Abstract: A liquid cooled integrated circuit module includes a substrate, a plurality of chips mounted on the substrate, and electrical conductors integrated into the substrate to interconnect the chips. A compliant member which is completely seamless overlies all of the chips. This seamless compliant member is hermetically sealed at its perimeter to the substrate around all of the chips. Between this seamless compliant member and the chips are thermally conductive studs, and they carry heat by conduction from the chips to the compliant member. A rigid cover overlies the compliant member, and it is attached to the substrate at its perimeter. Within the cover are several parallel spaced apart ribs which project towards and press against the compliant member between the chips, and they form channels for a liquid coolant which carries heat away from the compliant member.

Abstract: A liquid cooled circuit module comprises an integrated circuit package; a cover having a rim which lies against the integrated circuit package, the cover being shaped to form a passage for the liquid between the integrated circuit package and the cover; a retaining mechanism, which is fastened directly to the integrated circuit package, and which includes a member that extends above the cover; and a spring, which is held in compression between the cover and the retaining mechanism member; the spring being adapted to press the rim against the integrated circuit package with at least a predetermined minimal force which prevents leaks and at the same time not exceed a stress limit in the spring.

Abstract: A leak tolerant cooling system, for cooling electrical components with a liquid comprises: a frame holding a plurality of printed circuit boards, each of which have electrical components attached thereto; a top reservoir, mounted on the frame above the boards, for holding the liquid at atmospheric pressure; a conduit, coupled to the top reservoir and the boards, for conveying the liquid in a downward direction from the top reservoir over the components, the conduit being airtight in the absence of a leak therein; a bottom reservoir, coupled to the conduit below the boards, for receiving the liquid plus any air due to leaks from the conduit, the bottom reservoir being airtight except for a valve which opens in response to a valve control signal; a pump, coupled to the bottom reservoir, for sucking the liquid and air through the conduit at subatmospheric pressures in response to a pump control signal, and for simultaneously returning the liquid to the top reservoir; and a control circuit for generating the pump