Patents by Inventor Leena P. Buchwalter
Leena P. Buchwalter has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20120091585Abstract: A laser release and glass chip removal process for a integrated circuit module avoiding carrier edge cracking is provided.Type: ApplicationFiled: December 6, 2011Publication date: April 19, 2012Applicant: International Business Machines CorporationInventors: Leena P. Buchwalter, Paul S. Andry, Matthew J. Farinelli, Sherif A. Goma, Raymond R. Horton, Edmund J. Sprogis
-
Publication number: 20090032962Abstract: The present disclosure relates generally to semiconductor, integrated circuits, and particularly, but not by way of limitation, to centrifugal methods of filling high-aspect ratio vias and trenches with powders, pastes, suspensions of materials to act as any of a conducting, structural support, or protective member of an electronic component.Type: ApplicationFiled: October 8, 2008Publication date: February 5, 2009Applicant: International Business Machines Corporation (Yorktown)Inventors: Gareth Hougham, Leena P. Buchwalter, Stephen L. Buchwalter, Jon Casey, Claudius Feger, Matteo Flotta, Jeffrey D. Gelorme, Kathleen C. Hinge, Anurag Jain, Sung K. Kang, John U. Knickerbocker
-
Publication number: 20090032920Abstract: A laser release and glass chip removal process for a integrated circuit module avoiding carrier edge cracking is provided.Type: ApplicationFiled: July 3, 2008Publication date: February 5, 2009Applicant: International Business Machines CorporationInventors: Leena P. Buchwalter, Paul S. Andry, Matthew J. Farinelli, Sherif A. Goma, Raymond R. Horton, Edmund J. Sprogis
-
Patent number: 7199450Abstract: Sealing a via using a soventless, low viscosity, high temperature stable polymer or a high solids content polymer solution of low viscosity, where the polymeric material is impregnated within the via at an elevated temperature. A supply chamber is introduced to administer the polymeric material at an elevated temperature, typically at a temperature high enough to liquefy the polymeric material. The polymeric material is introduced through heated supply lines under force from a pump, piston, or a vacuum held within said supply chamber.Type: GrantFiled: May 13, 2005Date of Patent: April 3, 2007Assignee: International Business Machines CorporationInventors: Jon A. Casey, Michael Berger, Leena P. Buchwalter, Donald F. Canaperi, Raymond R. Horton, Anurag Jain, Eric D. Perfecto, James A. Tornello
-
Patent number: 6593660Abstract: The present invention utilizes a reducing plasma treatment step to enhance the adhesion of a subsequently deposited inorganic barrier film to a copper wire or via present in a semiconductor interconnect structure such as a dual damascene structure. Interconnect structure including a material layer of Cu, Si and O, as essential elements, is formed between said copper wire or via and the inorganic barrier film.Type: GrantFiled: May 29, 2001Date of Patent: July 15, 2003Assignee: International Business Machines CorporationInventors: Leena P. Buchwalter, Barbara Luther, Paul D. Agnello, John P. Hummel, Terence Lawrence Kane, Dirk Karl Manger, Paul Stephen McLaughlin, Anthony Kendall Stamper, Yun Yu Wang
-
Patent number: 6577011Abstract: The present invention includes a multilevel air-gap-containing interconnect wiring structure including: a collection of interspersed line levels and via levels, the via levels and line levels containing conductive via and line features embedded in a dielectric having an air-gap and solid dielectric. The air-gap and solid dielectric includes (i) one or more solid dielectrics only in the shadows of the conductive features in overlying levels and (ii) a gaseous dielectric elsewhere in the structure. The collection of line levels and via levels are topped by a laminated thin, taut insulating cover layer having openings to selected conductive features in the topmost underlying line or via layer, and the openings are filled with conductive material connecting to terminal pad contacts on the insulating cover layer.Type: GrantFiled: November 17, 2000Date of Patent: June 10, 2003Assignee: International Business Machines CorporationInventors: Leena P. Buchwalter, Alessandro Cesare Callegari, Stephan Alan Cohen, Teresita Ordonez Graham, John P. Hummel, Christopher V. Jahnes, Sampath Purushothaman, Katherine Lynn Saenger, Jane Margaret Shaw
-
Publication number: 20010053591Abstract: The present invention utilizes a reducing plasma treatment step to enhance the adhesion of a subsequently deposited inorganic barrier film to a copper wire or via present in a semiconductor interconnect structure such as a dual damascene structure. Interconnect structure comprising a material layer of Cu, Si and O, as essential elements, is formed between said copper wire or via and the inorganic barrier film.Type: ApplicationFiled: May 29, 2001Publication date: December 20, 2001Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Leena P. Buchwalter, Barbara Luther, Paul D. Agnello, John P. Hummel, Terence Lawrence Kane, Dirk Karl Manger, Paul Stephen Mclaughlin, Anthony Kendall Stamper, Yun Yu Wang
-
Patent number: 6261951Abstract: The present invention utilizes a reducing plasma treatment step to enhance the adhesion of a subsequently deposited inorganic barrier film to a copper wire or via present in a semiconductor interconnect structure such as a dual damascene structure. Interconnect structure comprising a material layer of Cu, Si and O, as essential elements, is formed between said copper wire or via and the inorganic barrier film.Type: GrantFiled: December 27, 1999Date of Patent: July 17, 2001Assignee: International Business Machines CorporationInventors: Leena P. Buchwalter, Barbara Luther, Paul D. Agnello, John P. Hummel, Terence Lawrence Kane, Dirk Karl Manger, Paul Stephen McLaughlin, Anthony Kendall Stamper, Yun Yu Wang
-
Patent number: 6255217Abstract: The present invention utilizes a reducing plasma treatment step to enhance the adhesion of a subsequently deposited inorganic barrier film to a copper wire or via present in a semiconductor interconnect structure such as a dual damascene structure.Type: GrantFiled: January 4, 1999Date of Patent: July 3, 2001Assignee: International Business Machines CorporationInventors: Paul D. Agnello, Leena P. Buchwalter, John Hummel, Barbara Luther, Anthony K. Stamper
-
Patent number: 6184121Abstract: A method to achieve a very low effective dielectric constant in high performance back end of the line chip interconnect wiring and the resulting multilayer structure are disclosed. The process involves fabricating the multilayer interconnect wiring structure by methods and materials currently known in the state of the art of semiconductor processing; removing the intralevel dielectric between the adjacent metal features by a suitable etching process; applying a thin passivation coating over the exposed etched structure; annealing the etched structure to remove plasma damage; laminating an insulating cover layer to the top surface of the passivated metal features; optionally depositing an insulating environmental barrier layer on top of the cover layer; etching vias in the environmental barrier layer, cover layer and the thin passivation layer for terminal pad contacts; and completing the device by fabricating terminal input/output pads.Type: GrantFiled: July 9, 1998Date of Patent: February 6, 2001Assignee: International Business Machines CorporationInventors: Leena P. Buchwalter, Alessandro Cesare Callegari, Stephan Alan Cohen, Teresita Ordonez Graham, John P. Hummel, Christopher V. Jahnes, Sampath Purushothaman, Katherine Lynn Saenger, Jane Margaret Shaw
-
Patent number: 5340451Abstract: A process is disclosed for producing a metal-organic polymer combination by contacting the polymer with a plasma followed by an aqueous solution of a metal salt. In one embodiment a water or nitrous oxide plasma is used to treat a polyimide or a fluorinated polymer. The polymer is combined with a metal cation, the metal being a catalyst for a conventional electroless coating after which it is contacted with an electroless metal plating bath for the formation of electrical circuits and especially for plating high aspect ratio vias in microcircuits. Unlike the conventional electroless process, the cationic catalytic metal is not reduced to a zero valent metal catalyst prior to the application of the electroless metal coating solution.The process also improves the wettability of the polymer, especially the fluorinated polymer and is especially useful in improving the wettability of high aspect ratio vias.Type: GrantFiled: May 13, 1993Date of Patent: August 23, 1994Assignee: International Business Machines CorporationInventors: Leena P. Buchwalter, Stephen L. Buchwalter, Charles R. Davis, Ronald D. Goldblatt, John E. Heidenreich, III, Sharon L. Nunes, Jae M. Park, Richard R. Thomas, Domenico Tortorella, Luis M. Ferreiro, deceased
-
Patent number: 5133840Abstract: The surface modification of polyimide materials by a chemical process is disclosed to provide a variety of functional groups on the surface. The surface is treated to produce polyamic acid carboxyl groups which are subsequently reacted with epoxies, hydrazines, or alcohols. The carboxyl groups can be also be subjected to other organic reactions, such as reduction with metal hydrides and the like. The versatility and controllability of this process lends itself to promoting adhesion of the polyimide to similarly treated polyimides, other polymers and other substrates as well as combining with metals such as metal catalysts used for depositing conductors on non-conductive surfaces such as circuit boards.Type: GrantFiled: May 15, 1990Date of Patent: July 28, 1992Assignee: International Business Machines CorporationInventors: Leena P. Buchwalter, Stephen L. Buchwalter, Terrence R. O'Toole, Richard R. Thomas, Alfred Viehbeck