defective microLED devices located outside the predetermined defect regions are separated from the carrier substrate while adhesive attachment is maintained between the microLED devices inside the predetermined defect regions and the carrier substrate. Methods are also provided for the dispersal of microLED devices on an emissive display panel by initially optically measuring a suspension of microLEDs to determine suspension homogeneity and calculate the number of microLEDs per unit volume.
    Type: Grant
    Filed: May 16, 2020
    Date of Patent: April 5, 2022
    Assignee: eLux Inc.
    Inventors: Kenji Sasaki, Kurt Ulmer, Paul J. Schuele, Jong-Jan Lee
  • Patent number: 11251166
    Abstract: A fluidic assembly emissive display panel is presented with a plurality of wells exposing LED interfaces. Each LED interface is made up of a planar first interconnect platform having an x-axis first depth and is configured to accept an axial LED first electrode mounting wing. A planar second interconnect platform has the first depth and is configured to accept an axial LED second electrode mounting wing. A groove is interposed between the first and second interconnect platforms and has an x-axis second depth, greater than the first depth, and is configured to accept an axial LED body locking tooth. The axial LEDs have an inorganic LED body with two symmetrical locking teeth. First and second electrode mounting wings are electrically connected to corresponding LED interface first and second interconnect platforms, and aligned in a plane orthogonal to stacked LED body semiconductor layers.
    Type: Grant
    Filed: April 13, 2020
    Date of Patent: February 15, 2022
    Assignee: eLux, Inc.
    Inventors: Paul J. Schuele, Kenji Sasaki, Kurt Ulmer, Jong-Jan Lee
  • Patent number: 10985302
    Abstract: A system and method are provided for repairing an emissive display. Following assembly, the emissive substrate is inspected to determine defective array sites, and defect items are removed using a pick-and-remove process. In one aspect, the emissive substrate includes an array of wells, with emissive elements located in the wells, but not electrically connected to the emissive substrate. If the emissive elements are light emitting diodes (LEDs), then the emissive substrate is exposed to ultraviolet illumination to photoexcite the array of LED, so that LED illumination can be measured to determine defective array sites. The defect items may be determined to be misaligned, mis-located, or non-functional emissive elements, or debris. Subsequent to determining these defect items, the robotic pick-and-remove process is used to remove them. The pick-and-remove process can also be repurposed to populate empty wells with replacement emissive elements.
    Type: Grant
    Filed: August 23, 2019
    Date of Patent: April 20, 2021
    Assignee: eLUX, Inc.
    Inventors: Kenji Sasaki, Paul J. Schuele, Kurt Ulmer, Jong-Jan Lee
  • Publication number: 20210091052
    Abstract: A microLED mass transfer stamping system includes a stamp substrate with an array of trap sites, each configured with a columnar-shaped recess to temporarily secure a keel extended from a bottom surface of a microLED. In the case of surface mount microLEDs, the keel is electrically nonconductive. In the case of vertical microLEDs, the keel is an electrically conductive second electrode. The stamping system also includes a fluidic assembly carrier substrate with an array of wells having a pitch separating adjacent wells that matches the pitch separating the stamp substrate trap sites. A display substrate includes an array of microLED pads with the same pitch as the trap sites. The stamp substrate top surface is pressed against the display substrate, with each trap site interfacing a corresponding microLED site, and the microLEDs are transferred. Fluidic assembly stamp substrates are also presented for use with microLEDs having keels or axial leads.
    Type: Application
    Filed: November 23, 2020
    Publication date: March 25, 2021
    Inventors: Paul J. Schuele, Kenji Sasaki, Kurt Ulmer, Jong-Jan Lee
  • Patent number: 10811403
    Abstract: A hybrid light emitting diode (LED) display and fabrication method are provided. The method forms a stack of thin-film layers overlying a top surface of a substrate. The stack includes an LED control matrix and a plurality of pixels. Each pixel is made up of a first subpixel enabled using an inorganic micro LED (uLED), a second subpixel enabled using an organic LED (OLED), and a third subpixel enabled using an OLED. The first subpixel emits a blue color light, the second subpixel emits a red color light, and the third subpixel emits a green color light. In one aspect, the stack includes a plurality of wells in a top surface of the stack, populated by the LEDs. The uLEDs may be configured vertical structures with top and bottom electrical contacts, or surface mount top surface contacts. The uLEDs may also include posts for fluidic assembly orientation.
    Type: Grant
    Filed: July 11, 2019
    Date of Patent: October 20, 2020
    Assignee: eLux Inc.
    Inventors: Kenji Sasaki, Paul J. Schuele, Kurt Ulmer, Jong-Jan Lee
  • Patent number: 10804426
    Abstract: Planar surface mount (SM) micro light emitting diodes (?LEDs) are presented. The fabrication method provides a MOCVD LED structure with a stack including a first doped semiconductor in a first plane, a MQW layer overlying the first doped semiconductor in a second plane, and a second doped semiconductor overlying the MQW layer in a third plane. An electrical insulator is conformally deposited over the etched stack in a fourth plane, and etched to expose the second doped semiconductor, creating a first via. Etching exposes the first doped semiconductor, creating a second via. A first electrode is connected to the second doped semiconductor through the first via, and has a substrate interface surface in a fifth plane with an average planarity tolerance of less than 10 nanometers. A second electrode is connected to the first doped semiconductor through the second via, and has a substrate interface surface in the fifth plane.
    Type: Grant
    Filed: May 8, 2019
    Date of Patent: October 13, 2020
    Assignee: ehux, Inc.
    Inventors: Paul J. Schuele, Changqing Zhan, Kenji Sasaki, Kurt Ulmer, Jong-Jan Lee
  • Publication number: 20200286870
    Abstract: A method is provided for the selective harvest of microLED devices from a carrier substrate. Defect regions are predetermined that include a plurality of adjacent defective microLED devices on a carrier substrate. A solvent-resistant binding material is formed overlying the predetermined defect regions and exposed adhesive is dissolved with an adhesive dissolving solvent. Non-defective microLED devices located outside the predetermined defect regions are separated from the carrier substrate while adhesive attachment is maintained between the microLED devices inside the predetermined defect regions and the carrier substrate. Methods are also provided for the dispersal of microLED devices on an emissive display panel by initially optically measuring a suspension of microLEDs to determine suspension homogeneity and calculate the number of microLEDs per unit volume.
    Type: Application
    Filed: May 16, 2020
    Publication date: September 10, 2020
    Inventors: Kenji Sasaki, Kurt Ulmer, Paul J. Schuele, Jong-Jan Lee
  • Publication number: 20200279835
    Abstract: A method is provided for the selective harvest of microLED devices from a carrier substrate. Defect regions are predetermined that include a plurality of adjacent defective microLED devices on a carrier substrate. A solvent-resistant binding material is formed overlying the predetermined defect regions and exposed adhesive is dissolved with an adhesive dissolving solvent. Non-defective microLED devices located outside the predetermined defect regions are separated from the carrier substrate while adhesive attachment is maintained between the microLED devices inside the predetermined defect regions and the carrier substrate. Methods are also provided for the dispersal of microLED devices on an emissive display panel by initially optically measuring a suspension of microLEDs to determine suspension homogeneity and calculate the number of microLEDs per unit volume.
    Type: Application
    Filed: May 16, 2020
    Publication date: September 3, 2020
    Inventors: Kenji Sasaki, Kurt Ulmer, Paul J. Schuele, Jong-Jan Lee
  • Publication number: 20200251451
    Abstract: A fluidic assembly emissive display panel is presented with a plurality of wells exposing LED interfaces. Each LED interface is made up of a planar first interconnect platform having an x-axis first depth and is configured to accept an axial LED first electrode mounting wing. A planar second interconnect platform has the first depth and is configured to accept an axial LED second electrode mounting wing. A groove is interposed between the first and second interconnect platforms and has an x-axis second depth, greater than the first depth, and is configured to accept an axial LED body locking tooth. The axial LEDs have an inorganic LED body with two symmetrical locking teeth. First and second electrode mounting wings are electrically connected to corresponding LED interface first and second interconnect platforms, and aligned in a plane orthogonal to stacked LED body semiconductor layers.
    Type: Application
    Filed: April 13, 2020
    Publication date: August 6, 2020
    Inventors: Paul J. Schuele, Kenji Sasaki, Kurt Ulmer, Jong-Jan Lee
  • Patent number: 10643981
    Abstract: Planar surface mount (SM) micro light emitting diodes (?LEDs) are presented. The fabrication method provides a MOCVD LED structure with a stack including a first doped semiconductor in a first plane, a MQW layer overlying the first doped semiconductor in a second plane, and a second doped semiconductor overlying the MQW layer in a third plane. An electrical insulator is conformally deposited over the etched stack in a fourth plane, and etched to expose the second doped semiconductor, creating a first via. Etching exposes the first doped semiconductor, creating a second via. A first electrode is connected to the second doped semiconductor through the first via, and has a substrate interface surface in a fifth plane with an average planarity tolerance of less than 10 nanometers. A second electrode is connected to the first doped semiconductor through the second via, and has a substrate interface surface in the fifth plane.
    Type: Grant
    Filed: May 8, 2019
    Date of Patent: May 5, 2020
    Assignee: eLux, Inc.
    Inventors: Paul J. Schuele, Changqing Zhan, Kenji Sasaki, Kurt Ulmer, Jong-Jan Lee
  • Publication number: 20200006613
    Abstract: A system and method are provided for repairing an emissive display. Following assembly, the emissive substrate is inspected to determine defective array sites, and defect items are removed using a pick-and-remove process. In one aspect, the emissive substrate includes an array of wells, with emissive elements located in the wells, but not electrically connected to the emissive substrate. If the emissive elements are light emitting diodes (LEDs), then the emissive substrate is exposed to ultraviolet illumination to photoexcite the array of LED, so that LED illumination can be measured to determine defective array sites. The defect items may be determined to be misaligned, mis-located, or non-functional emissive elements, or debris. Subsequent to determining these defect items, the robotic pick-and-remove process is used to remove them. The pick-and-remove process can also be repurposed to populate empty wells with replacement emissive elements.
    Type: Application
    Filed: August 23, 2019
    Publication date: January 2, 2020
    Inventors: Kenji Sasaki, Paul J. Schuele, Kurt Ulmer, Jong-Jan Lee
  • Patent number: 10520769
    Abstract: A multi-color emissive display is presented with printed light modifier structures. A fabrication method provides an emissive substrate with a plurality of wells formed in the emissions substrate top surface, and a plurality of emissive elements populating the wells. The method prints light modifier structures overlying the emissive elements. Some examples of light modifier material include light scattering materials, phosphors, and quantum dots. In one aspect, the emissive substrate wells have a first shape, with sidewalls and a first perimeter. Likewise, the emissive elements have the first shape, with sides and a second perimeter, less than the first perimeter. The light modifier structures fill the space between the emissive element sides and the well sidewalls with light modifier material. If the first shape is circular, the method prints the light modifier structures overlying the emissive elements in the circular shape having a first diameter defined by the well sidewalls.
    Type: Grant
    Filed: January 23, 2017
    Date of Patent: December 31, 2019
    Assignee: eLux, Inc.
    Inventors: Kurt Ulmer, Jong-Jan Lee, Kenji Sasaki, Paul J. Schuele
  • Publication number: 20190355708
    Abstract: A hybrid light emitting diode (LED) display and fabrication method are provided. The method forms a stack of thin-film layers overlying a top surface of a substrate. The stack includes an LED control matrix and a plurality of pixels. Each pixel is made up of a first subpixel enabled using an inorganic micro LED (uLED), a second subpixel enabled using an organic LED (OLED), and a third subpixel enabled using an OLED. The first subpixel emits a blue color light, the second subpixel emits a red color light, and the third subpixel emits a green color light. In one aspect, the stack includes a plurality of wells in a top surface of the stack, populated by the LEDs. The uLEDs may be configured vertical structures with top and bottom electrical contacts, or surface mount top surface contacts. The uLEDs may also include posts for fluidic assembly orientation.
    Type: Application
    Filed: July 11, 2019
    Publication date: November 21, 2019
    Inventors: Kenji Sasaki, Paul J. Schuele, Kurt Ulmer, Jong-Jan Lee
  • Publication number: 20190319015
    Abstract: Planar surface mount (SM) micro light emitting diodes (?LEDs) are presented. The fabrication method provides a MOCVD LED structure with a stack including a first doped semiconductor in a first plane, a MQW layer overlying the first doped semiconductor in a second plane, and a second doped semiconductor overlying the MQW layer in a third plane. An electrical insulator is conformally deposited over the etched stack in a fourth plane, and etched to expose the second doped semiconductor, creating a first via. Etching exposes the first doped semiconductor, creating a second via. A first electrode is connected to the second doped semiconductor through the first via, and has a substrate interface surface in a fifth plane with an average planarity tolerance of less than 10 nanometers. A second electrode is connected to the first doped semiconductor through the second via, and has a substrate interface surface in the fifth plane.
    Type: Application
    Filed: May 8, 2019
    Publication date: October 17, 2019
    Inventors: Paul J. Schuele, Changqing Zhan, Kenji Sasaki, Kurt Ulmer, Jong-Jan Lee
  • Publication number: 20190319163
    Abstract: Planar surface mount (SM) micro light emitting diodes (?LEDs) are presented. The fabrication method provides a MOCVD LED structure with a stack including a first doped semiconductor in a first plane, a MQW layer overlying the first doped semiconductor in a second plane, and a second doped semiconductor overlying the MQW layer in a third plane. An electrical insulator is conformally deposited over the etched stack in a fourth plane, and etched to expose the second doped semiconductor, creating a first via. Etching exposes the first doped semiconductor, creating a second via. A first electrode is connected to the second doped semiconductor through the first via, and has a substrate interface surface in a fifth plane with an average planarity tolerance of less than 10 nanometers. A second electrode is connected to the first doped semiconductor through the second via, and has a substrate interface surface in the fifth plane.
    Type: Application
    Filed: May 8, 2019
    Publication date: October 17, 2019
    Inventors: Paul J. Schuele, Changqing Zhan, Kenji Sasaki, Kurt Ulmer, Jong-Jan Lee
  • Patent number: 10446728
    Abstract: A system and method are provided for repairing an emissive display. Following assembly, the emissive substrate is inspected to determine defective array sites, and defect items are removed using a pick-and-remove process. In one aspect, the emissive substrate includes an array of wells, with emissive elements located in the wells, but not electrically connected to the emissive substrate. If the emissive elements are light emitting diodes (LEDs), then the emissive substrate is exposed to ultraviolet illumination to photoexcite the array of LED, so that LED illumination can be measured to determine defective array sites. The defect items may be determined to be misaligned, mis-located, or non-functional emissive elements, or debris. Subsequent to determining these defect items, the robotic pick-and-remove process is used to remove them. The pick-and-remove process can also be repurposed to populate empty wells with replacement emissive elements.
    Type: Grant
    Filed: January 26, 2017
    Date of Patent: October 15, 2019
    Assignee: eLux, Inc.
    Inventors: Kenji Sasaki, Paul J. Schuele, Kurt Ulmer, Jong-Jan Lee