Patents by Inventor Liang-Liang Cao

Liang-Liang Cao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8245762
    Abstract: A heat dissipation assembly for dissipating heat from a first heat source and a second heat source includes a heat sink, a fan, a supporting member, and a deflecting panel. The heat sink includes a base and a plurality of heat dissipation fins disposed on the base. The base is in contact with the first heat source for thermally conducting the heat generated by the first heat source. The fan and the supporting member are attached at opposite sides of the heat dissipation fins. The supporting member is a pivotable rod. The deflecting plate is attached to the pivotable rod and is pivotable relative to the heat dissipation fins. The deflecting plate is capable of deflecting airflow from the fan towards the second heat source to dissipate heat generated by the second heat source.
    Type: Grant
    Filed: June 30, 2009
    Date of Patent: August 21, 2012
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventor: Liang-Liang Cao
  • Patent number: 8072757
    Abstract: A heat dissipation apparatus includes a heat sink configured to contact a heat source, and a fan mounted on the heat sink configured to generate airflow through the heat dissipation apparatus. The fan includes a plurality of fan blades, and a motor configured for rotating the fan. The motor is located a distance from the fan blades.
    Type: Grant
    Filed: June 8, 2009
    Date of Patent: December 6, 2011
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co. Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Liang-Liang Cao, Yu-Hsu Lin, Zhi-Ping Wu, Yang Li, Lei Guo
  • Patent number: 7929304
    Abstract: A heat dissipation apparatus for dissipating heat from two heat sources includes a heat sink, and a fan mounted on the heat sink. The heat sink includes a base and a plurality of parallel fins positioned on the base, the base contacts with one of the two heat sources for thermally conducting the heat generated by the one of the two heat sources. The fan is configured to generate airflow through the fins in such a manner that airflow flows from a second side of the fins to a first side of the fins. A deflecting member is mounted on the first side of the fins for deflecting airflow from the fan towards the second of the two heat sources.
    Type: Grant
    Filed: June 8, 2009
    Date of Patent: April 19, 2011
    Assignees: Hong-Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Liang-Liang Cao, Jeng-Da Wu, Yang Li
  • Patent number: 7929293
    Abstract: A heat dissipating assembly includes a heat generating component, a heat sink, and a fan. The heat sink includes a base attached on the heat generating component and a plurality of fins attached on the base. The fan is attached to a top surface of the fins. The top surface of the fins is wider than the base. The fins incline inwardly from the top surface to the base for gathering cooling air from the fan to the base.
    Type: Grant
    Filed: June 8, 2009
    Date of Patent: April 19, 2011
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventor: Liang-Liang Cao
  • Publication number: 20100310391
    Abstract: A heat dissipation fan includes a first magnetic pole, and a second magnetic pole positioned in the first magnetic pole. A plurality of coils is positioned on the first magnetic pole. A plurality of fan blades is positioned on an inner surface of the second magnetic pole. When the current is applied, the magnetic field between the first and second magnetic poles generates a force on the first magnetic pole through the plurality of coils thereon. The first magnetic pole generates a counterforce on the second magnetic pole to rotate the plurality of fan blades.
    Type: Application
    Filed: August 26, 2009
    Publication date: December 9, 2010
    Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: LIANG-LIANG CAO, LIANG-WEI JIANG
  • Publication number: 20100288476
    Abstract: A heat dissipation apparatus for dissipating heat from two heat sources includes a heat sink, and a fan mounted on the heat sink. The heat sink includes a base and a plurality of parallel fins positioned on the base, the base contacts with one of the two heat sources for thermally conducting the heat generated by the one of the two heat sources. A slantwise slot is formed in the fins, an edge of the slot bent to form a slantwise deflecting portion. The fan is configured to generate airflow through the fins in such a manner that some of the airflow is deflected by the deflecting portion towards the second of the two heat sources.
    Type: Application
    Filed: July 24, 2009
    Publication date: November 18, 2010
    Applicants: HONG FU JIN PRECISION INDUSTRY(ShenZhen) CO.,LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: LIANG-LIANG CAO, YU-HSU LIN
  • Publication number: 20100288475
    Abstract: A heat dissipation assembly for dissipating heat from a first heat source and a second heat source includes a heat sink, a fan, a supporting member, and a deflecting panel. The heat sink includes a base and a plurality of heat dissipation fins disposed on the base. The base contacts with the first heat source for thermally conducting the heat generated by the first heat source. The fan and the supporting member are attached at opposite sides of the heat dissipation fins. The supporting member a pivotable rod. The deflecting plate is attached to the pivotable rod and pivotable relative to the heat dissipation fins. The deflecting plate is capable of deflecting airflow from the fan towards the second heat source and dissipating the heat generated by the second heat source.
    Type: Application
    Filed: June 30, 2009
    Publication date: November 18, 2010
    Applicants: HONG FU JIN PRECISION INDUSTRY(ShenZhen) CO.,LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: LIANG-LIANG CAO
  • Patent number: 7835149
    Abstract: A computer enclosure includes a chassis with a plurality of heat generating components installed therein and an airflow guide structure. The airflow guide structure includes a fan and a duct attached to the fan. A pair of airflow outlets aligned with the fan is defined in the duct. The duct includes a plurality of pivot panels pivotally attached at airflow outlets. The pivot panels are configured to guide airflow from the fan to different positions of heat generating components in the chassis.
    Type: Grant
    Filed: December 22, 2008
    Date of Patent: November 16, 2010
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Yang Li, Yu-Hsu Lin, Jeng-Da Wu, Lei Guo, Liang-Liang Cao, Liang-Qing Shan
  • Publication number: 20100284142
    Abstract: A heat dissipating assembly includes a heat generating component, a heat sink, and a fan. The heat sink includes a base attached on the heat generating component and a plurality of fins attached on the base. The fan is attached to a top surface of the fins. The top surface of the fins is wider than the base. The fins incline inwardly from the top surface to the base for gathering cooling air from the fan to the base.
    Type: Application
    Filed: June 8, 2009
    Publication date: November 11, 2010
    Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen ) CO.LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: LIANG-LIANG CAO
  • Publication number: 20100282447
    Abstract: A heat sink assembly includes a fan and two sets of fin modules. The fan generates airflow along a first direction. The two sets of fin modules are fixed on opposite sides of the fan. Each set of fin module has a plurality of parallel fins. The fins extend parallel to the first direction.
    Type: Application
    Filed: June 25, 2009
    Publication date: November 11, 2010
    Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: Liang-Liang CAO
  • Patent number: 7760498
    Abstract: An electronic apparatus includes an enclosure (30), a circuit board (40), a fan module (20), and an air guiding element (10) mounted in the enclosure. The circuit board includes at least one heat generating component (41) thereon. The fan module has a fan (22) and an output opening (213) corresponding to the fan. The air guiding element comprises a resisting panel (11) and a guiding panel (12) comprises a free end that extends toward the output opening of the fan module. The at least one heat generating component and the output opening are on the same side of the resisting panel. The guiding panel defines a free end (127) and a connecting end (125) connecting the resisting panel. A plane defined by the ends of the guiding panel is aligned at an angle larger than 90 degrees relative to the resisting panel.
    Type: Grant
    Filed: June 12, 2008
    Date of Patent: July 20, 2010
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Liang-Qing Shan, Yang Li, Yu-Hsu Lin, Jeng-Da Wu, Liang-Liang Cao, Lei Guo
  • Publication number: 20100149749
    Abstract: A heat dissipation apparatus for dissipating heat from two heat sources includes a heat sink, and a fan mounted on the heat sink. The heat sink includes a base and a plurality of parallel fins positioned on the base, the base contacts with one of the two heat sources for thermally conducting the heat generated by the one of the two heat sources. The fan is configured to generate airflow through the fins in such a manner that airflow flows from a second side of the fins to a first side of the fins. A deflecting member is mounted on the first side of the fins for deflecting airflow from the fan towards the second of the two heat sources.
    Type: Application
    Filed: June 8, 2009
    Publication date: June 17, 2010
    Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Liang-Liang CAO, Jeng-Da WU, Yang LI
  • Publication number: 20100147495
    Abstract: A heat dissipation apparatus includes a heat sink configured to contact a heat source, and a fan mounted to the heat sink. The heat sink includes a base with a bottom surface for contacting the heat source, and a plurality of radial fins angling upwardly from a top surface of the base to form a truncated conical space in the middle of the heat sink. A cross section area of the truncated conical space gradually increases from the top surface of the base to top of the fins.
    Type: Application
    Filed: June 16, 2009
    Publication date: June 17, 2010
    Applicants: HONG FU JIN PRECISION INDUSTRY(Shenzhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Liang-Liang Cao, Zhong-Yong Du, Yang Li, Lei Guo
  • Publication number: 20100134971
    Abstract: A heat dissipation apparatus includes a heat sink configured to contact a heat source, and a fan mounted on the heat sink configured to generate airflow through the heat dissipation apparatus. The fan includes a plurality of fan blades, and a motor configured for rotating the fan. The motor is located a distance from the fan blades.
    Type: Application
    Filed: June 8, 2009
    Publication date: June 3, 2010
    Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Liang-Liang CAO, Yu-Hsu LIN, Zhi-Ping WU, Yang LI, Lei GUO
  • Publication number: 20100097754
    Abstract: A computer enclosure includes a chassis with a plurality of heat generating components installed therein and an airflow guide structure. The airflow guide structure includes a fan and a duct attached to the fan. A pair of airflow outlets aligned with the fan is defined in the duct. The duct includes a plurality of pivot panels pivotally attached at airflow outlets. The pivot panels are configured to guide airflow from the fan to different positions of heat generating components in the chassis.
    Type: Application
    Filed: December 22, 2008
    Publication date: April 22, 2010
    Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: YANG LI, YU-HSU LIN, JENG-DA WU, LEI GUO, LIANG-LIANG CAO, LIANG-QING SHAN
  • Publication number: 20100014244
    Abstract: A heat sink for dissipating heat from a heat source, includes a base configured to connect with a heat source, and a plurality of fins positioned on the base. A cutout is defined within the plurality of parallel fins.
    Type: Application
    Filed: September 30, 2008
    Publication date: January 21, 2010
    Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD, HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: LIANG-LIANG CAO, YU-HSU LIN, JENG-DA WU, CHIH-HANG CHAO, YANG LI, LEI GUO
  • Publication number: 20090213549
    Abstract: A heat sink assembly includes a printed circuit board, an electronic component mounted on the printed circuit board, and a heat sink mounted on the printed circuit board for dissipating heat from the electronic component. The printed circuit board includes a heat-conduction layer. The heat sink includes a base configured to contact the heat-conduction layer, and a main body extending upward from the base configured to contact the electronic component. The cross section of the base is larger than the cross section of the main body. A plurality of fins extends from the main body.
    Type: Application
    Filed: September 15, 2008
    Publication date: August 27, 2009
    Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: LEI GUO, YU-HSU LIN, JENG-DA WU, CHIH-HANG CHAO, YANG LI, LIANG-LIANG CAO
  • Publication number: 20090190309
    Abstract: An electronic apparatus includes an enclosure (30), a circuit board (40), a fan module (20), and an air guiding element (10) mounted in the enclosure. The circuit board includes at least one heat generating component (41) thereon. The fan module has a fan (22) and an output opening (213) corresponding to the fan. The air guiding element comprises a resisting panel (11) and a guiding panel (12) comprises a free end that extends toward the output opening of the fan module. The at least one heat generating component and the output opening are on the same side of the resisting panel. The guiding panel defines a free end (127) and a connecting end (125) connecting the resisting panel. A plane defined by the ends of the guiding panel is aligned at an angle larger than 90 degrees relative to the resisting panel.
    Type: Application
    Filed: June 12, 2008
    Publication date: July 30, 2009
    Applicants: HONG FU JIN PRECISION INDUSTRy (shenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: LIANG-QING SHAN, YANG LI, YU-HSU LIN, JENG-DA WU, LIANG-LIANG CAO, LEI GUO
  • Publication number: 20090166062
    Abstract: A printed circuit board assembly includes a printed circuit board, a carrier, a semiconductor chip mounted on the carrier, a plurality of tin balls soldered between the printed circuit board and the carrier for transmitting signals, and a heat sink glued to the semiconductor chip to dissipate heat. A pressing portion is formed on the bottom of the heat sink and does not make contact with the semiconductor chip. The pressing portion contacts with the periphery of the carrier to reinforce the tin balls located between the printed circuit board and the carrier.
    Type: Application
    Filed: May 10, 2008
    Publication date: July 2, 2009
    Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: ZHI-PING WU, JENG-DA WU, YU-HSU LIN, CHIH-HANG CHAO, LIANG-LIANG CAO
  • Publication number: 20090168330
    Abstract: An electronic device includes an enclosure (30), a circuit board (40), and an airflow guiding duct (10). The enclosure includes a bottom wall (31) and a rear wall (32) perpendicular to the bottom wall. The circuit board is mounted on the bottom wall of the enclosure. The circuit board includes a first heat generating element (41) and a second heat generating element (42) near to the first heat generating element. The airflow guiding duct includes two side panels (11) and a connecting panel (13) connecting a pair of side edges (112) of the two side panels. A first opening (17) is defined by a lower edge (131) of the connecting panel and lower edges (111) of the two side panels and corresponding to the first heat generating element. The lower edges of the two side panels and the lower of the connecting panel are in the same plane. The first opening is a predetermined distance from the circuit board and the airflow guiding duct is capable of allowing air flow from different directions.
    Type: Application
    Filed: May 12, 2008
    Publication date: July 2, 2009
    Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: YANG LI, YU-HSU LIN, JENG-DA WU, LEI GUO, LIANG-LIANG CAO