Patents by Inventor L. William Menzies

L. William Menzies has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5982635
    Abstract: An interconnect structure adapts one or more signals conducted between a printed circuit board (PCB) and an integrated circuit (IC) including leads, the IC having signal requirements not provided by the PCB. The interconnect structure includes sockets that provideA. conductive paths between the circuit board and some, but not all, of the leads on the package. To adapt the signals, the interconnect structure also includes an intermediate adaptor board that includes one or more electrical components. The adaptor board and the sockets fit beneath the package containing the IC and above the PCB, and do not extend beyond the lateral boundaries of the package. Heat generated by these components during operation of the IC is dissipated through the IC package via a layer of thermally conductive material sandwiched between the component and the package.
    Type: Grant
    Filed: October 23, 1996
    Date of Patent: November 9, 1999
    Assignee: Concept Manufacturing, Incorporated
    Inventors: L. William Menzies, Stephen W. Menzies, Dale S. Mackey
  • Patent number: 4882656
    Abstract: A decoupling capacitor is mounted on a thin auxiliary board and connected by metallization traces on the board to a single pair of plug-in contacts press-fitted into a pair of apertures in a pair of integral tabs extending from the board. The auxiliary board and capacitor height is not more than about 0.070 inches. The plug-in contacts are pluggable into a pair of sockets in a printed circuit board. The auxiliary insulative board with its attached capacitor is sandwiched between a surface of a printed circuit board having a plurality of sockets, and the underside of a dual-in-line (DIP) integrated circuit package. At least two leads of the DIP package are inserted into the pair of insertable contacts in the auxliary isulative board while the remainder of the DIP package leads are inserted directly into other sockets in the printed circuit board. In one embodiment, other DIP leads pass through clearance holes in a second pair of integral tabs.
    Type: Grant
    Filed: October 14, 1988
    Date of Patent: November 21, 1989
    Inventors: L. William Menzies, Jr., Stephen W. Menzies
  • Patent number: 4779164
    Abstract: A decoupling capacitor is mounted on a thin auxiliary board and connected by metallization traces on the board to a single pair of plug-in contacts press-fitted into a pair of apertures in a pair of integral tabs extending from the board. The auxiliary board and capacitor height is not more than about 0.070 inches. The plug-in contacts are pluggable into a pair of sockets in a printed circuit board. The auxiliary insulative board with its attached capacitor is sandwiched between the top of a printed circuit board having a plurality of sockets, and the underside of a dual-in-line (DIP) integrated circuit package. Two leads of the DIP package are inserted into the pair of insertable contacts in the auxiliary insulative board while the remainder of the DIP package leads are inserted directly into other sockets in the printed circuit board.
    Type: Grant
    Filed: December 12, 1986
    Date of Patent: October 18, 1988
    Inventors: L. William Menzies, Jr., Stephen W. Menzies