Abstract: A LED bulb apparatus has a bulb shell, a head cap, a driver circuit and at least one light strip. The bulb shell has a light passing shell and a bottom portion. A head cap has a neck portion, a first electrode and a second electrode. The neck portion of the head cap is connected to the bottom portion of the bulb shell forming a container space. A fluorescent layer covers the multiple LED modules. The driving current is transmitted via at least one of the top end and the bottom end of the light strip to the LED modules. The substrate has a light transmittance less than 50%.

Abstract: A LED bulb apparatus has a bulb shell, a head cap, a driver circuit and at least one light strip. The bulb shell has a light passing shell and a bottom portion. A head cap has a neck portion, a first electrode and a second electrode. The neck portion of the head cap is connected to the bottom portion of the bulb shell forming a container space. A fluorescent layer covers the multiple LED modules. The driving current is transmitted via at least one of the top end and the bottom end of the light strip to the LED modules. The substrate has a light transmittance less than 50%.

Abstract: A LED bulb apparatus has a bulb shell, a head cap, a driver circuit and at least one light strip. The bulb shell has a light passing shell and a bottom portion. A head cap has a neck portion, a first electrode and a second electrode. The neck portion of the head cap is connected to the bottom portion of the bulb shell forming a container space. A fluorescent layer covers the multiple LED modules. The driving current is transmitted via at least one of the top end and the bottom end of the light strip to the LED modules. The substrate has a light transmittance less than 50%.

Abstract: A LED bulb apparatus has a bulb shell, a head cap, a driver circuit and at least one light strip. The bulb shell has a light passing shell and a bottom portion. A head cap has a neck portion, a first electrode and a second electrode. The neck portion of the head cap is connected to the bottom portion of the bulb shell forming a container space. A fluorescent layer covers the multiple LED modules. The driving current is transmitted via at least one of the top end and the bottom end of the light strip to the LED modules. The substrate has a light transmittance less than 50%.

Abstract: An LED lighting device includes: a bulb shell; a light-source board having a connector, the light-source board disposed in the bulb shell for generating optical light; a conductive rivet disposed on a bottom of the LED light device; and a fusible resistor having a first conductive-line terminal clamped by the connector and a second conductive-line terminal coupled to the conductive rivet.

Abstract: A light bulb base includes a cylinder-shaped insulating component, a cylinder-shaped base connector, a metal thimble and a heat-dissipating component. The insulating component has a jack at its first side. The base connector has a circumferential interior bore extending there through. The interior bore accommodates the insulating component at a first side of the base connector. The metal thimble inserts into the jack at its first side via the interior bore. Such that the metal thimble rivets the base connector to the insulating component. The heat-dissipating component has a first side coupled to a second side of the insulating component. The heat-dissipating component includes a first opening at its second side. The heat-dissipating component also includes a cavity chamber disposed inside the first opening.

Abstract: A heat dissipation assembly for dissipating heat from a first heat source and a second heat source includes a heat sink, a fan, a supporting member, and a deflecting panel. The heat sink includes a base and a plurality of heat dissipation fins disposed on the base. The base is in contact with the first heat source for thermally conducting the heat generated by the first heat source. The fan and the supporting member are attached at opposite sides of the heat dissipation fins. The supporting member is a pivotable rod. The deflecting plate is attached to the pivotable rod and is pivotable relative to the heat dissipation fins. The deflecting plate is capable of deflecting airflow from the fan towards the second heat source to dissipate heat generated by the second heat source.

Abstract: A heat dissipation apparatus includes a heat sink configured to contact a heat source, and a fan mounted on the heat sink configured to generate airflow through the heat dissipation apparatus. The fan includes a plurality of fan blades, and a motor configured for rotating the fan. The motor is located a distance from the fan blades.

Abstract: A heat dissipating assembly includes a heat generating component, a heat sink, and a fan. The heat sink includes a base attached on the heat generating component and a plurality of fins attached on the base. The fan is attached to a top surface of the fins. The top surface of the fins is wider than the base. The fins incline inwardly from the top surface to the base for gathering cooling air from the fan to the base.

Abstract: A heat dissipation apparatus for dissipating heat from two heat sources includes a heat sink, and a fan mounted on the heat sink. The heat sink includes a base and a plurality of parallel fins positioned on the base, the base contacts with one of the two heat sources for thermally conducting the heat generated by the one of the two heat sources. The fan is configured to generate airflow through the fins in such a manner that airflow flows from a second side of the fins to a first side of the fins. A deflecting member is mounted on the first side of the fins for deflecting airflow from the fan towards the second of the two heat sources.

Abstract: A heat dissipation fan includes a first magnetic pole, and a second magnetic pole positioned in the first magnetic pole. A plurality of coils is positioned on the first magnetic pole. A plurality of fan blades is positioned on an inner surface of the second magnetic pole. When the current is applied, the magnetic field between the first and second magnetic poles generates a force on the first magnetic pole through the plurality of coils thereon. The first magnetic pole generates a counterforce on the second magnetic pole to rotate the plurality of fan blades.

Abstract: A heat dissipation apparatus for dissipating heat from two heat sources includes a heat sink, and a fan mounted on the heat sink. The heat sink includes a base and a plurality of parallel fins positioned on the base, the base contacts with one of the two heat sources for thermally conducting the heat generated by the one of the two heat sources. A slantwise slot is formed in the fins, an edge of the slot bent to form a slantwise deflecting portion. The fan is configured to generate airflow through the fins in such a manner that some of the airflow is deflected by the deflecting portion towards the second of the two heat sources.

Abstract: A heat dissipation assembly for dissipating heat from a first heat source and a second heat source includes a heat sink, a fan, a supporting member, and a deflecting panel. The heat sink includes a base and a plurality of heat dissipation fins disposed on the base. The base contacts with the first heat source for thermally conducting the heat generated by the first heat source. The fan and the supporting member are attached at opposite sides of the heat dissipation fins. The supporting member a pivotable rod. The deflecting plate is attached to the pivotable rod and pivotable relative to the heat dissipation fins. The deflecting plate is capable of deflecting airflow from the fan towards the second heat source and dissipating the heat generated by the second heat source.

Abstract: A computer enclosure includes a chassis with a plurality of heat generating components installed therein and an airflow guide structure. The airflow guide structure includes a fan and a duct attached to the fan. A pair of airflow outlets aligned with the fan is defined in the duct. The duct includes a plurality of pivot panels pivotally attached at airflow outlets. The pivot panels are configured to guide airflow from the fan to different positions of heat generating components in the chassis.

Abstract: A heat dissipating assembly includes a heat generating component, a heat sink, and a fan. The heat sink includes a base attached on the heat generating component and a plurality of fins attached on the base. The fan is attached to a top surface of the fins. The top surface of the fins is wider than the base. The fins incline inwardly from the top surface to the base for gathering cooling air from the fan to the base.

Abstract: A heat sink assembly includes a fan and two sets of fin modules. The fan generates airflow along a first direction. The two sets of fin modules are fixed on opposite sides of the fan. Each set of fin module has a plurality of parallel fins. The fins extend parallel to the first direction.

Abstract: An electronic apparatus includes an enclosure (30), a circuit board (40), a fan module (20), and an air guiding element (10) mounted in the enclosure. The circuit board includes at least one heat generating component (41) thereon. The fan module has a fan (22) and an output opening (213) corresponding to the fan. The air guiding element comprises a resisting panel (11) and a guiding panel (12) comprises a free end that extends toward the output opening of the fan module. The at least one heat generating component and the output opening are on the same side of the resisting panel. The guiding panel defines a free end (127) and a connecting end (125) connecting the resisting panel. A plane defined by the ends of the guiding panel is aligned at an angle larger than 90 degrees relative to the resisting panel.

Abstract: A heat dissipation apparatus includes a heat sink configured to contact a heat source, and a fan mounted to the heat sink. The heat sink includes a base with a bottom surface for contacting the heat source, and a plurality of radial fins angling upwardly from a top surface of the base to form a truncated conical space in the middle of the heat sink. A cross section area of the truncated conical space gradually increases from the top surface of the base to top of the fins.

Abstract: A heat dissipation apparatus for dissipating heat from two heat sources includes a heat sink, and a fan mounted on the heat sink. The heat sink includes a base and a plurality of parallel fins positioned on the base, the base contacts with one of the two heat sources for thermally conducting the heat generated by the one of the two heat sources. The fan is configured to generate airflow through the fins in such a manner that airflow flows from a second side of the fins to a first side of the fins. A deflecting member is mounted on the first side of the fins for deflecting airflow from the fan towards the second of the two heat sources.

Abstract: A heat dissipation apparatus includes a heat sink configured to contact a heat source, and a fan mounted on the heat sink configured to generate airflow through the heat dissipation apparatus. The fan includes a plurality of fan blades, and a motor configured for rotating the fan. The motor is located a distance from the fan blades.