Abstract: A light emitting diode (LED) assembly includes at least an LED (102), a substrate (20), a heat dissipation apparatus (40) and at least one securing frame (30). The substrate forms a set of electrical circuitry (22) thereon. The at least one LED is arranged on a side of the substrate and electrically connected with the set of electrical circuitry of the substrate. The heat dissipation apparatus is arranged on an opposite side of the substrate. The securing frame includes a pressing portion (32) securing the substrate with the heat dissipation apparatus detachably.

Abstract: An LED assembly includes a packaged LED module (30) and a heat dissipation device (50). The LED module includes at least an LED die therein and a plurality of conductive pins (32, 34) extending downwardly from a bottom portion thereof. The heat dissipation device is thermally and electrically connected with the at least an LED die. The heat dissipation device defines at least a mounting hole (542) therein. At least one of the conductive pins is fittingly received in the at least a mounting hole and thermally and electrically connects with the heat dissipation device.

Abstract: A heat dissipation assembly used for dissipating heat from heat generating electronic components includes a mounting frame, a heat sink and a fan duct. The heat sink is positioned on the mounting frame; the fan duct is attached to the heat sink. The fan duct includes a plurality of first clamping portions, and the mounting frame includes a plurality of second clamping portions corresponding to the first clamping portions. The first clamping portions engage with the second clamping portions to fix the fan duct and the heat sink onto the mounting frame.

Abstract: A light-emitting diode (LED) assembly and a method for fabrication thereof are disclosed. The LED assembly includes a heat-absorbing member in which a working fluid is provided, an LED die (60) directly attached to the heat-absorbing member, and a heat-dissipating member thermally attached to the heat-absorbing member. The heat-absorbing member absorbs heat via the working fluid from the LED die and transfers the heat to the heat-dissipating member for dissipation. The method involves directly attaching the LED die to the heat-absorbing member.

Abstract: This specification discloses a heat sink for coolers. The heat sink contains a heat conductive element, a heat dissipating shell covering over the heat conductive element, and a plurality of heat dissipating fins installed on the heat dissipating shell. The heat conductive element is comprised of a heat conductive plate and a heat conductive block installed at the center thereof. The area of the lower surface of the heat conductive block is greater than that of the upper surface thereof. When the lower surface of the heat conductive plate is in contact with a device that needs heat dissipation, the heat conductive block increases the heat conducting volume at the center of the heat conductive plate, so that the heat produced by the device can be released at an optimal rate.

Abstract: A heat sink for coolers is provided. The heat sink contains a heat conductive element, a heat dissipating shell covering over the heat conductive element, and a plurality of heat dissipating fins installed on the heat dissipating shell. The heat conductive element includes a heat conductive plate and a heat conductive block installed at the center thereof. The area of the bottom surface of the heat conductive block is greater than that of the topmost surface thereof. When the lower surface of the heat conductive plate is in contact with a device that needs heat dissipation, the heat conductive block increases the heat conducting volume at the center of the heat conductive plate, so that the heat produced by the device can be released at an optimal rate.

Abstract: A cooling fan with high heat-dissipating performance includes a plurality of blades; and a frame for receiving the blades therein, wherein the frame has a reduced height for exposing the blades to outside of the frame so as to allow air to enter into the frame via a top portion and a peripheral portion of the blades to improve air introduction and heat dissipating efficiency of the cooling fan. A cover may be mounted to a top surface of the frame, and formed with a plurality of openings for allowing air to enter into the frame through the openings; such an arrangement cam effectively enhance air intake and working efficiency of the cooling fan.

Abstract: A cooling fan with high heat-dissipating performance includes a plurality of blades; and a frame for receiving the blades therein, wherein the frame has a reduced height for exposing the blades to outside of the frame so as to allow air to enter into the frame via a top portion and a peripheral portion of the blades to improve air introduction and heat dissipating efficiency of the cooling fan. A cover may be mounted to a top surface of the frame, and formed with a plurality of openings for allowing air to enter into the frame through the openings; such an arrangement cam effectively enhance air intake and working efficiency of the cooling fan.

Abstract: A heat dissipation module includes an air conveying device, a first member and a second member. The first member has at least one air inlet, and the second member is formed with a heat transfer enhancing structure on its surface and mounted on a heating element. The second member is coupled to the first member to form a cooling chamber having at least one air vent, and allows the heat transfer enhancing structure to be received therein. The air conveying device draws airflow into and out of the cooling chamber, and the heat transfer enhancing structure defines at least one passage along which the airflow propagates in the cooling chamber.

Abstract: A heat-dissipating assembly utilizes a heat conductor having a high thermal conductivity to stagedly and effectively dissipate the heat to the surrounding environment. The heat-dissipating assembly includes a plurality of heat portions, at least one fan being disposed on the surface or side of the heat-dissipating portions, and a heat conductor having a high thermal conductivity connected within the plurality of the heat-dissipating portions.

Abstract: A heat sink comprises a plurality of heat-dissipating units, and each heat-dissipating unit provides a base and a plurality of parallel fins disposed thereon, respectively. The fins of any two adjacent heat-dissipating units extend in different directions.

Abstract: A fastening device is used to tightly attach the heat sink on an electronic element. The fastening device includes an elastic arm, a first latch element and a second latch element. The elastic arm has a first axial part, a second axial part, and a press part. The first latch element is secured to one side of the socket for mounting the electronic element thereon and pivotally coupled to the first axial part, and the second latch element is pivotally coupled to the second axial part. As the elastic arm turns about the first latch element and crosses the heat sink, the second latch element is allowed to be fastened onto another side of the socket. Thus, the press part of the elastic arm would urge against the heat sink to enable the heat sink to be tightly attached on the electronic element.

Abstract: A heat dissipation module includes a fan and a heat sink. The shaft of the fan, made from materials with high thermal conductivity, has a first end and an opposite second end, with the first end penetrating a fan hub and connecting to a heating element. The heat sink is connected to the second end of the shaft.

Abstract: The invention discloses an annular heat-dissipating device formed by a plurality of fins combined together, all of which are arranged around a base, wherein one side of each of the plurality of fins is coupled to the base, respectively. The heat-dissipating device of the invention can greatly increase the heat-dissipating area so as to effectively dissipate heat generated from the electronic elements to the outside.

Abstract: A heat-dissipating assembly utilizes a heat conductor having a high thermal conductivity to stagedly and effectively dissipate the heat to the surrounding environment. The heat-dissipating assembly includes a plurality of heat portions, at least one fan being disposed on the surface or side of the heat-dissipating portions, and a heat conductor having a high thermal conductivity connected within the plurality of the heat-dissipating portions.

Abstract: This specification discloses a heat sink for coolers. The heat sink contains a heat conductive element, a heat dissipating shell covering over the heat conductive element, and a plurality of heat dissipating fins installed on the heat dissipating shell. The heat conductive element is comprised of a heat conductive plate and a heat conductive block installed at the center thereof. The area of the lower surface of the heat conductive block is greater than that of the upper surface thereof. When the lower surface of the heat conductive plate is in contact with a device that needs heat dissipation, the heat conductive block increases the heat conducting volume at the center of the heat conductive plate, so that the heat produced by the device can be released at an optimal rate.

Abstract: A fastening device is used to tightly attach the heat sink on an electronic element. The fastening device includes an elastic arm, a first latch element and a second latch element. The elastic arm has a first axial part, a second axial part, and a press part. The first latch element is secured to one side of the socket for mounting the electronic element thereon and pivotally coupled to the first axial part, and the second latch element is pivotally coupled to the second axial part. As the elastic arm turns about the first latch element and crosses the heat sink, the second latch element is allowed to be fastened onto another side of the socket. Thus, the press part of the elastic arm would urge against the heat sink to enable the heat sink to be tightly attached on the electronic element.

Abstract: A cooling fan with high heat-dissipating performance includes a plurality of blades; and a frame for receiving the blades therein, wherein the frame has a reduced height for exposing the blades to outside of the frame so as to allow air to enter into the frame via a top portion and a peripheral portion of the blades to improve air introduction and heat dissipating efficiency of the cooling fan. A cover may be mounted to a top surface of the frame, and formed with a plurality of openings for allowing air to enter into the frame through the openings; such an arrangement cam effectively enhance air intake and working efficiency of the cooling fan.