Abstract: An object is to provide a photosensitive composition capable of obtaining a cured film having excellent reliability even when being heated at a low temperature and patterning by photolithography. A photosensitive composition of the present invention includes a polymerizable monomer having three or more (meth)acryloyl groups and one or more carboxy groups in a molecule as Component A, a polymerizable monomer having three or more (meth)acryloyl groups and not having a carboxy group in a molecule as Component B, a photopolymerization initiator as Component C, a solvent as Component D, a blocked isocyanate compound as Component N, and a polymerization inhibitor as Component K, in which a content of Component A is 10% to 50% by mass with respect to a total content of Component A and Component B.

Abstract: An object is to provide a photosensitive composition capable of obtaining a cured film having excellent reliability even when being heated at a low temperature and patterning by photolithography. A photosensitive composition of the present invention includes a polymerizable monomer having three or more (meth)acryloyl groups and one or more carboxy groups in a molecule as Component A, a polymerizable monomer having three or more (meth)acryloyl groups and not having a carboxy group in a molecule as Component B, a photopolymerization initiator as Component C, a solvent as Component D, a blocked isocyanate compound as Component N, and a polymerization inhibitor as Component K, in which a content of Component A is 10% to 50% by mass with respect to a total content of Component A and Component B.

Abstract: There is provided a photosensitive composition containing a compound represented by Formula (I), and the Formula (I) is defined as herein, and chemical amplification resist composition containing the photosensitive composition, wherein the photosensitive composition further contains a compound capable of generating an acid upon irradiation with an actinic ray or radiation, and a chemical amplification resist composition containing the photosensitive composition, wherein the photosensitive composition further contains a compound capable of generating an acid upon irradiation with an actinic ray or radiation.

Abstract: Provided is a curable composition for imprints having good patternability and dry etching resistance. Disclosed is a curable composition for imprints comprising a polymerizable monomer (Ax) having a substituent having an aromatic group and having a molecular weight of 100 or more, and a photopolymerization initiator.

Abstract: Provided a resist composition for a semiconductor manufacturing process comprising (A) a compound expressed by General Formula (I) below: wherein, in General Formula (I) above, R1 represents an alkyl group, a cycloalkyl group, or an aryl group, R2 represents a univalent organic group, each of R3 to R6 represents a hydrogen atom, an alkyl group, a cycloalkyl group, an aryl group, or a halogen atom, R3 and R4, R4 and R5, or R5 and R6 may be bonded to each other to form an alicyclic ring or an aromatic ring, and X represents an oxygen atom or a sulfur atom.

Abstract: Provided is a photosensitive resin composition having high sensitivity and storage stability.

Abstract: There is provided a photosensitive composition containing a compound represented by Formula (I), and the Formula (I) is defined as herein, and chemical amplification resist composition containing the photosensitive composition, wherein the photosensitive composition further contains a compound capable of generating an acid upon irradiation with an actinic ray or radiation, and a chemical amplification resist composition containing the photosensitive composition, wherein the photosensitive composition further contains a compound capable of generating an acid upon irradiation with an actinic ray or radiation.

Abstract: Provided is a photosensitive resin composition having high sensitivity and storage stability.

Abstract: Provided is a curable composition for imprints having good patternability and dry etching resistance.

Abstract: Provided is a curable composition for imprints having good patternability and dry etching resistance. Disclosed is a curable composition for imprints comprising a polymerizable monomer (Ax) having a substituent having an aromatic group and having a molecular weight of 100 or more, and a photopolymerization initiator.

Abstract: Provided is a curable composition for imprints having good patternability and dry etching resistance. Disclosed is a curable composition for imprints comprising a polymerizable monomer (Ax) having a substituent having an aromatic group and having a molecular weight of 100 or more, and a photopolymerization initiator.

Abstract: Disclosed is a photosensitive resin composition comprising: (Component A) an oxime sulfonate compound represented by Formula (1); (Component B) a resin comprising a constituent unit having an acid-decomposable group that is decomposed by an acid to form a carboxyl group or a phenolic hydroxy group; and (Component C) a solvent wherein in Formula (1) R1 denotes an alkyl group, an aryl group, or a heteroaryl group, each R2 independently denotes a hydrogen atom, an alkyl group, an aryl group, or a halogen atom, Ar1 denotes an o-arylene group or an o-heteroarylene group, X denotes O or S, and n denotes 1 or 2, provided that of two or more R2s present in the compound, at least one denotes an alkyl group, an aryl group, or a halogen atom.

Abstract: Provided is a curable composition for imprints having good patternability and dry etching resistance.

Abstract: Provided is a curable composition for imprints having good patternability and dry etching resistance. Disclosed is a curable composition for imprints comprising a polymerizable monomer (Ax) having a substituent having an aromatic group and having a molecular weight of 100 or more, and a photopolymerization initiator.

Abstract: A curable composition for photoimprints containing a photopolymerizable monomer and a photopolymerization initiator, wherein the proportion of the compound having a molecular weight of at most 190 in the composition is at most 20% by mass, and the viscosity of the composition is from 3 to 50 mPa·s at 25° C., is excellent in patterning accuracy.

Abstract: A curable composition for photoimprints, comprising a (meth)acrylate compound represented by the following formula (1): wherein R1 and R2 represent a hydrogen atom or a methyl group; X represents a single bond or an aliphatic group; n and m indicate an integer of 1 or more, has a low viscosity and a high transfer patterning accuracy and gives a cured film excellent in scratch resistance and adhesiveness.