Patents by Inventor KYU OH

KYU OH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220061604
    Abstract: A drying apparatus is proposed. The main body (100) may constitute the frame of the drying apparatus. The fan receiving part (104) may be provided in an upper part of the main body (100), and the fan assembly (160) may be installed in the fan receiving part (104). In the fan receiving part (104), the fan of the fan assembly (160) may be relatively located at a side of a rear end of the main body (100), and a fan motor (170) may be relatively located at a side of the front end of the main body (100). Accordingly, outside air may be introduced through the side edges of the rear end of the main body (100); may flow through a filter assembly (180) directly to the fan housing (162); and may flow through the air exit (169) of the fan housing (162) directly to the duct (130).
    Type: Application
    Filed: January 19, 2021
    Publication date: March 3, 2022
    Inventors: Dae woong Kim, Seung Yup Lee, Min Kyu Oh, Hyun Ki Kim, Seong Woo An, Yang hwan No, Sang Yoon Lee, Byung Soo Oh, Yeon A Jo, Gi seop Kwon, Byung Soo Oh
  • Patent number: 11254846
    Abstract: The present disclosure relates to an acrylic adhesive composition exhibiting excellent lap shear strength and adhesive strength by including an adhesion enhancer of a specific component.
    Type: Grant
    Filed: May 2, 2018
    Date of Patent: February 22, 2022
    Inventors: Wan Kyu Oh, Gyeong Shin Choi, Seung Young Park
  • Patent number: 11251113
    Abstract: Methods/structures of forming embedded inductor structures are described. Embodiments include forming a first interconnect structure on a dielectric material of a substrate, selectively forming a magnetic material on a surface of the first interconnect structure, forming an opening in the magnetic material, and forming a second interconnect structure in the opening. Build up layers are then formed on the magnetic material.
    Type: Grant
    Filed: December 27, 2017
    Date of Patent: February 15, 2022
    Assignee: Intel Corporation
    Inventors: Sai Vadlamani, Prithwish Chatterjee, Robert A. May, Rahul S. Jain, Lauren A. Link, Andrew J. Brown, Kyu Oh Lee, Sheng C. Li
  • Publication number: 20220042714
    Abstract: An air cleaner is provided that includes: a body housing having an air inlet and a filter discharge outlet; a fan module provided within the body housing; a filter supply module provided within the body housing and configured to provide a filter sheet; a filter transportation module configured to transport the filter sheet from the filter supply module such that the filter sheet passes by the air inlet and is discharged at the filter discharge outlet; and a cutting module configured to cut the filter sheet. The filter transportation module includes: a drive supply roller and a driven supply roller; drive and driven discharge rollers that are positioned a distance apart toward the filter discharge sides, respectively, of the two supply rollers; a first roller drive motor configured to drive the drive supply roller; and a second roller drive motor configured to drive the drive discharge roller.
    Type: Application
    Filed: July 30, 2021
    Publication date: February 10, 2022
    Inventors: Deuk Won Lee, Min Kyu Oh, Dae Woong Kim, Bo an Kwon, Yang Hwan No, Hyun Byung Cha, Byung Hoon Park, Yu Na Jo, Ji Hye Lee
  • Patent number: 11244912
    Abstract: Semiconductor packages having a first layer interconnect portion that includes a coaxial interconnect between a die and a package substrate are described. In an example, the package substrate includes a substrate-side coaxial interconnect electrically connected to a signal line. The die is mounted on the package substrate and includes a die-side coaxial interconnect coupled to the substrate-side coaxial interconnect. The coaxial interconnects can be joined by a solder bond between respective central conductors and shield conductors.
    Type: Grant
    Filed: March 30, 2017
    Date of Patent: February 8, 2022
    Assignee: Intel Corporation
    Inventors: Sai Vadlamani, Aleksandar Aleksov, Rahul Jain, Kyu Oh Lee, Kristof Kuwawi Darmawikarta, Robert Alan May, Sri Ranga Sai Boyapati, Telesphor Kamgaing
  • Publication number: 20220032224
    Abstract: A portable air purifier may include a housing provided with an inlet through which air is suctioned, a filter, and a fan module and forming an air flow path in a vertical direction, a discharge disposed at an outlet of the housing and configured to guide a discharge direction of air, a rotational supporter which is connected to the housing, movement of which is restricted, and which supports the discharge in a rotatable manner, and a rotational guide disposed respectively at the discharge and the rotational supporter and configured to guide rotation of the discharge to allow the discharge to rotate within predetermined angles.
    Type: Application
    Filed: July 27, 2021
    Publication date: February 3, 2022
    Inventors: Seong Woo An, Dongeun Kim, Min Kyu Oh, Deukwon Lee, Daewoong Kim, Boan Kwon
  • Publication number: 20220033781
    Abstract: An artificial recombinant chromosome produced by recombination of two or more chromosomes and the production of a transgenic animal using a cell including the same are disclosed. A method for producing a cell including one or more artificial recombinant chromosomes includes preparing a first targeted cell and a second targeted cell, producing one or more microcells using the second targeted cell, producing a fusion cell using the first targeted cell and the one or more microcells, and producing a cell including an artificial recombinant chromosome by treating the fusion cell with site specific recombinase (SSR).
    Type: Application
    Filed: November 12, 2019
    Publication date: February 3, 2022
    Inventors: Chang Kyu Oh, Soon-Ik Park, Ho Jin Kang, Ae Jin Choi
  • Patent number: 11225243
    Abstract: A method of controlling a split inflow of condensate water in a hybrid engine includes: determining whether condensate water is generated from an exhaust gas recirculation (EGR) device of a hybrid electric vehicle (HEV); determining an amount of the condensate water introduced into an hybrid engine; determining whether a vehicle speed of the HEV is within a predetermined speed range; determining whether a request torque of the HEV is within a predetermined torque range; determining whether a duration time of the vehicle speed within the predetermined speed range, and a duration time of the request torque within the predetermined torque range are greater than or equal to a predetermined duration time, respectively; and when the determined duration times are greater than or equal to the predetermined duration time, increasing an engine torque of the HEV.
    Type: Grant
    Filed: November 5, 2020
    Date of Patent: January 18, 2022
    Assignees: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventors: Young-Kyu Oh, Keum-Jin Park
  • Patent number: 11217534
    Abstract: Techniques of protecting cored or coreless semiconductor packages having materials formed from dissimilar metals from galvanic corrosion are described. An exemplary semiconductor package comprises one or more build-up layers; first and second semiconductor components (e.g., die, EMIB, etc.) on or embedded in the one or more build-up layers. The first semiconductor component may be electrically coupled to the second semiconductor component via a contact pad and an interconnect structure that are formed in the one or more build-up layers. The contact pad can comprise a contact region, a non-contact region, and a gap region that separates the contact region from the non-contact region. Coupling of the contact pad and an interconnect structure is performed by coupling only the contact region with the interconnect structure. Also, a surface area of the contact region can be designed to substantially equal to a surface area of the interconnect structure.
    Type: Grant
    Filed: December 30, 2017
    Date of Patent: January 4, 2022
    Assignee: Intel Corporation
    Inventors: Cheng Xu, Junnan Zhao, Ji Yong Park, Kyu Oh Lee
  • Publication number: 20210400934
    Abstract: A transgenic animal having a genome including a humanized immunoglobulin locus for securing the diversity of an antibody repertoire and a method of producing the same are disclosed. The transgenic non-human animal has two alleles of a humanized immunoglobulin gene, wherein the two alleles are hetero-alleles.
    Type: Application
    Filed: October 16, 2020
    Publication date: December 30, 2021
    Applicant: Humab Co., Ltd
    Inventors: Chang Kyu OH, Kyoung Seok OH, Soon Ik PARK
  • Publication number: 20210398941
    Abstract: Examples relate to a die interconnect substrate comprising a bridge die comprising at least one bridge interconnect connecting a first bridge die pad of the bridge die to a second bridge die pad of the bridge die. The die interconnect substrate further comprises a substrate structure comprising a substrate interconnect electrically insulated from the bridge die, wherein the bridge die is embedded in the substrate structure. The die interconnect substrate further comprises a first interface structure for attaching a semiconductor die to the substrate structure, wherein the first interface structure is connected to the first bridge die pad. The die interconnect substrate further comprises a second interface structure for attaching a semiconductor die to the substrate structure, wherein the second interface structure is connected to the substrate interconnect. A surface of the first interface structure and a surface of the second interface structure are at the same height.
    Type: Application
    Filed: September 3, 2021
    Publication date: December 23, 2021
    Inventors: Rahul JAIN, Ji Yong PARK, Kyu Oh LEE
  • Publication number: 20210391232
    Abstract: An apparatus is provided which comprises: a substrate, a die site on the substrate to couple with a die, a die side component site on the substrate to couple with a die side component, and a raised barrier on the substrate between the die and die side component sites to contain underfill material disposed at the die site, wherein the raised barrier comprises electroplated metal. Other embodiments are also disclosed and claimed.
    Type: Application
    Filed: August 27, 2021
    Publication date: December 16, 2021
    Applicant: INTEL CORPORATION
    Inventors: Rahul Jain, Kyu Oh Lee, Siddharth K. Alur, Wei-Lun K. Jen, Vipul V. Mehta, Ashish Dhall, Sri Chaitra J. Chavali, Rahul N. Manepalli, Amruthavalli P. Alur, Sai Vadlamani
  • Patent number: 11201150
    Abstract: A system on chip includes first to third nanowires extending in a second direction, first to third gate lines respectively surrounding the first to third nanowires, each of the first to third gate lines extending in a first direction across the second direction, a gate isolation region cutting the first to third gate lines and extending in the second direction, a first gate contact formed on the second gate line arranged between the first gate line and the third gate line, and electrically connecting the cut second gate line, a second gate contact formed on the first gate line, a third gate contact formed on the third gate line, a first metal line electrically connecting the second gate contact and the third gate contact; and a second metal line electrically connected to the first gate contact.
    Type: Grant
    Filed: January 17, 2020
    Date of Patent: December 14, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sang-Hoon Baek, Sun-Young Park, Sang-Kyu Oh, Ha-young Kim, Jung-Ho Do, Moo-Gyu Bae, Seung-Young Lee
  • Publication number: 20210381409
    Abstract: A method and a system for sensing engine oil deterioration are disclosed. The method includes measuring an engine RPM, load (Load), and an engine temperature (Temp), calculating the amount of change in a deterioration factor (f (RPM, Load, Temp) of engine oil per revolution of an engine using the measured engine RPM, load, and the engine oil temperature, and then calculating the engine oil deterioration degree at a current time point by accumulating a value obtained by multiplying the calculated amount in change of the deterioration factor (f (RPM, Load, Temp) by an engine revolutions during a predetermined sampling cycle (?r) to a previous engine oil deterioration degree.
    Type: Application
    Filed: July 23, 2020
    Publication date: December 9, 2021
    Applicants: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventors: Se-Kyu OH, Min-Kyu HAN, Hong-Wook LEE, Kyung-Ku YEO
  • Patent number: 11187193
    Abstract: An active dual purge system includes: an intake pipe, a compressor to compress air, a canister to collect an evaporation gas, a purge line extending from the canister to a front end of the compressor, a branch line branching off from the purge line and extending to a rear end of a throttle valve body, a purge pump installed in the purge line, a purge valve installed in the purge line, a vent valve installed in a vent line extending from the canister toward the atmosphere, a first sensor installed in the purge line, and a second sensor installed in the purge line, and a controller to perform different tests on the purge pump, the purge valve and the vent valve in different operating states, and diagnose whether at least one of the purge line, the branch line, or the vent line are abnormal using on-board diagnosis (OBD).
    Type: Grant
    Filed: December 8, 2020
    Date of Patent: November 30, 2021
    Assignees: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventors: Young-Kyu Oh, Keum-Jin Park
  • Publication number: 20210363943
    Abstract: An active dual purge system includes: an intake pipe, a compressor to compress air, a canister to collect an evaporation gas, a purge line extending from the canister to a front end of the compressor, a branch line branching off from the purge line and extending to a rear end of a throttle valve body, a purge pump installed in the purge line, a purge valve installed in the purge line, a vent valve installed in a vent line extending from the canister toward the atmosphere, a first sensor installed in the purge line, and a second sensor installed in the purge line, and a controller to perform different tests on the purge pump, the purge valve and the vent valve in different operating states, and diagnose whether at least one of the purge line, the branch line, or the vent line are abnormal using on-board diagnosis (OBD).
    Type: Application
    Filed: December 8, 2020
    Publication date: November 25, 2021
    Applicants: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventors: Young-Kyu OH, Keum-Jin PARK
  • Patent number: 11168626
    Abstract: The present disclosure relates to a method for removing residual purge gas in operating an active purge system and includes determining evaporation gas purge stop in a control unit, closing a PCSV mounted on a purge line connecting a canister and an intake pipe, and determining whether all of the evaporation gas flowed into the intake pipe is flowed into a combustion chamber, so that all of the evaporation gas flowed into an intake pipe during travelling can be flowed into and combusted in the combustion chamber.
    Type: Grant
    Filed: December 3, 2019
    Date of Patent: November 9, 2021
    Assignees: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventors: Tae-Ho Ahn, Jeong-Ho Seo, Young-Kyu Oh
  • Patent number: 11158558
    Abstract: An apparatus is provided which comprises: a substrate, a die site on the substrate to couple with a die, a die side component site on the substrate to couple with a die side component, and a raised barrier on the substrate between the die and die side component sites to contain underfill material disposed at the die site, wherein the raised barrier comprises electroplated metal. Other embodiments are also disclosed and claimed.
    Type: Grant
    Filed: December 29, 2016
    Date of Patent: October 26, 2021
    Assignee: Intel Corporation
    Inventors: Rahul Jain, Kyu Oh Lee, Siddharth K. Alur, Wei-Lun K. Jen, Vipul V. Mehta, Ashish Dhall, Sri Chaitra J. Chavali, Rahul N. Manepalli, Amruthavalli P. Alur, Sai Vadlamani
  • Patent number: 11139264
    Abstract: Examples relate to a die interconnect substrate comprising a bridge die comprising at least one bridge interconnect connecting a first bridge die pad of the bridge die to a second bridge die pad of the bridge die. The die interconnect substrate further comprises a substrate structure comprising a substrate interconnect electrically insulated from the bridge die, wherein the bridge die is embedded in the substrate structure. The die interconnect substrate further comprises a first interface structure for attaching a semiconductor die to the substrate structure, wherein the first interface structure is connected to the first bridge die pad. The die interconnect substrate further comprises a second interface structure for attaching a semiconductor die to the substrate structure, wherein the second interface structure is connected to the substrate interconnect. A surface of the first interface structure and a surface of the second interface structure are at the same height.
    Type: Grant
    Filed: September 27, 2019
    Date of Patent: October 5, 2021
    Assignee: Intel Corporation
    Inventors: Rahul Jain, Ji Yong Park, Kyu Oh Lee
  • Publication number: 20210278110
    Abstract: A refrigerator for drinks is provided. The refrigerator may include a cabinet and a cooling guide transmitting coldness to a drink container stored in an erect state in the cabinet. Several coolers may be disposed for cooling guides and may cool the cooling guides, respectively, and dispenser nozzles may be disposed to be exposed outside the cabinet, whereby drinks may be dispensed. A surface of a cooling block facing a thermoelectric element of the cooler and a surface of the cooling block facing the cooling guide may have different areas.
    Type: Application
    Filed: March 5, 2021
    Publication date: September 9, 2021
    Applicant: LG ELECTRONICS INC.
    Inventors: Dae Woong Kim, Hee Su Yang, Min Kyu Oh, Su Young Lee, Ja Yoen Kim, Hwa Yun Choi