Patents by Inventor Li-kuang Tan

Li-kuang Tan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200404807
    Abstract: In a heat sink module and a manufacturing method thereof, the method includes steps of: forming a heat dissipation fin set by aluminum extrusion process, wherein the heat dissipation fin set includes a plate, a plurality of fins extending from one side of the plate and being arranged spaced apart from one another, and a joint portion formed on the other side of the plate; placing the plate in a mold; injecting molten metal into the mold; forming a base by die-casting of the molten metal. The plate and the joint portion are wrapped by the base. The joint portion forms a connection structure including a bump and a notch fitted with the bump, so as to connect and fix the base and the heat dissipation fin set. The heat sink module has the strengthened connection structure and the fins with a superior aspect ratio.
    Type: Application
    Filed: September 5, 2020
    Publication date: December 24, 2020
    Inventors: Chun-Yang HUNG, Li-Kuang TAN
  • Publication number: 20200217595
    Abstract: A heat dissipation assembly includes a condenser, an evaporator, a vapor conduit, and a liquid conduit. The condenser has a condensing chamber therein. Two ends of the vapor conduit are respectively connected to the condenser and the evaporator. Two ends of the liquid conduit are respectively connected to the condenser and the evaporator. A geometric center of the liquid conduit in the condensing chamber is lower than or equal to a geometric center of the condensing chamber.
    Type: Application
    Filed: March 16, 2020
    Publication date: July 9, 2020
    Inventors: Wei-Fang WU, Li-Kuang TAN
  • Patent number: 10663231
    Abstract: A manufacturing method of a heat conducting device includes following steps: providing a first plate, which includes a plate body and at least a heat conducting element, wherein the plate body has at least an inserting end disposed corresponding to the heat conducting element and defining a tube, and the heat conducting element is mounted at the tube; providing a second plate, which has a first opening end; disposing a first wick structure on an internal wall of the heat conducting element and a bottom surface of the plate body; disposing a second wick structure on an internal wall of the second plate; and connecting the plate body to the first opening end so as to connect the first plate and the second plate to form a chamber. Accordingly, the heat conducting device has a higher heat conducting efficiency.
    Type: Grant
    Filed: June 6, 2017
    Date of Patent: May 26, 2020
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Li-Kuang Tan, Shih-Kang Lin
  • Publication number: 20200149821
    Abstract: A temperature plate device includes a plate body and a bent supporting structure. The plate body includes a first plate and a second plate. A chamber is defined by the first plate and the second plate. The first plate has a first step section. The second plate has a second step section corresponding to the first step section. The bent supporting structure is connected to and traverses the first step section between the first step section and the second step section.
    Type: Application
    Filed: January 14, 2020
    Publication date: May 14, 2020
    Inventors: LI-KUANG TAN, SHIH-KANG LIN, KUO-YING LEE, TING-YUAN WU, CHAO-WEN LU
  • Patent number: 10631435
    Abstract: A heat dissipation assembly includes a condenser, an evaporator, a vapor conduit, and a liquid conduit. The condenser has a condensing chamber therein. Two ends of the vapor conduit are respectively connected to the condenser and the evaporator. Two ends of the liquid conduit are respectively connected to the condenser and the evaporator. A geometric center of the liquid conduit in the condensing chamber is lower than or equal to a geometric center of the condensing chamber.
    Type: Grant
    Filed: October 27, 2016
    Date of Patent: April 21, 2020
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Wei-Fang Wu, Li-Kuang Tan
  • Publication number: 20190339023
    Abstract: A heat-dissipating device includes a condenser and an evaporator. The condenser includes a shell and a main capillary wick. The shell has a chamber and a through hole communicating with the chamber. The main capillary wick is disposed in the chamber. The evaporator has an evaporating section, a gas conduit and a liquid conduit. The evaporating section has a gas cavity, and the liquid conduit communicating with the chamber and filling with a liquid. The liquid conduit having a hole communicating with the gas cavity is inserted in the gas conduit and the gas cavity. A stepped area is formed between the liquid conduit and the chamber for gathering the liquid flowing into the liquid conduit.
    Type: Application
    Filed: July 16, 2019
    Publication date: November 7, 2019
    Inventors: Yu-Hung HUANG, Li-Kuang TAN, Wei-Fang WU
  • Publication number: 20180263140
    Abstract: In a heat sink module and a manufacturing method thereof, the method includes steps of: forming a heat dissipation fin set by aluminum extrusion process, wherein the heat dissipation fin set includes a plate, a plurality of fins extending from one side of the plate and being arranged spaced apart from one another, and a joint portion formed on the other side of the plate; placing the plate in a mold; injecting molten metal into the mold; forming a base by die-casting of the molten metal. The plate and the joint portion are wrapped by the base. The joint portion forms a connection structure including a bump and a notch fitted with the bump, so as to connect and fix the base and the heat dissipation fin set. The heat sink module has the strengthened connection structure and the fins with a superior aspect ratio.
    Type: Application
    Filed: May 9, 2018
    Publication date: September 13, 2018
    Inventors: Chun-Yang HUNG, Li-Kuang TAN
  • Publication number: 20180063994
    Abstract: A heat dissipation assembly includes a condenser, an evaporator, a vapor conduit, and a liquid conduit. The condenser has a condensing chamber therein. Two ends of the vapor conduit are respectively connected to the condenser and the evaporator. Two ends of the liquid conduit are respectively connected to the condenser and the evaporator. A geometric center of the liquid conduit in the condensing chamber is lower than or equal to a geometric center of the condensing chamber.
    Type: Application
    Filed: October 27, 2016
    Publication date: March 1, 2018
    Inventors: Wei-Fang WU, Li-Kuang TAN
  • Publication number: 20180054920
    Abstract: In a heat sink module and a manufacturing method thereof, the method includes steps of: forming a heat dissipation fin set by aluminum extrusion process, wherein the heat dissipation fin set includes a plate, a plurality of fins extending from one side of the plate and being arranged spaced apart from one another, and a joint portion formed on the other side of the plate; placing the plate in a mold; injecting molten metal into the mold; forming a base by die-casting of the molten metal. The plate and the joint portion are wrapped by the base. The joint portion forms a connection structure including a bump and a notch fitted with the bump, so as to connect and fix the base and the heat dissipation fin set. The heat sink module has the strengthened connection structure and the fins with a superior aspect ratio.
    Type: Application
    Filed: October 27, 2016
    Publication date: February 22, 2018
    Inventors: Chun-Yang HUNG, Li-Kuang TAN
  • Publication number: 20170363366
    Abstract: A temperature plate includes a plate body and a supporting structure. The plate body has a first plate and a second plat, and a vacuum chamber is defined by the first plate and the second plate. The first plate has a first surface away from the vacuum chamber. The plate body is bent to form a bent portion with the first surface to be a compressive side, and the supporting structure is disposed corresponding to the bent portion. This configuration can prevent the deformation as bending the temperature plate and enhance the heat dissipation performance. In addition, a heat dissipation device adapting the temperature plate is also disclosed, and the heat dissipation device further includes a cooling fin assembly disposed on the first surface of the plate body.
    Type: Application
    Filed: June 15, 2017
    Publication date: December 21, 2017
    Inventors: Li-Kuang TAN, Shih-Kang LIN
  • Patent number: 9847273
    Abstract: A clip for fixing a heat sink on a retaining bracket includes an elastic supporter, an operating member, a movable fastener and a fixing bar. Two ends of the elastic supporter have a connecting portion and a first buckle portion, respectively. The operating member has a resisting portion, a pivot portion and an operating bar. The pivot portion pivots to the connecting portion. The movable fastener installs on the resisting portion and the connecting portion, and includes two sliding slots, a resisting surface and a second buckle portion. The resisting portion has an arc surface for resisting against the resisting surface. The distance between the apex of the arc surface and the pivot portion is the largest distance between the arc surface and the pivot portion. When the clip is locked, the junction of the resisting portion and the resisting surface excludes the apex of the arc surface.
    Type: Grant
    Filed: July 18, 2013
    Date of Patent: December 19, 2017
    Assignee: Delta Electronics, Inc.
    Inventors: Yu-Hsien Lin, Li-Kuang Tan
  • Publication number: 20170356694
    Abstract: A manufacturing method of a heat conducting device includes following steps: providing a first plate, which includes a plate body and at least a heat conducting element, wherein the plate body has at least an inserting end disposed corresponding to the heat conducting element and defining a tube, and the heat conducting element is mounted at the tube; providing a second plate, which has a first opening end; disposing a first wick structure on an internal wall of the heat conducting element and a bottom surface of the plate body; disposing a second wick structure on an internal wall of the second plate; and connecting the plate body to the first opening end so as to connect the first plate and the second plate to form a chamber. Accordingly, the heat conducting device has a higher heat conducting efficiency.
    Type: Application
    Filed: June 6, 2017
    Publication date: December 14, 2017
    Inventors: Li-Kuang TAN, Shih-Kang LIN
  • Publication number: 20150129175
    Abstract: A heat-dissipating device includes a condenser and an evaporator. The condenser includes a shell and a main capillary wick. The shell has a chamber and a through hole communicating with the chamber. The main capillary wick is disposed in the chamber. The evaporator has an evaporating section, a gas conduit and a liquid conduit. The evaporating section has a gas cavity, and the liquid conduit communicating with the chamber and filling with a liquid. The liquid conduit having a hole communicating with the gas cavity is inserted in the gas conduit and the gas cavity. A stepped area is formed between the liquid conduit and the chamber for gathering the liquid flowing into the liquid conduit.
    Type: Application
    Filed: December 31, 2013
    Publication date: May 14, 2015
    Applicant: DELTA ELECTRONICS, INC.
    Inventors: Yu-Hung HUANG, Li-Kuang TAN, Wei-Fang WU
  • Publication number: 20140262148
    Abstract: A clip for fixing a heat sink on a retaining bracket includes an elastic supporter, an operating member, a movable fastener and a fixing bar. Two ends of the elastic supporter have a connecting portion and a first buckle portion, respectively. The operating member has a resisting portion, a pivot portion and an operating bar. The pivot portion pivots to the connecting portion. The movable fastener installs on the resisting portion and the connecting portion, and includes two sliding slots, a resisting surface and a second buckle portion. The resisting portion has an arc surface for resisting against the resisting surface. The distance between the apex of the arc surface and the pivot portion is the largest distance between the arc surface and the pivot portion. When the clip is locked, the junction of the resisting portion and the resisting surface excludes the apex of the arc surface.
    Type: Application
    Filed: July 18, 2013
    Publication date: September 18, 2014
    Inventors: Yu-Hsien LIN, Li-Kuang TAN
  • Patent number: 8503179
    Abstract: A cooling system including several air jet elements, a heat exchange assembly and a frame is provided. The cooling system is applied to a rack server configured to receive a plurality of electronic assemblies. The air jet elements receive a high-pressure air and convert the high-pressure air into a low-temperature air. The heat exchange assembly is disposed in the frame and is connected to the air jet elements so as to perform a heat exchange between the low-temperature air and a high-temperature air generated by the rack server so as to lower the temperature of the high-temperature air. The frame is applied to accommodate the heat exchange assembly.
    Type: Grant
    Filed: January 26, 2011
    Date of Patent: August 6, 2013
    Assignee: Delta Electronics, Inc.
    Inventors: Li-Kuang Tan, Yu-Hung Huang
  • Publication number: 20110182028
    Abstract: A cooling system including several air jet elements, a heat exchange assembly and a frame is provided. The cooling system is applied to a rack server configured to receive a plurality of electronic assemblies. The air jet elements receive a high-pressure air and convert the high-pressure air into a low-temperature air. The heat exchange assembly is disposed in the frame and is connected to the air jet elements so as to perform a heat exchange between the low-temperature air and a high-temperature air generated by the rack server so as to lower the temperature of the high-temperature air. The frame is applied to accommodate the heat exchange assembly.
    Type: Application
    Filed: January 26, 2011
    Publication date: July 28, 2011
    Applicant: DELTA ELECTRONICS, INC.
    Inventors: Li-Kuang TAN, Yu-Hung HUANG
  • Publication number: 20100322764
    Abstract: A cooling fan with high heat-dissipating performance includes a plurality of blades; and a frame for receiving the blades therein, wherein the frame has a reduced height for exposing the blades to outside of the frame so as to allow air to enter into the frame via a top portion and a peripheral portion of the blades to improve air introduction and heat dissipating efficiency of the cooling fan. A cover may be mounted to a top surface of the frame, and formed with a plurality of openings for allowing air to enter into the frame through the openings; such an arrangement cam effectively enhance air intake and working efficiency of the cooling fan.
    Type: Application
    Filed: August 27, 2010
    Publication date: December 23, 2010
    Inventors: Wen-Shi HUANG, Kuo-Cheng LIN, Li-Kuang TAN, Tsung-Yu LEI, Wen-Ha LIU
  • Patent number: 7802965
    Abstract: A cooling fan with high heat-dissipating performance includes a plurality of blades; and a frame for receiving the blades therein, wherein the frame has a reduced height for exposing the blades to outside of the frame so as to allow air to enter into the frame via a top portion and a peripheral portion of the blades to improve air introduction and heat dissipating efficiency of the cooling fan. A cover may be mounted to a top surface of the frame, and formed with a plurality of openings for allowing air to enter into the frame through the openings; such an arrangement cam effectively enhance air intake and working efficiency of the cooling fan.
    Type: Grant
    Filed: January 17, 2006
    Date of Patent: September 28, 2010
    Assignee: Delta Electronics Inc.
    Inventors: Wen-Shi Huang, Kuo-Cheng Lin, Li-Kuang Tan, Tsung-Yu Lei, Wen-Ha Liu
  • Patent number: 7753568
    Abstract: A light-emitting diode (LED) assembly includes a heat dissipation device (30) and at least one LED (10). The heat dissipation device has a connecting surface (33) with circuitry (20) being directly formed thereon. The at least one LED is electrically connected with the circuitry, and is maintained in thermal and mechanical contact with the connecting surface to dissipate heat generated thereby through the heat dissipation device. A method for making the LED assembly includes steps of: (A) providing a heat dissipation device having a surface for the LED to be mounted thereon; (B) insulating the surface; (C) forming circuitry on the insulated surface directly to obtain a connecting surface; (D) attaching the LED to the connecting surface of the heat dissipation device thermally and mechanically, and connecting the LED with the circuitry electrically to form the LED assembly.
    Type: Grant
    Filed: January 23, 2007
    Date of Patent: July 13, 2010
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Tseng-Hsiang Hu, Yeu-Lih Lin, Li-Kuang Tan
  • Patent number: 7598535
    Abstract: An LED assembly includes a packaged LED module (30) and a heat dissipation device (50). The LED module includes at least an LED die therein and a plurality of conductive pins (32, 34) extending downwardly from a bottom portion thereof. The heat dissipation device is thermally and electrically connected with the at least an LED die. The heat dissipation device defines at least a mounting hole (542) therein. At least one of the conductive pins is fittingly received in the at least a mounting hole and thermally and electrically connects with the heat dissipation device.
    Type: Grant
    Filed: July 20, 2006
    Date of Patent: October 6, 2009
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Tseng-Hsiang Hu, Yeu-Lih Lin, Li-Kuang Tan