Patents by Inventor Li-Ting Chen

Li-Ting Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250107207
    Abstract: A semiconductor structure includes a semiconductor substrate; fin active regions protruded above the semiconductor substrate; and a gate stack disposed on the fin active regions; wherein the gate stack includes a high-k dielectric material layer, and various metal layers disposed on the high-k dielectric material layer. The gate stack has an uneven profile in a sectional view with a first dimension D1 at a top surface, a second dimension D2 at a bottom surface, and a third dimension D3 at a location between the top surface and the bottom surface, and wherein each of D1 and D2 is greater than D3.
    Type: Application
    Filed: December 9, 2024
    Publication date: March 27, 2025
    Inventors: Chi-Sheng LAI, Wei-Chung SUN, Yu-Bey WU, Yuan-Ching PENG, Yu-Shan LU, Li-Ting CHEN, Shih-Yao LIN, Yu-Fan PENG, Kuei-Yu KAO, Chih-Han LIN, Jing Yi YAN, Pei-Yi LIU
  • Patent number: 12166096
    Abstract: A semiconductor structure includes a semiconductor substrate; fin active regions protruded above the semiconductor substrate; and a gate stack disposed on the fin active regions; wherein the gate stack includes a high-k dielectric material layer, and various metal layers disposed on the high-k dielectric material layer. The gate stack has an uneven profile in a sectional view with a first dimension D1 at a top surface, a second dimension D2 at a bottom surface, and a third dimension D3 at a location between the top surface and the bottom surface, and wherein each of D1 and D2 is greater than D3.
    Type: Grant
    Filed: April 17, 2023
    Date of Patent: December 10, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chi-Sheng Lai, Yu-Fan Peng, Li-Ting Chen, Yu-Shan Lu, Yu-Bey Wu, Wei-Chung Sun, Yuan-Ching Peng, Kuei-Yu Kao, Shih-Yao Lin, Chih-Han Lin, Pei-Yi Liu, Jing Yi Yan
  • Publication number: 20240387397
    Abstract: An alignment structure for a semiconductor device and a method of forming same are provided. A method includes forming an isolation region over a substrate and forming an alignment structure over the isolation region. Forming the alignment structure includes forming a sacrificial gate electrode layer over the substrate and the isolation region. The sacrificial gate electrode layer is patterned to form a plurality of first sacrificial gates over the isolation region. At least one of the plurality of first sacrificial gates is reshaped. The at least one of the plurality of first sacrificial gates is disposed at an edge of the alignment structure in a plan view. A sidewall of the at least one of the plurality of first sacrificial gates comprises a notch at an interface between the at least one of the plurality of first sacrificial gates and the isolation region.
    Type: Application
    Filed: July 27, 2024
    Publication date: November 21, 2024
    Inventors: Chi-Sheng Lai, Wei-Chung Sun, Li-Ting Chen, Kuei-Yu Kao, Chih-Han Lin
  • Publication number: 20240379672
    Abstract: A device includes a plurality of fin structures that each protrude vertically upwards out of a substrate and each extend in a first direction in a top view. A gate structure is disposed over the fin structures. The gate structure extends in a second direction in the top view. The second direction is different from the first direction. The fin structures have a fin pitch equal to a sum of: a dimension of one of the fin structures in the second direction and a distance between an adjacent pair of the fin structures in the second direction. An end segment of the gate structure extends beyond an edge of a closest one of the fin structures in the second direction. The end segment has a tapered profile in the top view or is at least 4 times as long as the fin pitch in the second direction.
    Type: Application
    Filed: July 23, 2024
    Publication date: November 14, 2024
    Inventors: Chi-Sheng Lai, Wei-Chung Sun, Li-Ting Chen, Kuei-Yu Kao, Chih-Han Lin
  • Publication number: 20230253470
    Abstract: A semiconductor structure includes a semiconductor substrate; fin active regions protruded above the semiconductor substrate; and a gate stack disposed on the fin active regions; wherein the gate stack includes a high-k dielectric material layer, and various metal layers disposed on the high-k dielectric material layer. The gate stack has an uneven profile in a sectional view with a first dimension D1 at a top surface, a second dimension D2 at a bottom surface, and a third dimension D3 at a location between the top surface and the bottom surface, and wherein each of D1 and D2 is greater than D3.
    Type: Application
    Filed: April 17, 2023
    Publication date: August 10, 2023
    Inventors: Chi-Sheng Lai, Yu-Fan Peng, Li-Ting Chen, Yu-Shan Lu, Yu-Bey Wu, Wei-Chung Sun, Yuan-Ching Peng, Kuei-Yu Kao, Shih-Yao Lin, Chih-Han Lin, Pei-Yi Liu, Jing Yi Yan
  • Patent number: 11652003
    Abstract: Processes to form differently-pitched gate structures are provided. An example method includes providing a workpiece having a substrate and semiconductor fins spaced apart from one another by an isolation feature, depositing a gate material layer over the workpiece, forming a patterned hard mask over the gate material layer, the patterned hard mask including differently-pitched elongated features, performing a first etch process using the patterned hard mask as an etch mask through the gate material layer to form a trench, performing a second etch process using the patterned hard mask as an etch mask to extend the trench to a top surface of the isolation feature, and performing a third etch process using the patterned hard mask to extend the trench into the isolation feature. The first etch process includes use of carbon tetrafluoride and is free of use of oxygen gas.
    Type: Grant
    Filed: February 28, 2022
    Date of Patent: May 16, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chi-Sheng Lai, Wei-Chung Sun, Li-Ting Chen, Kuei-Yu Kao, Chih-Han Lin
  • Patent number: 11631745
    Abstract: A semiconductor structure includes a semiconductor substrate; fin active regions protruded above the semiconductor substrate; and a gate stack disposed on the fin active regions; wherein the gate stack includes a high-k dielectric material layer, and various metal layers disposed on the high-k dielectric material layer. The gate stack has an uneven profile in a sectional view with a first dimension D1 at a top surface, a second dimension D2 at a bottom surface, and a third dimension D3 at a location between the top surface and the bottom surface, and wherein each of D1 and D2 is greater than D3.
    Type: Grant
    Filed: April 2, 2021
    Date of Patent: April 18, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chi-Sheng Lai, Yu-Fan Peng, Li-Ting Chen, Yu-Shan Lu, Yu-Bey Wu, Wei-Chung Sun, Yuan-Ching Peng, Kuei-Yu Kao, Shih-Yao Lin, Chih-Han Lin, Pei-Yi Liu, Jing Yi Yan
  • Patent number: 11557590
    Abstract: A device includes a plurality of fin structures that each protrude vertically upwards out of a substrate and each extend in a first direction in a top view. A gate structure is disposed over the fin structures. The gate structure extends in a second direction in the top view. The second direction is different from the first direction. The fin structures have a fin pitch equal to a sum of: a dimension of one of the fin structures in the second direction and a distance between an adjacent pair of the fin structures in the second direction. An end segment of the gate structure extends beyond an edge of a closest one of the fin structures in the second direction. The end segment has a tapered profile in the top view or is at least 4 times as long as the fin pitch in the second direction.
    Type: Grant
    Filed: June 11, 2020
    Date of Patent: January 17, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chi-Sheng Lai, Wei-Chung Sun, Li-Ting Chen, Kuei-Yu Kao, Chih-Han Lin
  • Publication number: 20220359511
    Abstract: A device includes a plurality of fin structures that each protrude vertically upwards out of a substrate and each extend in a first direction in a top view. A gate structure is disposed over the fin structures. The gate structure extends in a second direction in the top view. The second direction is different from the first direction. The fin structures have a fin pitch equal to a sum of: a dimension of one of the fin structures in the second direction and a distance between an adjacent pair of the fin structures in the second direction. An end segment of the gate structure extends beyond an edge of a closest one of the fin structures in the second direction. The end segment has a tapered profile in the top view or is at least 4 times as long as the fin pitch in the second direction.
    Type: Application
    Filed: July 27, 2022
    Publication date: November 10, 2022
    Inventors: Chi-Sheng Lai, Wei-Chung Sun, Li-Ting Chen, Kuei-Yu Kao, Chih-Han Lin
  • Publication number: 20220328420
    Abstract: An alignment structure for a semiconductor device and a method of forming same are provided. A method includes forming an isolation region over a substrate and forming an alignment structure over the isolation region. Forming the alignment structure includes forming a sacrificial gate electrode layer over the substrate and the isolation region. The sacrificial gate electrode layer is patterned to form a plurality of first sacrificial gates over the isolation region. At least one of the plurality of first sacrificial gates is reshaped. The at least one of the plurality of first sacrificial gates is disposed at an edge of the alignment structure in a plan view. A sidewall of the at least one of the plurality of first sacrificial gates comprises a notch at an interface between the at least one of the plurality of first sacrificial gates and the isolation region.
    Type: Application
    Filed: June 29, 2022
    Publication date: October 13, 2022
    Inventors: Chi-Sheng Lai, Wei-Chung Sun, Li-Ting Chen, Kuei-Yu Kao, Chih-Han Lin
  • Patent number: 11430190
    Abstract: A virtual and real image fusion method is disclosed. The method comprises the following operations: obtaining a picture of a three dimensional space by a first camera, in which the picture comprises a screen picture and a tag picture of an entity tag and the screen picture is projected on the entity tag; obtaining a corresponding point data of the entity tag on the screen picture according to the picture by a processor; obtaining a spatial correction parameter according to the corresponding point data by the processor; and displaying an image on the screen picture according to the spatial correction parameter by the processor.
    Type: Grant
    Filed: January 13, 2021
    Date of Patent: August 30, 2022
    Assignee: INSTITUTE FOR INFORMATION INDUSTRY
    Inventors: Li-Ting Chen, Ming-Fang Weng
  • Patent number: 11393769
    Abstract: An alignment structure for a semiconductor device and a method of forming same are provided. A method includes forming an isolation region over a substrate and forming an alignment structure over the isolation region. Forming the alignment structure includes forming a sacrificial gate electrode layer over the substrate and the isolation region. The sacrificial gate electrode layer is patterned to form a plurality of first sacrificial gates over the isolation region. At least one of the plurality of first sacrificial gates is reshaped. The at least one of the plurality of first sacrificial gates is disposed at an edge of the alignment structure in a plan view. A sidewall of the at least one of the plurality of first sacrificial gates comprises a notch at an interface between the at least one of the plurality of first sacrificial gates and the isolation region.
    Type: Grant
    Filed: May 8, 2020
    Date of Patent: July 19, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chi-Sheng Lai, Wei-Chung Sun, Li-Ting Chen, Kuei-Yu Kao, Chih-Han Lin
  • Publication number: 20220181215
    Abstract: Processes to form differently-pitched gate structures are provided. An example method includes providing a workpiece having a substrate and semiconductor fins spaced apart from one another by an isolation feature, depositing a gate material layer over the workpiece, forming a patterned hard mask over the gate material layer, the patterned hard mask including differently-pitched elongated features, performing a first etch process using the patterned hard mask as an etch mask through the gate material layer to form a trench, performing a second etch process using the patterned hard mask as an etch mask to extend the trench to a top surface of the isolation feature, and performing a third etch process using the patterned hard mask to extend the trench into the isolation feature. The first etch process includes use of carbon tetrafluoride and is free of use of oxygen gas.
    Type: Application
    Filed: February 28, 2022
    Publication date: June 9, 2022
    Inventors: Chi-Sheng Lai, Wei-Chung Sun, Li-Ting Chen, Kuei-Yu Kao, Chih-Han Lin
  • Publication number: 20220114789
    Abstract: A virtual and real image fusion method is disclosed. The method comprises the following operations: obtaining a picture of a three dimensional space by a first camera, in which the picture comprises a screen picture and a tag picture of an entity tag and the screen picture is projected on the entity tag; obtaining a corresponding point data of the entity tag on the screen picture according to the picture by a processor; obtaining a spatial correction parameter according to the corresponding point data by the processor; and displaying an image on the screen picture according to the spatial correction parameter by the processor.
    Type: Application
    Filed: January 13, 2021
    Publication date: April 14, 2022
    Inventors: Li-Ting CHEN, Ming-Fang WENG
  • Patent number: 11264282
    Abstract: Processes to form differently-pitched gate structures are provided. An example method includes providing a workpiece having a substrate and semiconductor fins spaced apart from one another by an isolation feature, depositing a gate material layer over the workpiece, forming a patterned hard mask over the gate material layer, the patterned hard mask including differently-pitched elongated features, performing a first etch process using the patterned hard mask as an etch mask through the gate material layer to form a trench, performing a second etch process using the patterned hard mask as an etch mask to extend the trench to a top surface of the isolation feature, and performing a third etch process using the patterned hard mask to extend the trench into the isolation feature. The first etch process includes use of carbon tetrafluoride and is free of use of oxygen gas.
    Type: Grant
    Filed: February 25, 2020
    Date of Patent: March 1, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chi-Sheng Lai, Wei-Chung Sun, Li-Ting Chen, Kuei-Yu Kao, Chih-Han Lin
  • Publication number: 20210359095
    Abstract: A semiconductor structure includes a semiconductor substrate; fin active regions protruded above the semiconductor substrate; and a gate stack disposed the fin active regions; wherein the gate stack includes a high-k dielectric material layer, and various metal layers disposed on the high-k dielectric material layer. The gate stack has an uneven profile in a sectional view with a first dimension D1 at a top surface, a second dimension D2 at a bottom surface, and a third dimension D3 at a location between the top surface and the bottom surface, and wherein each of D1 and D2 is greater than D3.
    Type: Application
    Filed: April 2, 2021
    Publication date: November 18, 2021
    Inventors: Chi-Sheng Lai, Yu-Fan Peng, Li-Ting Chen, Yu-Shan Lu, Yu-Bey Wu, Wei-Chung Sun, Yuan-Ching Peng, Kuei-Yu Kao, Shih-Yao Lin, Chih-Han Lin, Pei-Yi Liu, Jing Yi Yan
  • Publication number: 20210265219
    Abstract: Processes to form differently-pitched gate structures are provided. An example method includes providing a workpiece having a substrate and semiconductor fins spaced apart from one another by an isolation feature, depositing a gate material layer over the workpiece, forming a patterned hard mask over the gate material layer, the patterned hard mask including differently-pitched elongated features, performing a first etch process using the patterned hard mask as an etch mask through the gate material layer to form a trench, performing a second etch process using the patterned hard mask as an etch mask to extend the trench to a top surface of the isolation feature, and performing a third etch process using the patterned hard mask to extend the trench into the isolation feature. The first etch process includes use of carbon tetrafluoride and is free of use of oxygen gas.
    Type: Application
    Filed: February 25, 2020
    Publication date: August 26, 2021
    Inventors: Chi-Sheng Lai, Wei-Chung Sun, Li-Ting Chen, Kuei-Yu Kao, Chih-Han Lin
  • Publication number: 20210257359
    Abstract: A device includes a plurality of fin structures that each protrude vertically upwards out of a substrate and each extend in a first direction in a top view. A gate structure is disposed over the fin structures. The gate structure extends in a second direction in the top view. The second direction is different from the first direction. The fin structures have a fin pitch equal to a sum of: a dimension of one of the fin structures in the second direction and a distance between an adjacent pair of the fin structures in the second direction. An end segment of the gate structure extends beyond an edge of a closest one of the fin structures in the second direction. The end segment has a tapered profile in the top view or is at least 4 times as long as the fin pitch in the second direction.
    Type: Application
    Filed: June 11, 2020
    Publication date: August 19, 2021
    Inventors: Chi-Sheng Lai, Wei-Chung Sun, Li-Ting Chen, Kuei-Yu Kao, Chih-Han Lin
  • Publication number: 20210257310
    Abstract: An alignment structure for a semiconductor device and a method of forming same are provided. A method includes forming an isolation region over a substrate and forming an alignment structure over the isolation region. Forming the alignment structure includes forming a sacrificial gate electrode layer over the substrate and the isolation region. The sacrificial gate electrode layer is patterned to form a plurality of first sacrificial gates over the isolation region. At least one of the plurality of first sacrificial gates is reshaped. The at least one of the plurality of first sacrificial gates is disposed at an edge of the alignment structure in a plan view. A sidewall of the at least one of the plurality of first sacrificial gates comprises a notch at an interface between the at least one of the plurality of first sacrificial gates and the isolation region.
    Type: Application
    Filed: May 8, 2020
    Publication date: August 19, 2021
    Inventors: Chi-Sheng Lai, Wei-Chung Sun, Li-Ting Chen, Kuei-Yu Kao, Chih-Han Lin
  • Publication number: 20180367431
    Abstract: An embodiment of the invention provides a heavy network flow detection method for a software-defined networking (SDN) switch. The method includes: receiving a network packet through a network interface; analyzing the network packet to obtain routing information of the network packet; performing a plurality of hash calculations for the routing information to generate a plurality of index values, and updating a plurality of counting values in a plurality of hash tables according to the index values; obtaining a flow-amount evaluation value corresponding to the routing information according to the counting values; and identifying that the network packet belongs to a heavy network flow if the flow-amount evaluation value is larger than a threshold value.
    Type: Application
    Filed: July 26, 2017
    Publication date: December 20, 2018
    Applicant: Chung Yuan Christian University
    Inventors: Yu-Kuen Lai, Theophilus Yohanis Hermanus Wellem, Chao-Yuan Huang, Chung-Hsiang Cheng, Yung-Chuan Liao, Li-Ting Chen