Patents by Inventor Laurent Michaud

Laurent Michaud has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thin-film transfer method
    Patent number: 11551976
    Abstract: A method includes transferring a layer onto a flexible substrate, the layer being located in a stack on the front face of the substrate. The substrate includes at least one supplementary stack interposed between the stack and the bulk layer of the substrate. This supplementary stack includes at least two layers with thicknesses decreasing in the direction of the front face. The method makes provision, after bonding the flexible substrate on the front face, for successively and gradually removing the various layers of the substrate. Such gradualness makes it possible to transfer a thin layer of silicon, with a thickness of less than 50 nm, onto a flexible substrate.
    Type: Grant
    Filed: October 10, 2019
    Date of Patent: January 10, 2023
    Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    Inventors: Frank Fournel, Laurent Michaud, Pierre Montmeat
  • Method of transferring a thin film from a substrate to a flexible support
    Patent number: 11244971
    Abstract: A method of transferring a thin film from a substrate to a flexible support that includes transfer of the flexible support by a layer of polymer, crosslinkable under ultraviolet light, directly on the thin film, the adhesion energy of the polymer evolving according to its degree of crosslinking, decreasing to an energy point d minimum adhesion achieved for a nominal crosslinking rate, then increasing for a crosslinking rate greater than the nominal crosslinking rate, then apply, on the polymer layer, an ultraviolet exposure parameterized so as to stiffen the polymer layer and have an adhesion energy between the thin film and the flexible support greater than an adhesion energy between the thin film and the substrate, then remove the substrate.
    Type: Grant
    Filed: February 21, 2020
    Date of Patent: February 8, 2022
    Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    Inventors: Laurent Michaud, Clement Castan, Frank Fournel, Pierre Montmeat
  • THIN-FILM TRANSFER METHOD
    Publication number: 20210343595
    Abstract: A method includes transferring a layer onto a flexible substrate, the layer being located in a stack on the front face of the substrate. The substrate includes at least one supplementary stack interposed between the stack and the bulk layer of the substrate. This supplementary stack includes at least two layers with thicknesses decreasing in the direction of the front face. The method makes provision, after bonding the flexible substrate on the front face, for successively and gradually removing the various layers of the substrate. Such gradualness makes it possible to transfer a thin layer of silicon, with a thickness of less than 50 nm, onto a flexible substrate.
    Type: Application
    Filed: October 10, 2019
    Publication date: November 4, 2021
    Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    Inventors: Frank FOURNEL, Laurent MICHAUD, Pierre MONTMEAT
  • METHOD OF TRANSFERRING A THIN FILM FROM A SUBSTRATE TO A FLEXIBLE SUPPORT
    Publication number: 20200350343
    Abstract: A method of transferring a thin film from a substrate to a flexible support that includes transfer of the flexible support by a layer of polymer, crosslinkable under ultraviolet light, directly on the thin film, the adhesion energy of the polymer evolving according to its degree of crosslinking, decreasing to an energy point d minimum adhesion achieved for a nominal crosslinking rate, then increasing for a crosslinking rate greater than the nominal crosslinking rate, then apply, on the polymer layer, an ultraviolet exposure parameterized so as to stiffen the polymer layer and have an adhesion energy between the thin film and the flexible support greater than an adhesion energy between the thin film and the substrate, then remove the substrate.
    Type: Application
    Filed: February 21, 2020
    Publication date: November 5, 2020
    Applicant: COMMISSARIAT A L'ENERGIE A TOMIQUE ET AUX ENERGIES ALTERNATIVES
    Inventors: Laurent MICHAUD, Clement Castan, Frank Fournel, Pierre Montmeat
  • Propuision and recharge system for an electric vehicle with a propeller system
    Publication number: 20050103537
    Abstract: Wind turns propellers, which in them generate enough energy to be used in an electric vehicle.
    Type: Application
    Filed: August 25, 2003
    Publication date: May 19, 2005
    Inventors: Laurent Michaud, Denis Blanchette, Joanne Michaud