Abstract: Semiconductor package having self-aligned structure disclosed. Semiconductor package includes a semiconductor chip having an active area and at least one marginal area that is located around the active area, wherein at least one alignment bar is arranged on the marginal area and a top structure being arranged on the semiconductor chip and having a groove being formed on a bottom surface, wherein the groove is configured for accommodating the alignment bar.

Abstract: A fingerprint sensor is disclosed. An embodiment according to an aspect of the present invention provides a display having a fingerprint recognition function. The display having a fingerprint recognition function may comprise: a display panel, which is disposed under a cover glass and allows rays to pass therethrough, the rays having various incident angles indicating ridges and troughs of a fingerprint that is in contact with the cover glass; and an image sensor layer, which is disposed under the display panel and detects a ray to be detected in the rays having the various incident angles to generate a fingerprint image.

Abstract: Semiconductor package having self-aligned structure disclosed. Semiconductor package includes a semiconductor chip having an active area and at least one marginal area that is located around the active area, wherein at least one alignment bar is arranged on the marginal area and a top structure being arranged on the semiconductor chip and having a groove being formed on a bottom surface, wherein the groove is configured for accommodating the alignment bar.

Abstract: A semiconductor package including a prism sheet having dam structure disclosed. The semiconductor package includes a case having a wall configured for surrounding a space in which a semiconductor chip is installed, and a prism sheet having a prism surface consisting of a plurality of prism peaks and a plurality of prism valleys and a flat surface facing the prism surface, wherein the prism surface faces the semiconductor chip and the flat surface is coupled to a cover, wherein a dam extending in a direction different from an extending direction of the prism peak is formed on the prism surface.

Abstract: A semiconductor package including a prism sheet having dam structure disclosed. The semiconductor package includes a case having a wall configured for surrounding a space in which a semiconductor chip is installed, and a prism sheet having a prism surface consisting of a plurality of prism peaks and a plurality of prism valleys and a flat surface facing the prism surface, wherein the prism surface faces the semiconductor chip and the flat surface is coupled to a cover, wherein a dam extending in a direction different from an extending direction of the prism peak is formed on the prism surface.

Abstract: A fingerprint sensor is disclosed. An embodiment according to an aspect of the present invention provides a display having a fingerprint recognition function. The display having a fingerprint recognition function may comprise: a display panel, which is disposed under a cover glass and allows rays to pass therethrough, the rays having various incident angles indicating ridges and troughs of a fingerprint that is in contact with the cover glass; and an image sensor layer, which is disposed under the display panel and detects a ray to be detected in the rays having the various incident angles to generate a fingerprint image.

Abstract: An image sensor and a method for processing image data, can reduce a large proportion of data signals corresponding to high illumination and a small proportion of data signals corresponding to low illumination in order to generate an image just like the original, by adjusting the reset sampling period pertaining to the data signals outputted from a unit pixel. The image sensor includes a first switch which is operated by a reset sampling signal for sampling reset voltage when a voltage drop in an image data signal occurs, in which the image data signal is applied from a picture element part, a first capacitor for storing the reset voltage applied from the first switch, a second switch which is operated by a data sampling signal for sampling data voltage after completion of the voltage drop in the image data signal, a second capacitor for storing the data voltage from the second switch, and an image data processing circuit equipped with a comparator for comparing the reset voltage with the data voltage.

Abstract: A unit pixel of a CMOS image sensor includes one PMOS for receiving light and generating electric signals and one NMOS that outputs the signals applied from the PMOS. Therefore, the pitch size of the pixel itself can be reduced, and the whole area by the image sensor can be also reduced. The present unit pixel improves image embodying characteristics even at low illumination, and does not require integration time, thereby enabling production of a moving picture at high speed. Further, the present unit pixel of the image sensor is formed using only a simple MOS process, which dramatically simplifies the fabrication steps. Therefore, process yield can be improved, while production cost savings can be realized. According to the present discussion, the unit pixel of a CMOS image sensor formed on a P type semiconductor substrate, includes an N type doped well, a PMOS for receiving light and generating electric signals, and an NMOS for outputting the signals from the PMOS.