Patents by Inventor Lik Hang Ken Wan

Lik Hang Ken Wan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MEMS microphone and method of manufacturing the MEMS microphone
    Patent number: 10999684
    Abstract: A MEMS microphone includes a MEMS transducer, a sealing cover, and a package substrate. The MEMS transducer includes an element substrate, a plurality of cantilevered beams, and a weight. An airtight sealing structure is formed with the sealing cover and the package substrate, which is formed by mounting the MEMS transducer on the package substrate, and adhering the sealing cover to the package substrate so as to surround the MEMS transducer.
    Type: Grant
    Filed: January 17, 2020
    Date of Patent: May 4, 2021
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Lik Hang Ken Wan, Masashi Shiraishi, Akio Nakao
  • MEMS package, MEMS microphone and method of manufacturing the MEMS package
    Patent number: 10863282
    Abstract: A MEMS package has a MEMS chip, a package substrate which the MEMS chip is adhered, a chip-cover which wraps the MEMS chip, and a cover-supporting part which supports the chip-cover from the inside. In the MEMS package, the chip-cover is supported by the cover-supporting part to form a back chamber, surrounded by the chip-cover and the package substrate.
    Type: Grant
    Filed: January 30, 2019
    Date of Patent: December 8, 2020
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Koichi Shiozawa, Masashi Shiraishi, Jumpei Tsuchiya, Lik Hang Ken Wan, Toyotaka Kobayashi, Hironobu Hayashi
  • MEMS Package, MEMS Microphone and Method of Manufacturing the MEMS Package
    Publication number: 20200245076
    Abstract: A MEMS package has a MEMS chip, a package substrate which the MEMS chip is adhered, a chip-cover which wraps the MEMS chip, and a cover-supporting part which supports the chip-cover from the inside. In the MEMS package, the chip-cover is supported by the cover-supporting part to form a back chamber, surrounded by the chip-cover and the package substrate.
    Type: Application
    Filed: January 30, 2019
    Publication date: July 30, 2020
    Inventors: Koichi Shiozawa, Masashi Shiraishi, Jumpei Tsuchiya, Lik Hang Ken Wan, Toyotaka Kobayashi, Hironobu Hayashi