Patents by Inventor Lee J. Millette

Lee J. Millette has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6350387
    Abstract: A multilayer rigid flex printed circuit board wherein the board laminate comprises a basestock composite containing a flexible core, formed by laminating a first conductive layer to a flexible insulator layer, a second insulator layer affixed to the basestock, said second insulator layer having a cutout region proximate to the flexible core of the basestock composite to expose a portion of said first conducting layer on said flexible core, a second conductive layer attached to said second insulator layer said second conductive layer having a cutout region proximate to the flexible core of the basestock composite, and a photo-imageable soldermask applied to the exposed portion said first conducting layer, and to the second conductive layer, wherein said photoimageable soldermask allows for photo definition of openings on the conductive layers to which it is applied.
    Type: Grant
    Filed: March 1, 1999
    Date of Patent: February 26, 2002
    Assignee: Teledyne Industries, Inc.
    Inventors: A. Roland Caron, Sandra L. Jean, James E. Keating, Robert S. Larmouth, Lee J. Millette
  • Publication number: 20010010303
    Abstract: A multilayer rigid flex printed circuit board wherein the board laminate comprises a basestock composite containing a flexible core, formed by laminating a first conductive layer to a flexible insulator layer, a second insulator layer affixed to the basestock, said second insulator layer having a cutout region proximate to the flexible core of the basestock composite to expose a portion of said first conducting layer on said flexible core, a second conductive layer attached to said second insulator layer said second conductive layer having a cutout region proximate to the flexible core of the basestock composite, and a photo-imageable soldermask applied to the exposed portion said first conducting layer, and to the second conductive layer, wherein said photoimageable soldermask allows for photo definition of openings on the conductive layers to which it is applied.
    Type: Application
    Filed: March 1, 1999
    Publication date: August 2, 2001
    Inventors: A. ROLAND CARON, SANDRA L. JEAN, JAMES E. KEATING, ROBERT S. LARMOUTH, LEE J. MILLETTE
  • Patent number: 6246009
    Abstract: A novel basestock composite comprising two copper conducting sheets bonded to insulator layers comprised of fiberglass sheets impregnated with an adhesive such as epoxy, wherein the insulator layers are both affixed to a release layer which is not coextensive with the borders of the insulator layers such that when the basestock is cut at a point internal to its borders and into the release layer the two basestock composites can be separated.
    Type: Grant
    Filed: June 8, 1998
    Date of Patent: June 12, 2001
    Assignee: Teledyne Industries, Inc.
    Inventors: Lee J. Millette, A. Roland Caron, Joseph A. Thoman
  • Patent number: 5997983
    Abstract: A rigid flex printed circuit board wherein the flex section of said board comprises a basestock composite with edges formed by laminating a conductive layer to a flexible insulator layer, the conductor layer containing at least one conductive pathway and the flexible insulator layer comprises fibers dispersed in a matrix polymer. The fibers are oriented with respect to the conductive pathway so that the conductive pathway is substantially non-aligned with said fibers, substantially along an entirety of the conductive pathway in the flex section so as to be flexible.
    Type: Grant
    Filed: May 30, 1997
    Date of Patent: December 7, 1999
    Assignee: TeledyneIndustries, Inc.
    Inventors: A. Roland Caron, Sandra L. Jean, James E. Keating, Robert S. Larmouth, Lee J. Millette
  • Patent number: 5877940
    Abstract: Multilayer rigid/flex printed circuits are fabricated from a novel basestock composite (10) comprising two copper conducting sheets (12, 14), bonded to insulator layers (16, 18) comprised of fiberglass sheets impregnated with an adhesive such as epoxy, wherein the insulator layers (16, 18) are both affixed to a release layer (20) is not coextensive with the borders of the insulator layers, then can the basestock composite be imaged and etched on the conductor layers to form conductor patterns (22) and the basestock can be cut at a point (24) internal to its borders and into the release layer (20) thereby separating two imaged and etched conductor layers (22), along with removal of the release material from the insulating layer.
    Type: Grant
    Filed: May 31, 1996
    Date of Patent: March 2, 1999
    Assignee: Teledyne Industries Inc.
    Inventors: Lee J. Millette, A. Roland Caron, Joseph A. Thoman
  • Patent number: 5723205
    Abstract: A multilayer rigid flex printed circuit board, wherein the board laminate comprises a double-sided basestock composite, formed by laminating two conducting sheets (12 and 14) to an insulating layer, said insulator layer contacting a flexible core (20), a second insulator layer (24 and 26) affixed to each side of the basestock, said insulator having a cutout region proximate to the flexible core of the basestock composite, a flexible layer (28 and 30) affixed to said cutout regions with an adhesive, wherein said flexible layer contacts the conducting layers and abuts and overlaps a portion of the second insulator layer such that upon stacking of the board laminate a hollow region (32) is produced as between the stacked laminate sections.
    Type: Grant
    Filed: September 6, 1996
    Date of Patent: March 3, 1998
    Assignee: Teledyne Industries, Inc.
    Inventors: Lee J. Millette, A. Roland Caron, Joseph A. Thoman
  • Patent number: 5591519
    Abstract: Multilayer rigid flex printed circuits are fabricated from a novel basestock composite comprising two copper conducting sheets, bonded to insulator layers comprised of fiberglass sheets impregnated with an adhesive such as epoxy, wherein the insulator layers are both affixed to Kapton layers wherein said Kapton layers are not coextensive with the borders of the insulator layers. The basestock composite can then be imaged and etched on the conductor layers to form conductor patterns, laminated or coated with a coverlay of dielectric material, and the basestock can be cut at a point internal to its borders and into the Kapton layers thereby separating two imaged and etched conductor layers.
    Type: Grant
    Filed: May 25, 1995
    Date of Patent: January 7, 1997
    Assignee: Teledyne Industries, Inc.
    Inventors: A. Roland Caron, Lee J. Millette, John G. King
  • Patent number: 5505321
    Abstract: Multilayer rigid flex printed circuits are fabricated from a novel basestock composite comprising two copper conducting sheets, bonded to insulator layers comprised of fiberglass sheets impregnated with an adhesive such as epoxy, wherein the insulator layers are both affixed to Kapton layers wherein said Kapton layers are not coextensive with the borders of the insulator layers. The basestock composite can then be imaged and etched on the conductor layers to form conductor patterns, laminated or coated with a coverlay of dielectric material, and the basestock can be cut at a point internal to its borders and into the Kapton layers thereby separating two imaged and etched conductor layers.
    Type: Grant
    Filed: December 5, 1994
    Date of Patent: April 9, 1996
    Assignee: Teledyne Industries, Inc.
    Inventors: A. Roland Caron, Lee J. Millette, John G. King