Patents by Inventor Li-Jen Wu
Li-Jen Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240117342Abstract: An construction method of an embryonic chromosome signal library is provided. The construction method comprises obtaining an embryo and performing whole-genome amplification and next-generation sequencing to obtain a first chromosome signal; mapping the first chromosome signal to a chromosome reference signal to obtain a second chromosome signal; dividing the second chromosome signal within a predetermined interval range to obtain a third chromosome signal; and performing a regression correction on the sequencing read count (RC) of the third chromosome signal to obtain an embryonic chromosome signal library. Furthermore, a detection method and system of embryonic chromosomes are also provided. Thereby, the information comparison of the embryo chromosome signal library is used to determine whether the pre-implantation embryo is abnormal or not to achieve pre-implantation chromosome screening of pre-implantation embryos.Type: ApplicationFiled: October 2, 2023Publication date: April 11, 2024Inventors: LI-JEN SU, SHAO-PING WENG, YU-YU YEN, LI-CHING WU, HUI-YIN CHIU, JUI-HUNG KAO
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Publication number: 20240071911Abstract: A semiconductor device includes a first die having a first bonding layer; a second die having a second bonding layer disposed over and bonded to the first bonding layer; a plurality of bonding members, wherein each of the plurality of bonding members extends within the first bonding layer and the second bonding layer, wherein the plurality of bonding members includes a connecting member electrically connected to a first conductive pattern in the first die and a second conductive pattern in the second die, and a dummy member electrically isolated from the first conductive pattern and the second conductive pattern; and an inductor disposed within the first bonding layer and the second bonding layer. A method of manufacturing a semiconductor device includes bonding a first inductive coil of a first die to a second inductive coil of a second die to form an inductor.Type: ApplicationFiled: January 31, 2023Publication date: February 29, 2024Inventors: Harry-Haklay Chuang, Wen-Tuo Huang, Li-Feng Teng, Wei-Cheng Wu, Yu-Jen Wang
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Patent number: 11899368Abstract: A method of manufacturing a semiconductor device is as below. An exposed photoresist layer is developed using a developer supplied by a developer supplying unit. An ammonia gas by-product of the developer is discharged through a gas outlet of the developer supplying unit into a treating tool. The ammonia gas by-product is retained in the treating tool. A concentration of the ammonia gas by-product is monitored.Type: GrantFiled: August 9, 2022Date of Patent: February 13, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yu-Kai Chen, Chia-Hung Chung, Ko-Bin Kao, Su-Yu Yeh, Li-Jen Wu, Zhi-You Ke, Ming-Hung Lin
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Publication number: 20230264360Abstract: The present disclosure describes a method for replacing a photoresist (PR) bottle using a vehicle. An exemplary vehicle includes a processor configured to receive a request signal to replace a first PR bottle. The processor is also configured to transmit an order based on the request signal. The vehicle also includes a plurality of wheels configured to move the vehicle from the first location to a second location, and from the second location to the first location. The vehicle further includes a robotic arm configured to load, at the first location, the first PR bottle into a first container; load a second PR bottle in a second container; remove a cap from the second PR bottle and a socket from the first PR bottle; couple the socket of the first PR bottle to the second PR bottle; and unload the second PR bottle from the second container.Type: ApplicationFiled: May 1, 2023Publication date: August 24, 2023Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Oliver Yu, Huei-Chi Chiu, Shi-Ming Wang, Li-Jen Wu, Yu Kai Chen, Sharon Yang
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Patent number: 11679510Abstract: The present disclosure describes a method for replacing a photoresist (PR) bottle using a vehicle. An exemplary vehicle includes a processor configured to receive a request signal to replace a first PR bottle. The processor is also configured to transmit an order based on the request signal. The vehicle also includes a plurality of wheels configured to move the vehicle from the first location to a second location, and from the second location to the first location. The vehicle further includes a robotic arm configured to load, at the first location, the first PR bottle into a first container; load a second PR bottle in a second container; remove a cap from the second PR bottle and a socket from the first PR bottle; couple the socket of the first PR bottle to the second PR bottle; and unload the second PR bottle from the second container.Type: GrantFiled: December 7, 2020Date of Patent: June 20, 2023Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Oliver Yu, Huei-Chi Chiu, Shi-Ming Wang, Li-Jen Wu, Yu Kai Chen, Sharon Yang
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Publication number: 20220382161Abstract: A method of manufacturing a semiconductor device is as below. An exposed photoresist layer is developed using a developer supplied by a developer supplying unit. An ammonia gas by-product of the developer is discharged through a gas outlet of the developer supplying unit into a treating tool. The ammonia gas by-product is retained in the treating tool. A concentration of the ammonia gas by-product is monitored.Type: ApplicationFiled: August 9, 2022Publication date: December 1, 2022Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yu-Kai Chen, Chia-Hung Chung, Ko-Bin Kao, Su-Yu Yeh, Li-Jen Wu, Zhi-You Ke, Ming-Hung Lin
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Patent number: 11454891Abstract: A method of manufacturing a semiconductor device and a semiconductor processing system are provided. The method includes the following steps. A photoresist layer is formed on a substrate in a lithography tool. The photoresist layer is exposed in the lithography tool to form an exposed photoresist layer. The exposed photoresist layer is developed to form a patterned photoresist layer in the lithography tool by using a developer. An ammonia gas by-product of the developer is removed from the lithography tool.Type: GrantFiled: July 12, 2021Date of Patent: September 27, 2022Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yu-Kai Chen, Chia-Hung Chung, Ko-Bin Kao, Su-Yu Yeh, Li-Jen Wu, Zhi-You Ke, Ming-Hung Lin
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Publication number: 20220193580Abstract: A method for eliminating bubbles from a liquid dispensing system includes flowing a liquid containing bubbles into a liquid inlet of a tank from a filter to substantially fill the tank, wherein substantially all bubbles accumulate in an upper portion of the tank having a lateral dimension greater than a lateral dimension of a lower portion of the tank, and flowing the liquid into the tank comprises flowing the liquid through an inlet pipe extending at an acute angle relative to a horizontally-oriented axis of the tank. The method further includes flowing a liquid substantially free of bubbles out of the tank via a liquid outlet at the lower portion of the tank for dispensing to a substrate.Type: ApplicationFiled: March 9, 2022Publication date: June 23, 2022Inventors: Y. L. HUANG, Chin-Kun FANG, Li-Jen WU, Yu Kai CHEN
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Publication number: 20220082468Abstract: A system for detecting leakage of a liquid supply pipe includes a pipe casing for enclosing an end portion of the liquid supply pipe adjoined to a nozzle and a sensor system configured to detect presence of a liquid leaked from the liquid supply pipe at the end portion. The sensor system is in alignment with the end portion of the liquid supply pipe.Type: ApplicationFiled: November 23, 2021Publication date: March 17, 2022Inventors: Yu Kai CHEN, Li-Jen WU, Chin-Kun FANG, Ko-Bin KAO
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Patent number: 11273396Abstract: A system for dispensing a liquid includes a filter adapted to filter a liquid and to provide a filtered liquid at a liquid outlet of the filter, and a tank having a liquid inlet coupled to the liquid outlet of the filter via a first pipe. The tank includes an upper portion having a first lateral dimension and a lower portion having a second lateral dimension less than the first lateral dimension. The upper portion of the tank is above the liquid inlet of the tank.Type: GrantFiled: July 25, 2019Date of Patent: March 15, 2022Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Y. L. Huang, Chin-Kun Fang, Li-Jen Wu, Yu Kai Chen
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Patent number: 11240973Abstract: An artificially intelligent harvest and reuse system for planting vegetables has a first mechanic arm moving a plurality of planting plates around a first conveyor, a second conveyor, a first shelf and a second shelf. The planting plates are sent to a connecting conveyor for the grown vegetables thereon to be picked up by a second mechanic arm and further sent to a root cutting apparatus then to a packaging apparatus, while the empty planting plates are further sent to an exit end of the first conveyor and a third mechanic arm places nursery foams with sprouts from a storage area onto the empty planting plates. Then the refilled planting plates are sent back to the corresponding shelf via the second conveyor and placed back into the corresponding layers neatly by the first mechanic arm on a first distributing apparatus.Type: GrantFiled: April 23, 2020Date of Patent: February 8, 2022Assignee: Sunpower Grand Holdings Pte. Ltd.Inventors: Yu-Chien Wu, Li-Jen Wu, Hsin-Lan Wu
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Patent number: 11199466Abstract: A system for detecting leakage of a liquid supply pipe includes a pipe casing for enclosing an end portion of the liquid supply pipe adjoined to a nozzle and a sensor system configured to detect presence of a liquid leaked from the liquid supply pipe at the end portion. The sensor system is in alignment with the end portion of the liquid supply pipe.Type: GrantFiled: July 17, 2019Date of Patent: December 14, 2021Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Yu Kai Chen, Chin-Kun Fang, Ko-Bin Kao, Li-Jen Wu
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Publication number: 20210341843Abstract: A method of manufacturing a semiconductor device and a semiconductor processing system are provided. The method includes the following steps. A photoresist layer is formed on a substrate in a lithography tool. The photoresist layer is exposed in the lithography tool to form an exposed photoresist layer. The exposed photoresist layer is developed to form a patterned photoresist layer in the lithography tool by using a developer. An ammonia gas by-product of the developer is removed from the lithography tool.Type: ApplicationFiled: July 12, 2021Publication date: November 4, 2021Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yu-Kai Chen, Chia-Hung Chung, Ko-Bin Kao, Su-Yu Yeh, Li-Jen Wu, Zhi-You Ke, Ming-Hung Lin
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Patent number: 11061333Abstract: A method of manufacturing a semiconductor device and a semiconductor processing system are provided. The method includes the following steps. A photoresist layer is formed on a substrate in a lithography tool. The photoresist layer is exposed in the lithography tool to form an exposed photoresist layer. The exposed photoresist layer is developed to form a patterned photoresist layer in the lithography tool by using a developer. An ammonia gas by-product of the developer is removed from the lithography tool.Type: GrantFiled: February 26, 2018Date of Patent: July 13, 2021Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yu-Kai Chen, Chia-Hung Chung, Ko-Bin Kao, Su-Yu Yeh, Li-Jen Wu, Zhi-You Ke, Ming-Hung Lin
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Patent number: 11029603Abstract: Embodiments of the present disclosure describe a chemical replacement system and a method to automatically replace PR bottles. The chemical replacement system includes a computer system and a transfer module. The computer system can receive a request signal to replace one or more chemical containers and transmit a command to the transfer module. The transfer module, being controlled by the computer system, can include a holder configured to hold the one or more chemical containers (e.g., PR bottles); a door unit configured to open in response to the command; and a transfer unit configured to eject the holder in response to the command for replacement. The chemical replacement system can further include an automated vehicle configured to replace the one or more chemical containers in the ejected holder.Type: GrantFiled: December 19, 2018Date of Patent: June 8, 2021Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Yu Kai Chen, Forster Yuan, Ko-Bin Kao, Shi-Ming Wang, Su-Yu Yeh, Li-Jen Wu, Oliver Yu
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Patent number: 11004709Abstract: A method for monitoring gas in a wafer processing system is provided. The method includes producing an exhaust flow in an exhausting conduit from a processing chamber. The method further includes placing a gas sensor in fluid communication with a detection point located in the exhausting conduit via a sampling tube that passes through a through hole formed on the exhausting conduit. The detection point is located away from the through hole. The method also includes detecting a gas condition at the detection point with the gas sensor. In addition, the method also includes analyzing the gas condition detected by the gas sensor to determine if the gas condition in the exhausting conduit is in a range of values.Type: GrantFiled: September 11, 2018Date of Patent: May 11, 2021Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Wen-Chieh Hsieh, Su-Yu Yeh, Ko-Bin Kao, Chia-Hung Chung, Li-Jen Wu, Chun-Yu Chen, Hung-Ming Chen, Yong-Ting Wu
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Publication number: 20210086368Abstract: The present disclosure describes a method for replacing a photoresist (PR) bottle using a vehicle. An exemplary vehicle includes a processor configured to receive a request signal to replace a first PR bottle. The processor is also configured to transmit an order based on the request signal. The vehicle also includes a plurality of wheels configured to move the vehicle from the first location to a second location, and from the second location to the first location. The vehicle further includes a robotic arm configured to load, at the first location, the first PR bottle into a first container; load a second PR bottle in a second container; remove a cap from the second PR bottle and a socket from the first PR bottle; couple the socket of the first PR bottle to the second PR bottle; and unload the second PR bottle from the second container.Type: ApplicationFiled: December 7, 2020Publication date: March 25, 2021Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Oliver YU, Huei-Chi CHIU, Shi-Ming WANG, Li-Jen Wu, Yu Kai Chen, Sharon Yang
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Patent number: 10943802Abstract: The present disclosure describes a container for placing an object therein. The container includes a container body and a lid over the container body, a collision-preventing portion attached to one or more of the container body and the lid and configured to buffer an impact force, a pairing recognition mechanism configured to detect an object placed in the container body, and a liquid-detecting sensor configured to detect a leakage from the object.Type: GrantFiled: December 27, 2018Date of Patent: March 9, 2021Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Yu Kai Chen, Chia-Hung Chung, Ko-Bin Kao, Shi-Ming Wang, Su-Yu Yeh, Li-Jen Wu, Oliver Yu, Wen-Shiung Chen
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Patent number: 10857676Abstract: The present disclosure describes a method for replacing a photoresist (PR) bottle using a vehicle. An exemplary vehicle includes a processor configured to receive a request signal to replace a first PR bottle. The processor is also configured to transmit an order based on the request signal. The vehicle also includes a plurality of wheels configured to move the vehicle from the first location to a second location, and from the second location to the first location. The vehicle further includes a robotic arm configured to load, at the first location, the first PR bottle into a first container; load a second PR bottle in a second container; remove a cap from the second PR bottle and a socket from the first PR bottle; couple the socket of the first PR bottle to the second PR bottle; and unload the second PR bottle from the second container.Type: GrantFiled: July 13, 2018Date of Patent: December 8, 2020Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Oliver Yu, Huei-Chi Chiu, Shi-Ming Wang, Li-Jen Wu, Yu Kai Chen, Sharon Yang
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Publication number: 20200337249Abstract: An artificially intelligent harvest and reuse system for planting vegetables has a first mechanic arm moving a plurality of planting plates around a first conveyor, a second conveyor, a first shelf and a second shelf. The planting plates are sent to a connecting conveyor for the grown vegetables thereon to be picked up by a second mechanic arm and further sent to a root cutting apparatus then to a packaging apparatus, while the empty planting plates are further sent to an exit end of the first conveyor and a third mechanic arm places nursery foams with sprouts from a storage area onto the empty planting plates. Then the refilled planting plates are sent back to the corresponding shelf via the second conveyor and placed back into the corresponding layers neatly by the first mechanic arm on a first distributing apparatus.Type: ApplicationFiled: April 23, 2020Publication date: October 29, 2020Inventors: YU-CHIEN WU, LI-JEN WU, HSIN-LAN WU