Patents by Inventor Lauren Palmateer
Lauren Palmateer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8435838Abstract: A MEMS device may be package with a desiccant to provide a moisture-free environment. In order to avoid undesirable effects on the MEMS device, the desiccant may be selected or treated so as to be compatible with a particular MEMS device. This treatment may include baking of the desiccant to as to cause outgassing of moisture or other undesirable material. The structure of the MEMS device may also be altered to improve compatibility with particular desiccants.Type: GrantFiled: September 28, 2007Date of Patent: May 7, 2013Assignee: QUALCOMM MEMS Technologies, Inc.Inventors: Yen Hua Lin, Rihui He, Lingling Wu, Lauren Palmateer, David Heald
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Patent number: 8244092Abstract: One embodiment provides a method of testing humidity, comprising: i) determining a property of a device which encloses a plurality of interferometric modulators and ii) determining a relative humidity value or a degree of the relative humidity inside the device based at least in part upon the determined property, wherein the determined property comprises at least one of i) the thickness and width of a seal of the device and ii) adhesive permeability of a component of the device. In one embodiment, the determined property further comprises at least one of the following: i) temperature-humidity combination inside the device, ii) a desiccant capacity inside the device and iii) a device size.Type: GrantFiled: October 9, 2009Date of Patent: August 14, 2012Assignee: QUALCOMM MEMS Technologies, Inc.Inventors: Brian J. Gally, Lauren Palmateer, Manish Kothari, William J. Cummings
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Publication number: 20120127556Abstract: A package structure and method of packaging for an interferometric modulator. A transparent substrate having an interferometric modulator formed thereon is provided. A backplane is joined to the transparent substrate with a seal where the interferometric modulator is exposed to the surrounding environment through an opening in either the backplane or the seal. The opening is sealed after the transparent substrate and backplane are joined and after any desired desiccant, release material, and/or self-aligning monolayer is introduced into the package structure.Type: ApplicationFiled: January 18, 2012Publication date: May 24, 2012Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.Inventors: Brian J. Gally, William J. Cummings, Lauren Palmateer, Philip D. Floyd, Clarence Chui
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Patent number: 8124434Abstract: A package structure and method of packaging for an interferometric modulator. A transparent substrate having an interferometric modulator formed thereon is provided. A backplane is joined to the transparent substrate with a seal where the interferometric modulator is exposed to the surrounding environment through an opening in either the backplane or the seal. The opening is sealed after the transparent substrate and backplane are joined and after any desired desiccant, release material, and/or self-aligning monolayer is introduced into the package structure.Type: GrantFiled: June 10, 2005Date of Patent: February 28, 2012Assignee: QUALCOMM MEMS Technologies, Inc.Inventors: Brian J. Gally, William J. Cummings, Lauren Palmateer, Philip D. Floyd, Clarence Chui
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Publication number: 20120002266Abstract: A package structure and method of packaging for an interferometric modulator. A thin film material is deposited over an interferometric modulator and transparent substrate to encapsulate the interferometric modulator. A gap or cavity between the interferometric modulator and the thin film provides a space in which mechanical parts of the interferometric modulator may move. The gap is created by removal of a sacrificial layer that is deposited over the interferometric modulator.Type: ApplicationFiled: September 13, 2011Publication date: January 5, 2012Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.Inventors: Lauren Palmateer, William J. Cummings, Brian Gally, Mark Miles, Jeffrey B. Sampsell, Clarence Chui, Manish Kothari
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Publication number: 20110290552Abstract: Methods and systems for packaging MEMS devices such as interferometric modulator arrays are disclosed. One embodiment of a MEMS device package structure includes a seal with a chemically reactant getter. Another embodiment of a MEMS device package comprises a primary seal with a getter, and a secondary seal proximate an outer periphery of the primary seal. Yet another embodiment of a MEMS device package comprises a getter positioned inside the MEMS device package and proximate an inner periphery of the package seal.Type: ApplicationFiled: August 11, 2011Publication date: December 1, 2011Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.Inventors: Lauren Palmateer, William J. Cummings, Brian Gally, Clarence Chui, Manish Kothari
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Patent number: 8045835Abstract: A package structure and method of packaging for an interferometric modulator. A thin film material is deposited over an interferometric modulator and transparent substrate to encapsulate the interferometric modulator. A gap or cavity between the interferometric modulator and the thin film provides a space in which mechanical parts of the interferometric modulator may move. The gap is created by removal of a sacrificial layer that is deposited over the interferometric modulator.Type: GrantFiled: August 15, 2008Date of Patent: October 25, 2011Assignee: QUALCOMM MEMS Technologies, Inc.Inventors: Lauren Palmateer, William J. Cummings, Brian Gally, Mark Miles, Jeffrey B. Sampsell, Clarence Chui, Manish Kothari
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Patent number: 8040587Abstract: A package structure and method for packaging a MEMS device is described. In one embodiment, the MEMS base device can include a substrate having a MEMS device formed thereon, a backplate, an exposed or activated desiccant disposed between the backplate and the transparent substrate, and a cover at least partially encapsulating said desiccant. In another embodiment, a MEMS display device can be manufactured by contacting the substrate and/or backplate with a cover which at least partially encapsulates a desiccant, joining the backplate and the substrate to form a package, and exposing or activating the desiccant.Type: GrantFiled: May 17, 2007Date of Patent: October 18, 2011Assignee: QUALCOMM MEMS Technologies, Inc.Inventor: Lauren Palmateer
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Publication number: 20110210910Abstract: Systems and methods of displaying an end-of-life image on an electronic display are disclosed. An end-of-life image is displayed on a MEMS display device in the presence of sufficient water vapor and without continued activation of the display. The image can be displayed in response to user input, in response to detection of a predefined level of water vapor within the display package, according to a prestored lifetime of the device, or according to the natural expiration of the lifetime of the display device and packaging.Type: ApplicationFiled: March 24, 2011Publication date: September 1, 2011Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.Inventor: Lauren Palmateer
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Patent number: 8004736Abstract: A first electrode and a sacrificial layer are sequentially formed on a substrate, and then first openings for forming supports inside are formed in the first electrode and the sacrificial layer. The supports are formed in the first openings, and then a second electrode is formed on the sacrificial layer and the supports, thus forming a micro electro mechanical system structure. Afterward, an adhesive is used to adhere and fix a protection structure to the substrate for forming a chamber to enclose the micro electro mechanical system structure, and at least one second opening is preserved on sidewalls of the chamber. A release etch process is subsequently employed to remove the sacrificial layer through the second opening in order to form cavities in an optical interference reflection structure. Finally, the second opening is closed to seal the optical interference reflection structure between the substrate and the protection structure.Type: GrantFiled: May 8, 2009Date of Patent: August 23, 2011Assignee: Qualcomm MEMS Technologies, Inc.Inventors: Wen-Jian Lin, Brian Arbuckle, Brian Gally, Philip Floyd, Lauren Palmateer
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Patent number: 7990601Abstract: A package structure and method of packaging an interferometric modulator with a reinforcing substance to help support the integrity of the package. In some embodiments the reinforcing substance is a desiccant integrated into the backplate or the transparent substrate.Type: GrantFiled: March 18, 2010Date of Patent: August 2, 2011Assignee: QUALCOMM MEMS Technologies, Inc.Inventor: Lauren Palmateer
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Patent number: 7916103Abstract: Systems and methods of displaying an end-of-life image on an electronic display are disclosed. An end-of-life image is displayed on a MEMS display device in the presence of sufficient water vapor and without continued activation of the display. The image can he displayed in response to user input, in response to detection of a predefined level of water vapor within the display package, according to a prestored lifetime of the device, or according to the natural expiration of the lifetime of the display device and packaging.Type: GrantFiled: April 8, 2005Date of Patent: March 29, 2011Assignee: QUALCOMM MEMS Technologies, Inc.Inventor: Lauren Palmateer
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Publication number: 20110053304Abstract: A package is made of a transparent substrate having an interferometric modulator and a back plate. A non-hermetic seal joins the back plate to the substrate to form a package, and a desiccant resides inside the package. A method of packaging an interferometric modulator includes providing a transparent substrate and manufacturing an interferometric modulator array on a backside of the substrate. A back plate includes a curved portion relative to the substrate. The curved portion is substantially throughout the back plate. The back plate is sealed to the backside of the substrate with a back seal in ambient conditions, thereby forming a package.Type: ApplicationFiled: October 14, 2010Publication date: March 3, 2011Applicant: Qualcomm MEMS Technologies, Inc.Inventors: Lauren Palmateer, Brian J. Gally, William J. Cummings, Manish Kothari, Clarence Chui
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Publication number: 20110012219Abstract: A MEMS device may be package with a desiccant to provide a moisture-free environment. In order to avoid undesirable effects on the MEMS device, the desiccant may be selected or treated so as to be compatible with a particular MEMS device. This treatment may include baking of the desiccant to as to cause outgassing of moisture or other undesirable material. The structure of the MEMS device may also be altered to improve compatibility with particular desiccants.Type: ApplicationFiled: September 28, 2007Publication date: January 20, 2011Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.Inventors: Yen Hua Lin, Rihui He, Lingling Wu, Lauren Palmateer, David Heald
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Patent number: 7816710Abstract: A package is made of a transparent substrate having an interferometric modulator and a back plate. A non-hermetic seal joins the back plate to the substrate to form a package, and a desiccant resides inside the package. A method of packaging an interferometric modulator includes providing a transparent substrate and manufacturing an interferometric modulator array on a backside of the substrate. A back plate includes a curved portion relative to the substrate. The curved portion is substantially throughout the back plate. The back plate is sealed to the backside of the substrate with a back seal in ambient conditions, thereby forming a package.Type: GrantFiled: January 24, 2008Date of Patent: October 19, 2010Assignee: QUALCOMM MEMS Technologies, Inc.Inventors: Lauren Palmateer, Brian J. Gally, William J. Cummings, Manish Kothari, Clarence Chui
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Publication number: 20100172013Abstract: A package structure and method of packaging an interferometric modulator with a reinforcing substance to help support the integrity of the package. In some embodiments the reinforcing substance is a desiccant integrated into the backplate or the transparent substrate.Type: ApplicationFiled: March 18, 2010Publication date: July 8, 2010Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.Inventor: Lauren Palmateer
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Patent number: 7715080Abstract: A package structure and method of packaging for a MEMS device is described. A transparent substrate having an interferometric modulator array formed thereon is shown. A single or dual-layered backplate is joined to a frame that circumscribes the modulator array. The frame is bonded to the transparent substrate and to the backplate to provide a hermetic package.Type: GrantFiled: April 13, 2007Date of Patent: May 11, 2010Assignee: QUALCOMM MEMS Technologies, Inc.Inventors: Bangalore R. Natarajan, Lauren Palmateer
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Patent number: 7710629Abstract: A package structure and method of packaging an interferometric modulator with a reinforcing substance to help support the integrity of the package. In some embodiments the reinforcing substance is a desiccant integrated into the backplate or the transparent substrate.Type: GrantFiled: June 3, 2005Date of Patent: May 4, 2010Assignee: Qualcomm Mems Technologies, Inc.Inventor: Lauren Palmateer
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Patent number: 7692839Abstract: In various embodiments of the invention, an anti-stiction coating is formed on at least one surface of an interior cavity of a MEMS device. Particular embodiments provide an anti-stiction on one or mirror surfaces of an interferometric light modulation device, also known as an iMoD in some embodiments. In other embodiments, an interferometric light modulation device is encapsulated within a package and the anti-stiction coating is applied after the package is fabricated. In one embodiment, one or more orifices are defined in the package, e.g., in a seal, a substrate or a backplate and the anti-stiction coating material is supplied into the interior of the package via the orifice(s). In one embodiment, the anti-stiction coating material includes a self-aligned (or self-assembled) monolayer. In yet another embodiment, the anti-stiction layer coating can be incorporated into a release process where a sacrificial layer of an interferometric light modulation device is etched away with the use of a gas.Type: GrantFiled: April 29, 2005Date of Patent: April 6, 2010Assignee: QUALCOMM MEMS Technologies, Inc.Inventors: Lauren Palmateer, William J. Cummings, Brian J. Gally
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Publication number: 20100024523Abstract: One embodiment provides a method of testing humidity, comprising: i) determining a property of a device which encloses a plurality of interferometric modulators and ii) determining a relative humidity value or a degree of the relative humidity inside the device based at least in part upon the determined property, wherein the determined property comprises at least one of i) the thickness and width of a seal of the device and ii) adhesive permeability of a component of the device. In one embodiment, the determined property further comprises at least one of the following: i) temperature-humidity combination inside the device, ii) a desiccant capacity inside the device and iii) a device size.Type: ApplicationFiled: October 9, 2009Publication date: February 4, 2010Applicant: IDC, LLCInventors: Brian J. Gally, Lauren Palmateer, Manish Kothari, William J. Cummings