Patents by Inventor Laura M. HIND

Laura M. HIND has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of heat treatment
    Patent number: 10793933
    Abstract: A method of heat treating a localised region of a component including providing a heat treatment assembly with two or more subassemblies. Each subassembly is configured to partially circumscribe a portion of the component for heat treatment. Each subassembly includes a housing configured to partially circumscribe a portion of the component. An insulator and a heater are provided within the housing and extend to partially circumscribe a component and are arranged such that the insulator is between a wall of the housing and the heater. The method includes positioning the subassemblies adjacently around the component so that the subassemblies fully circumscribe the component. The subassemblies are connected together. The method includes activating the heater to heat the component in a region adjacent the heater.
    Type: Grant
    Filed: December 19, 2017
    Date of Patent: October 6, 2020
    Assignee: ROLLS-ROYCE PLC
    Inventors: Laura M. Hind, Vincent P. Tsao, Callum J. Jackson, Daniel Clark, Wai Lek Chan
  • METHOD OF HEAT TREATMENT
    Publication number: 20180187282
    Abstract: A method of heat treating a localised region of a component including providing a heat treatment assembly with two or more subassemblies. Each subassembly is configured to partially circumscribe a portion of the component for heat treatment. Each subassembly includes a housing configured to partially circumscribe a portion of the component. An insulator and a heater are provided within the housing and extend to partially circumscribe a component and are arranged such that the insulator is between a wall of the housing and the heater. The method includes positioning the subassemblies adjacently around the component so that the subassemblies fully circumscribe the component. The subassemblies are connected together. The method includes activating the heater to heat the component in a region adjacent the heater.
    Type: Application
    Filed: December 19, 2017
    Publication date: July 5, 2018
    Inventors: Laura M. HIND, Vincent P. Tsao, Callum J. Jackson, Daniel Clark, Wai Lek Chan