Patents by Inventor Lewis P. Bevans
Lewis P. Bevans has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11952194Abstract: A shipping system for shipping planar substrates includes a plurality of planar substrates stacked to form a pack and a plurality of interleaving material including substantially spherical beads positioned between the substrates of the pack and configured to carry a load. Substantially all of the beads have a diameter within 25% of Dmax, where Dmax is a diameter corresponding to a size of an opening of an upper limit sieve used in the shipping system. Also disclosed are a spacer for use in a shipping system for shipping planar substrates, a wrapped system for shipping planar substrates, a method of wrapping a system for shipping planar substrates, and a powder applicator.Type: GrantFiled: August 2, 2022Date of Patent: April 9, 2024Assignee: Vitro, S.A.B. de C.V.Inventors: Farzad Fareed, Erin A. Casci, Adam D. Polcyn, Lewis P. Bevans
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Patent number: 11673730Abstract: A shipping system for shipping planar substrates includes a plurality of planar substrates stacked to form a pack and a plurality of interleaving material including substantially spherical beads positioned between the substrates of the pack and configured to carry a load. Substantially all of the beads have a diameter within 25% of Dmax, where Dmax is a diameter corresponding to a size of an opening of an upper limit sieve used in the shipping system. Also disclosed are a spacer for use in a shipping system for shipping planar substrates, a wrapped system for shipping planar substrates, a method of wrapping a system for shipping planar substrates, and a powder applicator.Type: GrantFiled: September 1, 2021Date of Patent: June 13, 2023Assignee: Vitro, S.A.B. de C.V.Inventors: Farzad Behafarid, Erin A. Casci, Adam D. Polcyn, Lewis P. Bevans
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Publication number: 20220371805Abstract: A shipping system for shipping planar substrates includes a plurality of planar substrates stacked to form a pack and a plurality of interleaving material including substantially spherical beads positioned between the substrates of the pack and configured to carry a load. Substantially all of the beads have a diameter within 25% of Dmax, where Dmax is a diameter corresponding to a size of an opening of an upper limit sieve used in the shipping system. Also disclosed are a spacer for use in a shipping system for shipping planar substrates, a wrapped system for shipping planar substrates, a method of wrapping a system for shipping planar substrates, and a powder applicator.Type: ApplicationFiled: August 2, 2022Publication date: November 24, 2022Inventors: Farzad Behafarid, Erin A. Casci, Adam D. Polcyn, Lewis P. Bevans
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Patent number: 11434059Abstract: A shipping system for shipping planar substrates includes a plurality of planar substrates stacked to form a pack and a plurality of interleaving material including substantially spherical beads positioned between the substrates of the pack and configured to carry a load. Substantially all of the beads have a diameter within 25% of Dmax, where Dmax is a diameter corresponding to a size of an opening of an upper limit sieve used in the shipping system. Also disclosed are a spacer for use in a shipping system for shipping planar substrates, a wrapped system for shipping planar substrates, a method of wrapping a system for shipping planar substrates, and a powder applicator.Type: GrantFiled: September 22, 2017Date of Patent: September 6, 2022Assignee: Vitro S.A.B. de C.V.Inventors: Farzad Fareed, Erin A. Casci, Adam D. Polcyn, Lewis P. Bevans
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Publication number: 20210394987Abstract: A shipping system for shipping planar substrates includes a plurality of planar substrates stacked to form a pack and a plurality of interleaving material including substantially spherical beads positioned between the substrates of the pack and configured to carry a load. Substantially all of the beads have a diameter within 25% of Dmax, where Dmax is a diameter corresponding to a size of an opening of an upper limit sieve used in the shipping system. Also disclosed are a spacer for use in a shipping system for shipping planar substrates, a wrapped system for shipping planar substrates, a method of wrapping a system for shipping planar substrates, and a powder applicator.Type: ApplicationFiled: September 1, 2021Publication date: December 23, 2021Inventors: Farzad Behafarid, Erin A. Casci, Adam D. Polcyn, Lewis P. Bevans
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Patent number: 11161670Abstract: A shipping system for shipping planar substrates includes a plurality of planar substrates stacked to form a pack and a plurality of interleaving material including substantially spherical beads positioned between the substrates of the pack and configured to carry a load. Substantially all of the beads have a diameter within 25% of Dmax, where Dmax is a diameter corresponding to a size of an opening of an upper limit sieve used in the shipping system. Also disclosed are a spacer for use in a shipping system for shipping planar substrates, a wrapped system for shipping planar substrates, a method of wrapping a system for shipping planar substrates, and a powder applicator.Type: GrantFiled: January 24, 2020Date of Patent: November 2, 2021Assignee: Vitro, S.A.B. de C.V.Inventors: Farzad Behafarid, Erin A. Casci, Adam D. Polcyn, Lewis P. Bevans
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Patent number: 11124349Abstract: A shipping system for shipping planar substrates includes a plurality of planar substrates stacked to form a pack and a plurality of interleaving material including substantially spherical beads positioned between the substrates of the pack and configured to carry a load. Substantially all of the beads have a diameter within 25% of Dmax, where Dmax is a diameter corresponding to a size of an opening of an upper limit sieve used in the shipping system. Also disclosed are a spacer for use in a shipping system for shipping planar substrates, a wrapped system for shipping planar substrates, a method of wrapping a system for shipping planar substrates, and a powder applicator.Type: GrantFiled: September 22, 2017Date of Patent: September 21, 2021Assignee: Vitro, S.A.B. de C.V.Inventors: Farzad Behafarid, Erin A. Casci, Adam D. Polcyn, Lewis P. Bevans
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Publication number: 20200156845Abstract: A shipping system for shipping planar substrates includes a plurality of planar substrates stacked to form a pack and a plurality of interleaving material including substantially spherical beads positioned between the substrates of the pack and configured to carry a load. Substantially all of the beads have a diameter within 25% of Dmax, where Dmax is a diameter corresponding to a size of an opening of an upper limit sieve used in the shipping system. Also disclosed are a spacer for use in a shipping system for shipping planar substrates, a wrapped system for shipping planar substrates, a method of wrapping a system for shipping planar substrates, and a powder applicator.Type: ApplicationFiled: January 24, 2020Publication date: May 21, 2020Inventors: Farzad Behafarid, Erin A. Casci, Adam D. Polcyn, Lewis P. Bevans
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Patent number: 10611546Abstract: A shipping system for shipping planar substrates includes a plurality of planar substrates stacked to form a pack and a plurality of interleaving material including substantially spherical beads positioned between the substrates of the pack and configured to carry a load. Substantially all of the beads have a diameter within 25% of Dmax, where Dmax is a diameter corresponding to a size of an opening of an upper limit sieve used in the shipping system. Also disclosed are a spacer for use in a shipping system for shipping planar substrates, a wrapped system for shipping planar substrates, a method of wrapping a system for shipping planar substrates, and a powder applicator.Type: GrantFiled: September 22, 2017Date of Patent: April 7, 2020Assignee: Vitro, S.A.B. de C.V.Inventors: Farzad Behafarid, Erin A. Casci, Adam D. Polcyn, Lewis P. Bevans
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Publication number: 20180127186Abstract: A shipping system for shipping planar substrates includes a plurality of planar substrates stacked to form a pack and a plurality of interleaving material including substantially spherical beads positioned between the substrates of the pack and configured to carry a load. Substantially all of the beads have a diameter within 25% of Dmax, where Dmax is a diameter corresponding to a size of an opening of an upper limit sieve used in the shipping system. Also disclosed are a spacer for use in a shipping system for shipping planar substrates, a wrapped system for shipping planar substrates, a method of wrapping a system for shipping planar substrates, and a powder applicator.Type: ApplicationFiled: September 22, 2017Publication date: May 10, 2018Inventors: Farzad Behafarid, Erin A. Casci, Adam D. Polcyn, Lewis P. Bevans
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Publication number: 20180093810Abstract: A shipping system for shipping planar substrates includes a plurality of planar substrates stacked to form a pack and a plurality of interleaving material including substantially spherical beads positioned between the substrates of the pack and configured to carry a load. Substantially all of the beads have a diameter within 25% of Dmax, where Dmax is a diameter corresponding to a size of an opening of an upper limit sieve used in the shipping system. Also disclosed are a spacer for use in a shipping system for shipping planar substrates, a wrapped system for shipping planar substrates, a method of wrapping a system for shipping planar substrates, and a powder applicator.Type: ApplicationFiled: September 22, 2017Publication date: April 5, 2018Inventors: Farzad Behafarid, Erin A. Casci, Adam D. Polcyn, Lewis P. Bevans
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Publication number: 20180093812Abstract: A shipping system for shipping planar substrates includes a plurality of planar substrates stacked to form a pack and a plurality of interleaving material including substantially spherical beads positioned between the substrates of the pack and configured to carry a load. Substantially all of the beads have a diameter within 25% of Dmax, where Dmax is a diameter corresponding to a size of an opening of an upper limit sieve used in the shipping system. Also disclosed are a spacer for use in a shipping system for shipping planar substrates, a wrapped system for shipping planar substrates, a method of wrapping a system for shipping planar substrates, and a powder applicator.Type: ApplicationFiled: September 22, 2017Publication date: April 5, 2018Inventors: Farzad Behafarid, Erin A. Casci, Adam D. Polcyn, Lewis P. Bevans
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Publication number: 20180093811Abstract: A shipping system for shipping planar substrates includes a plurality of planar substrates stacked to form a pack and a plurality of interleaving material including substantially spherical beads positioned between the substrates of the pack and configured to carry a load. Substantially all of the beads have a diameter within 25% of Dmax, where Dmax is a diameter corresponding to a size of an opening of an upper limit sieve used in the shipping system. Also disclosed are a spacer for use in a shipping system for shipping planar substrates, a wrapped system for shipping planar substrates, a method of wrapping a system for shipping planar substrates, and a powder applicator.Type: ApplicationFiled: September 22, 2017Publication date: April 5, 2018Inventors: Farzad Behafarid, Erin A. Casci, Adam D. Polcyn, Lewis P. Bevans
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Publication number: 20180093813Abstract: A shipping system for shipping planar substrates includes a plurality of planar substrates stacked to form a pack and a plurality of interleaving material including substantially spherical beads positioned between the substrates of the pack and configured to carry a load. Substantially all of the beads have a diameter within 25% of Dmax, where Dmax is a diameter corresponding to a size of an opening of an upper limit sieve used in the shipping system. Also disclosed are a spacer for use in a shipping system for shipping planar substrates, a wrapped system for shipping planar substrates, a method of wrapping a system for shipping planar substrates, and a powder applicator.Type: ApplicationFiled: September 22, 2017Publication date: April 5, 2018Inventors: Farzad Behafarid, Erin A. Casci, Adam D. Polcyn, Lewis P. Bevans