Patents by Inventor Lawrence E. Felton
Lawrence E. Felton has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8343369Abstract: A method of producing a MEMS device removes the bottom side of a device wafer after its movable structure is formed. To that end, the method provides the device wafer, which has an initial bottom side. Next, the method forms the movable structure on the device wafer, and then removes substantially the entire initial bottom side of the device wafer. Removal of the entire initial bottom side effectively forms a final bottom side.Type: GrantFiled: July 14, 2011Date of Patent: January 1, 2013Assignee: Analog Devices, Inc.Inventors: Manolo G. Mena, Elmer S. Lacsamana, William A. Webster, Lawrence E. Felton
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Publication number: 20110266639Abstract: A method of producing a MEMS device removes the bottom side of a device wafer after its movable structure is formed. To that end, the method provides the device wafer, which has an initial bottom side. Next, the method forms the movable structure on the device wafer, and then removes substantially the entire initial bottom side of the device wafer. Removal of the entire initial bottom side effectively forms a final bottom side.Type: ApplicationFiled: July 14, 2011Publication date: November 3, 2011Applicant: ANALOG DEVICES, INC.Inventors: Manolo G. Mena, Elmer S. Lacsamana, William A. Webster, Lawrence E. Felton
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Patent number: 7795723Abstract: A sensor element is capped by bonding or otherwise forming a cap on a sensor element. The sensor may be hermetically sealed by using a hermetic cap and hermetic bonding material or by applying a hermetic coating. The sensor may be filled with a gas at an elevated pressure. The sensor may alternatively or additionally be filled with a special gas, such as a gas having a density-to-viscosity ratio above approximately 0.2.Type: GrantFiled: January 20, 2005Date of Patent: September 14, 2010Assignee: Analog Devices, Inc.Inventors: Kevin H.-L. Chau, Lawrence E. Felton, John A. Geen, Michael W. Judy, John R. Martin
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Patent number: 7521363Abstract: A method of producing a MEMS device forms structure on a non-standard device wafer. To that end, the method provides the noted non-standard device wafer, which has a wafer outer diameter and a non-standard thickness. As known by those in the art, a standard device wafer has a standard thickness when its outer diameter equals the wafer outer diameter. In illustrative embodiments, however, the non-standard thickness is smaller than the standard thickness. The method then forms structure on the non-standard device wafer.Type: GrantFiled: August 9, 2004Date of Patent: April 21, 2009Assignee: Analog Devices, Inc.Inventors: John R. Martin, Lawrence E. Felton
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Publication number: 20080225505Abstract: A method of producing a MEMS device removes the bottom side of a device wafer after its movable structure is formed. To that end, the method provides the device wafer, which has an initial bottom side. Next, the method forms the movable structure on the device wafer, and then removes substantially the entire initial bottom side of the device wafer. Removal of the entire initial bottom side effectively forms a final bottom side.Type: ApplicationFiled: May 29, 2008Publication date: September 18, 2008Applicant: ANALOG DEVICES, INC.Inventors: John R. Martin, Manolo G. Mena, Elmer S. Lacsamana, Michael P. Duffy, William A. Webster, Lawrence E. Felton, Maurice S. Karpman
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Publication number: 20080150104Abstract: A package for a micro-electromechanical (MEMS) device is described. A premolded leadframe base has opposing top and bottom surfaces. Each surface is defined by a topology having at least one electrically conductive portion and at least one electrically non-conductive portion, and the topology of the top surface differs from the topology of the bottom surface.Type: ApplicationFiled: October 19, 2007Publication date: June 26, 2008Inventors: Michael A. Zimmerman, Keith Smith, Kieran P. Harney, John R. Martin, Lawrence E. Felton
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Patent number: 7357017Abstract: A sensor has a die (with a working portion), a cap coupled with the die to at least partially cover the working portion, and a conductive pathway extending through the cap to the working portion. The pathway provides an electrical interface to the working portion.Type: GrantFiled: August 9, 2007Date of Patent: April 15, 2008Assignee: Analog Devices, Inc.Inventors: Lawrence E. Felton, Kieran P. Harney, Carl M. Roberts
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Patent number: 7338705Abstract: An optically transparent conductive material is disposed directly or indirectly on an inside surface of a cover material for static dissipation in an optical switching device. The optically transparent conductive material forms an electrically continuous film. The optically transparent conductive material can also be used for anti-reflection. An additional coating may be disposed directly or indirectly on an outside surface of the cover material.Type: GrantFiled: March 20, 2006Date of Patent: March 4, 2008Assignee: Analog Devices, Inc.Inventors: John R. Martin, Maurice Karpman, Lawrence E. Felton
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Patent number: 7275424Abstract: A sensor has a die (with a working portion), a cap coupled with the die to at least partially cover the working portion, and a conductive pathway extending through the cap to the working portion. The pathway provides an electrical interface to the working portion.Type: GrantFiled: March 23, 2005Date of Patent: October 2, 2007Assignee: Analog Devices, Inc.Inventors: Lawrence E. Felton, Kieran P. Harncy, Carl M. Roberts
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Patent number: 7166911Abstract: A MEMS inertial sensor is secured within a premolded-type package formed, at least in part, from a low moisture permeable molding material. Consequently, such a motion detector should be capable of being produced more economically than those using ceramic packages. To those ends, the package has at least one wall (having a low moisture permeability) extending from a leadframe to form a cavity, and an isolator (with a top surface) within the cavity. The MEMS inertial sensor has a movable structure suspended above a substrate having a bottom surface. The substrate bottom surface is secured to the isolator top surface at a contact area. In illustrative embodiments, the contact area is less than the surface area of the bottom surface of the substrate. Accordingly, the isolator forms a space between at least a portion of the bottom substrate surface and the package. This space thus is free of the isolator.Type: GrantFiled: September 28, 2004Date of Patent: January 23, 2007Assignee: Analog Devices, Inc.Inventors: Maurice S. Karpman, Nicole Hablutzel, Peter W. Farrell, Michael W. Judy, Lawrence E. Felton, Lewis Long
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Patent number: 7040922Abstract: An electrical interconnect apparatus has a mounting member with a plurality of sides. The mounting member is formed from an insulator as a cuboid. Moreover, the mounting member also may be formed from a flexible circuit. Among other things, the plurality of sides includes an interface side. At least two of the plurality of sides are in electrical communication with the interface side.Type: GrantFiled: June 5, 2003Date of Patent: May 9, 2006Assignee: Analog Devices, Inc.Inventors: Kieran P. Harney, Lawrence E. Felton, Lewis Long
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Patent number: 7033672Abstract: An optically transparent conductive material is used for static dissipation of a cover material for an optical switching device. The optically transparent conductive material is deposited directly or indirectly on the cover material. The optically transparent conductive material forms an electrically continuous film. The optically transparent conductive material can also be used for anti-reflection.Type: GrantFiled: March 19, 2002Date of Patent: April 25, 2006Assignee: Analog Devices, Inc.Inventors: John R. Martin, Maurice Karpman, Lawrence E. Felton
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Patent number: 6964882Abstract: A flip-bonding technique is used to fabricate complex micro-electromechanical systems. Various micromachined structures are fabricated on the front side of each of two wafers. One of the wafers is flipped over and bonded to the other wafer so that the front sides of the two wafers are bonded together in a flip-stacked configuration.Type: GrantFiled: September 27, 2002Date of Patent: November 15, 2005Assignee: Analog Devices, Inc.Inventors: Chang-Han Yun, Lawrence E. Felton, Maurice S. Karpman, John A. Yasaitis, Michael W. Judy, Colin Gormley
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Patent number: 6940636Abstract: In an optical switching apparatus having a mirror structure bonded to a substrate, the gap between the mirror structure and the substrate is controlled by mechanical standoffs placed between the mirror structure and the substrate. The mirror structure is bonded to the substrate using solder. The mechanical standoffs are formed from a material having a higher melting point than that of the solder. The mirror structure is bonded to the substrate under pressure at a temperature between the melting point of the solder and the melting point of the mechanical standoffs.Type: GrantFiled: September 20, 2001Date of Patent: September 6, 2005Assignee: Analog Devices, Inc.Inventor: Lawrence E. Felton
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Patent number: 6936918Abstract: A MEMS device has at least one conductive path extending from the top facing side of its substrate (having MEMS structure) to the bottom side of the noted substrate. The at least one conductive path extends through the substrate as noted to electrically connect the bottom facing side with the MEMS structure.Type: GrantFiled: April 19, 2004Date of Patent: August 30, 2005Assignee: Analog Devices, Inc.Inventors: Kieran P. Harney, Lawrence E. Felton, Thomas Kieran Nunan, Susan A. Alie, Bruce Wachtmann
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Patent number: 6933163Abstract: An intermediate electrode layer is used to fabricate an integrated micro-electromechanical system. An intermediate electrode layer is formed on an integrated circuit wafer. The intermediate electrode layer places drive electrodes a predetermined height above the surface of the integrated circuit wafer. A micro-electromechanical system wafer having micromachined optical mirrors is bonded to the integrated circuit wafer such that the drive electrodes are positioned a predetermined distance from the optical mirrors.Type: GrantFiled: September 27, 2002Date of Patent: August 23, 2005Assignee: Analog Devices, Inc.Inventors: Chang-Han Yun, Lawrence E. Felton, Maurice S. Karpman, John A. Yasaitis, Michael W. Judy, Colin Gormley
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Patent number: 6931170Abstract: A fiber-attached optical device with in-plane micromachined mirrors includes a cover having at least one reflector formed on one side and a substrate having a plurality of micromachined optical mirrors formed substantially on a single plane on a side facing toward the mirrored side of the cover. The micromachined optical mirrors are controllable to reflect optical signals between a plurality of optical fiber segments via the at least one reflector. The plurality of optical fiber segments can be attached to either the cover or the substrate so as to form an integrated package including the substrate, the cover, and the plurality of optical fiber segments. The mirrors can be controlled to variably attenuate the optical signals.Type: GrantFiled: October 18, 2002Date of Patent: August 16, 2005Assignee: Analog Devices, Inc.Inventors: Chang-Han Yun, Shanti Bhattacharya, Yakov Reznichenko, John R. Martin, Lawrence E. Felton, Jeffrey Swift, Kieran P. Harney, Michael W. Judy
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Patent number: 6893574Abstract: A MEMS capping method and apparatus uses a cap structure on which is formed a MEMS cavity, a cut capture cavity, and a cap wall. The cap wall is essentially the outer wall of the MEMS cavity and the inner wall of the cut capture cavity. The cap structure is bonded onto a MEMS structure such that the MEMS cavity covers protected MEMS components. The cap structure is trimmed by cutting through to the cut capture cavity from the top of the cap structure without cutting all the way through to the MEMS structure.Type: GrantFiled: October 23, 2001Date of Patent: May 17, 2005Inventors: Lawrence E. Felton, Peter W. Farrell, Jing Luo, David J. Collins, John R. Martin, William A. Webster
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Publication number: 20040244510Abstract: A motion sensor has a mounting member with a plurality of mounting surfaces, and a plurality of motion sensor devices mounted to two or more of the mounting surfaces.Type: ApplicationFiled: June 5, 2003Publication date: December 9, 2004Inventors: Kieran P. Harney, Lawrence E. Felton, Lewis Long
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Method and device for protecting micro electromechanical systems structures during dicing of a wafer
Patent number: 6759273Abstract: A wafer cap protects micro electromechanical system (“MEMS”) structures during a dicing of a MEMS wafer to produce individual MEMS dies. A MEMS wafer is prepared having a plurality of MEMS structure sites thereon. Upon the MEMS wafer, the wafer cap is mounted to produce a laminated MEMS wafer. The wafer cap is recessed in areas corresponding to locations of the MEMS structure sites on the MEMS wafer. The capped MEMS wafer can be diced into a plurality of MEMS dies without causing damage to or contaminating the MEMS die.Type: GrantFiled: December 5, 2001Date of Patent: July 6, 2004Assignee: Analog Devices, Inc.Inventors: Lawrence E. Felton, Jing Luo