Abstract: A method is described for calculating head disk interference (HDI) using a dynamic parametric test. In one embodiment, HDI is calculated based on an actual and ideal sensitivity profile based on a read-back signal track profile for the slider/head.

Abstract: An integrated lapping guide (ILG) is described including at least one read-head and an electronic lapping guide (ELG). In one embodiment, the ELG is offset from the height of the read-head. Resistance between the read-head and the ELG can be measured during the lapping process. During the initial phase of the lapping process, the ELG dominates the change in ILG resistance and provides a long-range stripe-height control allowing for inclination and bending of the row of magneto-resistive (MR) heads. During the latter phases of the lapping process, the read-head dominates the change in ILG resistance and provides a short-range, uniform read-head resistance control. In this embodiment, the transition between the long-range stripe-height control and the short-range, uniform read-head resistance control is smooth, providing a marked benefit to the read-head manufacturing process.

Abstract: An integrated lapping guide (ILG) is described including at least one read-head and an electronic lapping guide (ELG). In one embodiment, the ELG is offset from the height of the read-head. Resistance between the read-head and the ELG can be measured during the lapping process. During the initial phase of the lapping process, the ELG dominates the change in ILG resistance and provides a long-range stripe-height control allowing for inclination and bending of the row of magneto-resistive (MR) heads. During the latter phases of the lapping process, the read-head dominates the change in ILG resistance and provides a short-range, uniform read-head resistance control. In this embodiment, the transition between the long-range stripe-height control and the short-range, uniform read-head resistance control is smooth, providing a marked benefit to the read-head manufacturing process.

Abstract: A structure for preventing and controlling Arcing Across Thin Dielectric Film in sputtering and other process that generate electric fields and cause arcing across conductive structures. In an embodiment, an extraneous window or two extraneous windows are formed in a second dielectric layer under at least of a portion of a lead to that a “hot spot” area is created where arcing is more likely to occur.

Abstract: A method for fabricating balanced shield connections for noise reduction MR/GMR read heads and an MR/MGR read head so fabricated. The present invention teaches a method for forming a balanced electrical half-bridge in parallel with the MR/GMR element of a read head so as to reduce readback noise caused by discharges between the two ends of the MR/GMR sensor element, which are at different potentials as a result of the bias current passing through the sensor, and the magnetic shields, whose potential is constant. The half-bridge is connected to each of the magnetic shields by interconnects attached to a pad at its mid-point, thus placing the shields at the same average potential as the sensor element.

Abstract: Methods and structures are disclosed which avoid electrostatic charge build up and subsequent electrostatic discharge (ESD) during the wafer fabrication process of magnetoresistive (MR) or giant magnetoresistive (GMR) read/write heads of magnetic disk drives. This is achieved by designing the wafer layout and process so that the MR/GMR sensor film is shorted to the magnetic shields of the head through shorting paths so that there is an equal potential between MR/GMR sensor film and magnetic shields during the entire fabrication process.

Abstract: A method for preventing and controlling Arcing Across Thin Dielectric Film in sputtering and other process that generate electric fields and cause arcing across conductive structures. In a first embodiment, when the wafer is subjected to RF electric fields from a RF generating tool, the leads are oriented in a first direction which is perpendicular to the RF fields (in a second direction) generated by a RF generating tool (e.g., sputter tool). In a second embodiment, leads are shaped so that the leads extend on both sides of the ABS line so that the MR window 40 is close to the geometric center of the leads. In a third embodiment, an extraneous window or two extraneous windows are formed in a second dielectric layer under at least of a portion of a lead to that a “hot spot” area is created where arcing is more likely to occur.

Abstract: A laminated spin-valve sensor comprises a fixed magnetic layer and a free-layer separated by a thin spacer layer, with electrical leads interconnected to ends of the sensor. The sensor is longitudinally biased by permanently magnetized structures between the electrical leads and the sensor ends. Each electrical lead interconnects to a sensor end through a permanently magnetized structures which are permanent magnets or exchange-coupled thin films. Exchange-coupled films are canted in a direction consistent with a desired direction of fixed-layer magnetization. Each layer of the sensor has an easy axis aligned with a respective desired direction of magnetization. The transverse bias of the fixed-layer is provided by the bias current and enhanced by a transverse high uniaxial anisotropy, with a selected material with proper magnetostriction. The permanently magnetized structure incorporates a seed-layer and a capping layer for improving the magnetic property.

Abstract: A method for preventing and controlling Arcing Across Thin Dielectric Film in sputtering and other process that generate electric fields and cause arcing across conductive structures. In a first embodiment, when the wafer is subjected to RF electric fields from a RF generating tool, the leads are oriented in a first direction which is perpendicular to the RF fields (in a second direction) generated by a RF generating tool (e.g., sputter tool). In a second embodiment, leads are shaped so that the leads extend on both sides of the ABS line so that the MR window 40 is close to the geometric center of the leads. In a third embodiment, an extraneous window or two extraneous windows are formed in a second dielectric layer under at least of a portion of a lead to that a “hot spot” area is created where arcing is more likely to occur.

Abstract: A method for forming a magnetoresistive (MR) lapping monitor, and a magnetoresistive (MR) lapping monitor formed employing the method. To practice the method, there is first provided a substrate. There is then formed over the substrate a patterned magnetoresistive (MR) layer, where the patterned magnetoresistive (MR) layer has a concavity at an edge of the patterned magnetoresistive (MR) layer opposite an air bearing surface (ABS) edge of the patterned magnetoresistive (MR) layer. There is then formed covering the edge of the patterned magnetoresistive (MR) layer opposite the air bearing surface edge of the patterned magnetoresistive (MR) layer and separated by the concavity a pair of patterned conductor lead layers, where neither patterned conductor lead layer within the pair of patterned conductor lead layers reaches a plane defined by the air bearing surface (ABS) edge of the patterned magnetoresistive (MR) layer.

Abstract: A rotary actuated arm assembly for positioning a tranducer over a data track of a rotating magnetic disk includes an extended load beam having an etched cavity along its top surface and shaped to function as a dynamic absorbing member for absorbing undesirable vibrations and resonances occurring in high speed mechanisms such as disk drives.

Abstract: A trace suspension assembly for supporting a smaller head slider from an actuator arm in a disk drive includes a flexure formed in three layers, a stainless steel layer for mechanical strength, a polyimide layer for electrical isolation and a ductile copper layer for electrical transmission. The copper layer is etched to form a plurality of U-shaped and contiguous circuit traces beginning at the distal end of the flexure and running symmetrical along each side of the flexure to its proximal end. Indentation sites along the copper traces adjusts for pitch static attitude and/or roll static attitude errors.

Abstract: A rotary actuated arm assembly for positioning a tranducer over a data track of a rotating magnetic disk includes an extended load beam having an etched cavity along its top surface and shaped to function as a dynamic absorbing member for absorbing undesirable vibrations and resonances occurring in high speed mechanisms such as disk drives.

Abstract: A method for testing slider/disk contact in a disk drive is described. The disk drive comprises a rotating disk and a head mounted by an actuator for selective positioning of the head over the disk, the head having a slider, and a flexure for attaching the head to the actuator. The method includes the steps of rotating the disk of the disk drive at a first preselected rotational velocity, using the head of the disk drive to write a signal having a substantially uniform pattern on the disk as it rotates, thereafter rotating the disk at a second preselected rotational velocity, while rotating the disk at the second preselected rotational velocity, using the head to read back the signal written at the first preselected rotational velocity, and performing an FM demodulation of the read back signal through a frequency range corresponding to a range of natural frequencies of vibration of the flexure caused by slider/disk contact.