Abstract: The present invention is directed to a composition including N-Coumaroyldopamine and a catechol-o-methyltransferase (COMT) inhibitor for promoting weight loss in a user.

Abstract: A method of fabricating a metal oxide semiconductor transistor comprising:a silicon substrate having a first conductivity type in which its central portion having a channel region has a recessed surface and other portion excepting the central portion has a flattened surface, a thin gate oxide film formed on the recessed surface of the silicon substrate, an oxide film formed on the flattened of the silicon substrate and having a thickness a little thicker than that of the gate oxide film, a gate formed on the gate oxide film and having a structure in which its upper surface is flattened and its lower surface is convex, a thick cap oxide film on the gate, a low concentration source region and drain region having a second conductivity type overlapped completely with the gate and formed on a portion adjacent to the channel region of the recessed surface of the silicon substrate, a high concentration source region and drain region having the second conductivity type formed on the flattened surface of the silicon s

Abstract: A high definition television signal conversion circuit using a side cut mode or a letter box mode.

Abstract: A method for fabricating an LDD MOS transistor having an improved structure capable of simplifying the fabrication and improving characteristics of the transistor.

Abstract: A semiconductor chip package comprises leads which protrude from one side of a package body, and support portions which are formed at both ends of the package body on either side of the leads for firmly mounting the package on a printed circuit board (PCB). The support portions are made of a same material as the package body. At the package body, a slot is formed to further protect the leads, and the leads are alternately formed to mount the packages close by. Thus, there is no additional process step for forming holes in the PCB to mount the support portions of the semiconductor package, so the mounting process of the package becomes simpler. The support portions which protrude from the package body permit the package to be mounted on the PCB firmly. The slot and support portions protect the leads and prevent the leads from being deformed by external forces, thereby improving the reliability of the semiconductor package.

Abstract: A high speed ATM cell synchronizing switching apparatus is disclosed, and the apparatus includes: a plurality of ATM cell inputting circuits 1 for receiving optical ATM signals; a routing control circuit 2 for receiving address information; a cell gate circuit 3 for transmitting the inputted cells synchronously; a switching information tabling circuit 4 for switching the switching information; and a switching matrix circuit 5 for receiving and outputting the switching control information and the cell data information.

Abstract: A ceramic-metal article including a ceramic rod, a metal rod, and a braze joining the ceramic and metal rods at a braze area of a coaxial bore in the metal rod. The bore gradually decreases in diameter, having an inward seat area sized for close sliding fit about the ceramic, a larger brazing area near the joint end, and a void area intermediate the braze and seat areas. The ceramic is seated without brazing in the bore seat area. The side wall between the brazing area and the metal outer surface is about 0.030-0.080 inch. The braze includes an inner braze layer, an outer braze layer, and an interlayer about 0.030-0.090 inch thick. A shoulder between the brazing and void areas supports the interlayer during bonding while preventing bonding between the void area and the ceramic member, leaving a void space between the void area and the ceramic member. A venting orifice extends generally radially through the metal member from the outer surface to the void space.