Patents by Inventor Laurent OTTE
Laurent OTTE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11600559Abstract: A method of manufacturing a sensor device (100) comprises providing (200) a package (102) having a first die-receiving subframe volume (104) separated from a second die-receiving subframe volume (106) by a partition wall (116). An elongate sensor element (120) is disposed (202) within the package (102) so as to bridge the first and second subframe volumes (104, 106) and to overlie the partition wall (116). The elongate sensor element (120) resides substantially in the first subframe volume (104) and partially in the second subframe volume (106). The elongate sensor element (120) is electrically connected within the second subframe volume (106).Type: GrantFiled: August 30, 2019Date of Patent: March 7, 2023Assignee: MELEXIS TECHNOLOGIES NVInventors: Jian Chen, Appolonius Jacobus Van Der Wiel, Laurent Otte
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Patent number: 11515467Abstract: A piezo-resistor sensor includes a diffusion of a first conductivity type in a well of an opposite second type, contacts with islands in the diffusion, interconnects with the contacts, and a shield covers the diffusion between the contacts and extends over side walls of the diffusion between the contacts. Each interconnect covers the diffusion at the corresponding contact and extends over edges of the diffusion, and each island is at a side covered by its interconnect. A guard ring of the second type is around the diffusion. The shield covers the well between the diffusion and the ring and the edge of the ring facing the diffusion. If a gap between the shield and the interconnect is present, the ring bridges this gap, and/or the edges of the diffusion are completely covered by the combination of the shield and the interconnects.Type: GrantFiled: December 4, 2020Date of Patent: November 29, 2022Assignee: MELEXIS TECHNOLOGIES NVInventors: Appolonius Jacobus Van Der Wiel, Maliheh Ramezani, Cathleen Rooman, Laurent Otte, Johan Vergauwen
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Patent number: 11169039Abstract: A pressure sensor device comprises a device package (110) arranged to define a cavity (116) having an opening for fluid communication with an internal volume thereof. The cavity (116) comprises a side wall (114, 115). An elongate pressure sensor element (100) is provided and has a proximal end (120) and a distal end (122). The side wall (114, 115) is arranged to hold fixedly the proximal end (120) of the pressure sensor element (100) therein so that the pressure sensor element (100) is cantilever-suspended from the side wall (114, 115) within the cavity (116).Type: GrantFiled: August 30, 2019Date of Patent: November 9, 2021Assignee: MELEXIS TECHNOLOGIES NVInventors: Laurent Otte, Appolonius Jacobus Van Der Wiel, Jian Chen
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Publication number: 20210175410Abstract: A piezo-resistor sensor includes a diffusion of a first conductivity type in a well of an opposite second type, contacts with islands in the diffusion, interconnects with the contacts, and a shield covers the diffusion between the contacts and extends over side walls of the diffusion between the contacts. Each interconnect covers the diffusion at the corresponding contact and extends over edges of the diffusion, and each island is at a side covered by its interconnect. A guard ring of the second type is around the diffusion. The shield covers the well between the diffusion and the ring and the edge of the ring facing the diffusion. If a gap between the shield and the interconnect is present, the ring bridges this gap, and/or the edges of the diffusion are completely covered by the combination of the shield and the interconnects.Type: ApplicationFiled: December 4, 2020Publication date: June 10, 2021Inventors: Appolonius Jacobus VAN DER WIEL, Maliheh RAMEZANI, Cathleen ROOMAN, Laurent OTTE, Johan VERGAUWEN
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Publication number: 20200075466Abstract: A method of manufacturing a sensor device (100) comprises providing (200) a package (102) having a first die-receiving subframe volume (104) separated from a second die-receiving subframe volume (106) by a partition wall (116). An elongate sensor element (120) is disposed (202) within the package (102) so as to bridge the first and second subframe volumes (104, 106) and to overlie the partition wall (116). The elongate sensor element (120) resides substantially in the first subframe volume (104) and partially in the second subframe volume (106). The elongate sensor element (120) is electrically connected within the second subframe volume (106).Type: ApplicationFiled: August 30, 2019Publication date: March 5, 2020Applicant: Melexis Technologies NVInventors: Jian CHEN, Appolonius Jacobus VAN DER WIEL, Laurent OTTE
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Publication number: 20200072692Abstract: A pressure sensor device comprises a device package (110) arranged to define a cavity (116) having an opening for fluid communication with an internal volume thereof. The cavity (116) comprises a side wall (114, 115). An elongate pressure sensor element (100) is provided and has a proximal end (120) and a distal end (122). The side wall (114, 115) is arranged to hold fixedly the proximal end (120) of the pressure sensor element (100) therein so that the pressure sensor element (100) is cantilever-suspended from the side wall (114, 115) within the cavity (116).Type: ApplicationFiled: August 30, 2019Publication date: March 5, 2020Applicant: Melexis Technologies NVInventors: Laurent OTTE, Appolonius Jacobus VAN DER WIEL, Jian CHEN
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Patent number: 10308502Abstract: A semiconductor pressure sensor assembly for measuring a pressure of an exhaust gas which contains corrosive components, comprising: a first cavity, a pressure sensor comprising first bondpads for electrical interconnection, a CMOS chip comprising second bondpads for electrical interconnection with the pressure sensor, an interconnection module having electrically conductive paths connected via bonding wires to the pressure sensor and to the CMOS chip; the interconnection module being a substrate with corrosion-resistant metal tracks, wherein the CMOS chip and part of the interconnection module are encapsulated by a plastic package.Type: GrantFiled: February 28, 2017Date of Patent: June 4, 2019Assignee: MELEXIS TECHNOLOGIES NVInventors: Laurent Otte, Jian Chen, Appolonius Jacobus Van Der Wiel
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Patent number: 10006822Abstract: A semiconductor sensor assembly for use in a corrosive environment comprises a processing device comprising at least one first bondpad of a material which may be corroded by a corrosive component in a corrosive environment; a sensor device comprising at least one second bondpad consisting of and/or being covered by a first corrosion resistant material; at least one bonding wire for making a signal connection between the at least one first bondpad of the processing device and the second bondpad of the sensor device. The processing device is partially overmoulded by a second corrosion resistant material, and is partially exposed to a cavity in the corrosion resistant material, with the sensor device being present in the cavity. A redistribution layer is provided to enable signal connection between the processing device and the sensor device is physically made in the cavity while the second corrosion resistant material covers the first bondpad.Type: GrantFiled: June 21, 2017Date of Patent: June 26, 2018Assignee: MELEXIS TECHNOLOGIES NVInventors: Jian Chen, Laurent Otte
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Publication number: 20170363492Abstract: A semiconductor sensor assembly for use in a corrosive environment comprises a processing device comprising at least one first bondpad of a material which may be corroded by a corrosive component in a corrosive environment; a sensor device comprising at least one second bondpad consisting of and/or being covered by a first corrosion resistant material; at least one bonding wire for making a signal connection between the at least one first bondpad of the processing device and the second bondpad of the sensor device. The processing device is partially overmoulded by a second corrosion resistant material, and is partially exposed to a cavity in the corrosion resistant material, with the sensor device being present in the cavity. A redistribution layer is provided to enable signal connection between the processing device and the sensor device is physically made in the cavity while the second corrosion resistant material covers the first bondpad.Type: ApplicationFiled: June 21, 2017Publication date: December 21, 2017Inventors: Jian CHEN, Laurent OTTE
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Publication number: 20170247250Abstract: A semiconductor pressure sensor assembly for measuring a pressure of an exhaust gas which contains corrosive components, comprising: a first cavity, a pressure sensor comprising first bondpads for electrical interconnection, a CMOS chip comprising second bondpads for electrical interconnection with the pressure sensor, an interconnection module having electrically conductive paths connected via bonding wires to the pressure sensor and to the CMOS chip; the interconnection module being a substrate with corrosion-resistant metal tracks, wherein the CMOS chip and part of the interconnection module are encapsulated by a plastic package.Type: ApplicationFiled: February 28, 2017Publication date: August 31, 2017Inventors: Laurent OTTE, Jian CHEN, Appolonius Jacobus VAN DER WIEL
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Patent number: 8969978Abstract: A pressure sensor system comprising a pressure sensor chip is disclosed. The pressure sensor chip comprises a sensing side where pressure sensing is performed and one or more interconnections where electrical connections are made at the other side of the chip. The pressure sensor comprising an integrated circuit (1) forming a substrate, the substrate comprising a membrane shaped portion adapted for being exposed to the pressure, the integrated circuit (1) comprising both pressure signal sensing components and pressure signal processing components.Type: GrantFiled: April 25, 2013Date of Patent: March 3, 2015Assignee: Melexis Technologies NVInventors: Laurent Otte, Appolonius Jacobus Van Der Wiel
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Publication number: 20130285167Abstract: A pressure sensor system comprising a pressure sensor chip is disclosed. The pressure sensor chip comprises a sensing side where pressure sensing is performed and one or more interconnections where electrical connections are made at the other side of the chip. The pressure sensor comprising an integrated circuit (1) forming a substrate, the substrate comprising a membrane shaped portion adapted for being exposed to the pressure, the integrated circuit (1) comprising both pressure signal sensing components and pressure signal processing components.Type: ApplicationFiled: April 25, 2013Publication date: October 31, 2013Applicant: Melexis Technologies NVInventors: Laurent OTTE, Appolonius Jacobus VAN DER WIEL