Abstract: A fluid ejection assembly includes a carrier including a substrate and an electrical circuit with the substrate having a first side and a second side opposite the first side and the electrical circuit being disposed on the second side of the substrate, a fluid ejection device mounted on the first side of the substrate, and at least one electrical connector electrically coupled to the electrical circuit and the fluid ejection device, wherein the electrical circuit includes a printed circuit board such that the printed circuit board and the substrate both have at least one fluid passage extending therethrough with the at least one fluid passage communicating with the first side of the substrate and the fluid ejection device.

Abstract: An inkjet printhead is provided with a high nozzle packing density. The printhead has ink feed holes for each firing chamber that are individually tuned such that the pressure drop from the reservoir to the firing chamber is held constant for all firing chambers on said printhead.

Abstract: An inkjet printhead assembly includes a carrier and a plurality of printhead dies. The carrier includes a substrate and an electrical circuit. The substrate has a first side and a second side such that the electrical circuit is disposed on the second side of the substrate. The printhead dies are each mounted on the first side of the substrate and electrically coupled to the electrical circuit Thus, the substrate provides support for the printhead dies while the substrate and the electrical circuit together accommodate fluidic and electrical routing to the printhead dies.

Abstract: A printhead including a printhead substrate having at least one opening for providing a fluid path through the substrate and a thin film membrane formed on a second surface of the substrate. The thin film membrane includes a plurality of fluid feed holes, each fluid feed hole is located over the opening in the substrate. The thin film membrane, which extends over the opening, also has a plurality of fluid ejection elements and a plurality of conductive leads to the fluid ejection elements. All portions of the fluid ejection elements and conductive leads overlie the substrate.

Abstract: A wide-array inkjet printhead assembly includes a carrier and a printhead die. The carrier includes a substrate and an electrical circuit. The substrate has a first side and a second side such that the electrical circuit is disposed on the second side of the substrate. The printhead die is mounted on the first side of the substrate and electrically coupled to the electrical circuit. Thus, electrical connection is established between the first side of the substrate and second side of the substrate.

Abstract: An inkjet printer prints swaths which overlap by, typically, one eighth of their width at each edge, each edge region having a reduced print density so that the combined density of the overlapping regions matches or exceeds that of non-overlapping regions. In a first embodiment, each edge region is printed with 50% printing density. In a second embodiment, the printing mask is modified so that each edge region comprises two sub-regions with differing print densities, e.g. a first outer sub-region with a printing density of 15% and a second sub-region with a printing density of 85%. In a third embodiment only one edge region has a reduced print density and comprises 3 sub-regions with different print densities, e.g. a first sub-region with a printing density of 6.75%, a second one with a printing density of 12.5% and a third one with a printing density of 25%.

Abstract: A wide-array inkjet printhead assembly includes a carrier and a printhead die. The carrier includes a substrate and an electrical circuit. The substrate has a first side and a second side such that the electrical circuit is disposed on the second side of the substrate. The printhead die is mounted on the first side of the substrate and electrically coupled to the electrical circuit. Thus, electrical connection is established between the first side of the substrate and second side of the substrate.

Abstract: A process for handling and storing surface-mount, encapsulated flip-chip carrier modules to prevent the formation of amoeba-like solder bridges between the flip-chip C4 connections along the boundary between the encapsulant and the chip surface and/or between the encapsulant and the chip carrier substrate surface. The concentration of free moisture in the encapsulant is maintained below a predetermined safe limit during reflow heating used to mount the modules on a circuit board.

Abstract: A process for handling and storing surface-mount, encapsulated flip-chip carrier modules to prevent the formation of amoeba-like solder bridges between the flip-chip C4 connections along the boundary between the encapsulant and the chip surface and/or between the encapsulant and the chip carrier substrate surface. The concentration of free moisture in the encapsulant is maintained below a predetermined safe limit during reflow heating used to mount the modules on a circuit board.

Abstract: An apparatus for lapping the edges of a metal foil tape to remove burrs. A pair of coaxial counter-rotating wheels have facing annular abrasive surfaces which are spaced apart a distance less than the width of the tape. The tape is drawn between the wheels, generally along the wheel diameters, with the tape edges in engagement with the abrasive surfaces. The peripheral velocity of the wheels is substantially greater than the lineal speed of the tape so that the tape edges are polished substantially at right angles to the plane of the tape.