Abstract: A MEMS device is packaged with a control material that is included in the package to affect an operation of a moveable element of the device. The control material may affect operational characteristics including actuation and release voltages and currents, mechanical affects including damping and stiffness, lifetime of the device, optical properties, thermal affects and corrosion. The control material may be inserted into the package as part of any of several structural components of the package or the MEMS device.

Abstract: A MEMS device is packaged with a control material that is included in the package to affect an operation of a moveable element of the device. The control material may affect operational characteristics including actuation and release voltages and currents, mechanical affects including damping and stiffness, lifetime of the device, optical properties, thermal affects and corrosion. The control material may be inserted into the package as part of any of several structural components of the package or the MEMS device.

Abstract: A MEMS device is packaged with a control material that is included in the package to affect an operation of a moveable element of the device. The control material may affect operational characteristics including actuation and release voltages and currents, mechanical affects including damping and stiffness, lifetime of the device, optical properties, thermal affects and corrosion. The control material may be inserted into the package as part of any of several structural components of the package or the MEMS device.

Abstract: A MEMS device package comprises a substrate with a MEMS device formed thereon, a backplane, and a primary seal, wherein the primary seal is positioned between the backplane and the substrate to encapsulate and seal the MEMS device package from ambient conditions. The MEMS device package further comprises a secondary seal in contact with at least the backplane and the substrate.

Abstract: Systems and methods of displaying an end-of-life image on an electronic display are disclosed. An end-of-life image is displayed on a MEMS display device in the presence of sufficient water vapor and without continued activation of the display. The image can he displayed in response to user input, in response to detection of a predefined level of water vapor within the display package, according to a prestored lifetime of the device, or according to the natural expiration of the lifetime of the display device and packaging.

Abstract: Disclosed is an electronic device utilizing interferometric modulation and a package of the device. The packaged device includes a substrate, an interferometric modulation display array formed on the substrate, and a back-plate. The back-plate is placed over the display array with a gap between the back-plate and the display array. The device further includes reinforcing structures which are integrated with the back-plate. The reinforcing structures add stiffness to the back-plate. The back-plate may have a thickness varying along an edge thereof.

Abstract: A MEMS-based display device is described, wherein an array of interferometric modulators are configured to reflect light through a transparent substrate. The transparent substrate is sealed to a backplate and the backplate can contain electronic circuitry for controlling the array of interferometric modulators. The backplate can provide physical support for device components, such as electronic components which can be used to control the state of the display. The backplate can also be utilized as a primary structural support for the device.

Abstract: A package structure and method of packaging for an interferometric modulator. A transparent substrate having an interferometric modulator formed thereon is provided. A backplane is joined to the transparent substrate with a seal where the interferometric modulator is exposed to the surrounding environment through an opening in either the backplane or the seal. The opening is sealed after the transparent substrate and backplane are joined and after any desired desiccant, release material, and/or self-aligning monolayer is introduced into the package structure.

Abstract: In various embodiments of the invention, an anti-stiction coating is formed on at least one surface of an interior cavity of a MEMS device. Particular embodiments provide an anti-stiction on one or mirror surfaces of an interferometric light modulation device, also known as an iMoD in some embodiments. In other embodiments, an interferometric light modulation device is encapsulated within a package and the anti-stiction coating is applied after the package is fabricated. In one embodiment, one or more orifices are defined in the package, e.g., in a seal, a substrate or a backplate and the anti-stiction coating material is supplied into the interior of the package via the orifice(s). In one embodiment, the anti-stiction coating material includes a self-aligned (or self-assembled) monolayer. In yet another embodiment, the anti-stiction layer coating can be incorporated into a release process where a sacrificial layer of an interferometric light modulation device is etched away with the use of a gas.

Abstract: A MEMS device package comprises a substrate with a MEMS device formed thereon, a backplane, a seal, and an inactive desiccant within the package. The desiccant is activated after assembly of the package by exposure to an environmental change or an activating substance. A method of packaging a MEMS device comprises activating a desiccant and contacting a substrate with the MEMS device formed thereon, a seal, and a backplane, wherein the desiccant is disposed on the substrate or the backplane.

Abstract: Physical forces sufficient to deform an electronic device and/or packaging for the electronic device can damage the device. Some mechanical components in a device, for example, in a microelectromechanical device and/or in an interferometric modulator are particularly susceptible to damage. Accordingly, provided herein is a packaging system and packaged electronic device that resists physical damage, a method for manufacturing the same, and a method for protecting an electronic device from physical damage. The packaging system for the electronic device includes one or more spacers that prevent or reduce damage to the electronic device arising from contact with the packaging. In some embodiments, the packaged electronic device comprising spacers is thinner than a comparable device manufactured without spacers.

Abstract: Methods and systems for packaging MEMS devices such as interferometric modulator arrays are disclosed. One embodiment of a MEMS device package structure includes a seal with a chemically reactant getter. Another embodiment of a MEMS device package comprises a primary seal with a getter, and a secondary seal proximate an outer periphery of the primary seal. Yet another embodiment of a MEMS device package comprises a getter positioned inside the MEMS device package and proximate an inner periphery of the package seal.

Abstract: A package structure and method of packaging an interferometric modulator with an integrated desiccant. An interferometric modulator is formed on a transparent substrate. A backplane is joined to the transparent substrate to form a package structure and to encapsulate the interferometric modulator. A desiccant integrated into the backplane or the transparent substrate is provided to absorb moisture within the package.

Abstract: A package structure and method of packaging for an interferometric modulator. A thin film material is deposited over an interferometric modulator and transparent substrate to encapsulate the interferometric modulator. A gap or cavity between the interferometric modulator and the thin film provides a space in which mechanical parts of the interferometric modulator may move. The gap is created by removal of a sacrificial layer that is deposited over the interferometric modulator.

Abstract: A package structure and method of packaging an interferometric modulator with a reinforcing substance to help support the integrity of the package. In some embodiments the reinforcing substance is a desiccant integrated into the backplate or the transparent substrate.

Abstract: One embodiment provides a method of testing humidity, comprising: determining a property of a device which encloses a plurality of interferometric modulators; and determining a relative humidity value or a degree of the relative humidity inside the device based at least in part upon the determined property. In one embodiment, the property of the device includes one of the following: i) a weight of the device, ii) a color change of a desiccant enclosed in the device, iii) a resistance inside the device, iv) whether frost formed in an inside area of the device which is contacted by a cold finger device, v) whether a desiccant enclosed in the device, when water vapor is provided into the device, is working properly, and vi) combination of at lest two of i)-v).

Abstract: Disclosed is an electronic device utilizing interferometric modulation and a package of the device. The packaged device includes a substrate, an interferometric modulation display array formed on the substrate, and a back-plate. The back-plate is placed over the display array with a gap between the back-plate and the display array. The depth of the gap may vary across the back-plate. The back-plate can be curved or have a recess on its interior surface facing the display array. Thickness of the back-plate may vary. The device may include reinforcing structures which are integrated with the back-plate.

Abstract: A package is made of a transparent substrate having an interferometric modulator and a back plate. A non-hermetic seal joins the back plate to the substrate to form a package, and a desiccant resides inside the package. A method of packaging an interferometric modulator includes providing a transparent substrate and manufacturing an interferometric modulator array on a backside of the substrate. A back plate is provided and a desiccant is applied to the back plate.

Abstract: A device has a first surface. A second surface is offset from a first surface to form a package. At least one movable element is within the package having a movable surface to contact another surface. An environmental control material is included inside the package to affect an operation of the movable element.