Patents by Inventor Lili Cheng
Lili Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250108023Abstract: The present disclosure provides an application of TRPM8 agonist, TRPA1 agonist or TRPV1-4 agonist as a substance for masking bitterness, an application of one or more substances as a taste masking agent, an application of one or more substances in an oral spray or mouthwash for masking bitterness, and an oral spray or taste masking agent for masking bitterness. The present disclosure finds that TRPM8 receptor agonists and TRPV1-4 and TRPA1 agonists all have the effect of masking the perception of oral bitterness. TRPM8 receptor agonists stimulate cold channels, and TRPV1-4 and TRPA1 stimulate hot channels. The cool feeling can be used to neutralize the heat feeling, eliminating the uncomfortable and hot pain and bringing a relatively cool and pleasant pleasure.Type: ApplicationFiled: December 13, 2024Publication date: April 3, 2025Applicants: The Third People's Hospital of Henan Province, Zhengzhou Weiqian Biotechnology Co., Ltd.Inventors: Mingkui Shen, Jingliang Zhang, Xiaoting Li, Hongna Cheng, Lili Jue, Chenmeng Gu, Linlin Jiao, Guangchong Zhang, Jiaxue Luo
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Patent number: 12262600Abstract: The present application discloses a display panel, a display device and a method for manufacturing a display panel. The display panel includes a first display area, including a plurality of first light emitting units and a first driving layer for driving the plurality of first light emitting units, and a second display area, at least partially surrounded by the first display area, and making ambient light at least partially transmitted. The first driving layer includes a first light shielding pattern, the first light shielding pattern at least partially surrounding the second display area and including a hollow structure which exposes at least part of the second display area.Type: GrantFiled: March 31, 2021Date of Patent: March 25, 2025Assignees: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.Inventors: Zhi Wang, Yue Long, Weiyun Huang, Yao Huang, Benlian Wang, Lili Du, Yudiao Cheng, Bo Shi
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Patent number: 12254794Abstract: A display panel and a display device are provided. In the display panel, a first display region includes first light-emitting units, and a second display region includes second light-emitting units, first pixel circuits and second pixel circuits, the first pixel circuit is connected with the first light-emitting unit, and the second pixel circuit is connected with the second light-emitting unit. The first display region includes a first region and a second region on a side of the first region away from the second display region, the second display region includes a third region and a fourth region on a side of the third region close to the first display region, the first light-emitting unit in the first region is connected with the first pixel circuit in the third region, the first light-emitting unit in the second region is connected with the first pixel circuit in the fourth region.Type: GrantFiled: July 21, 2021Date of Patent: March 18, 2025Assignees: Chengdu BOE Optoelectronics Technology Co., Ltd., BOE TECHNOLOGY GROUP CO., LTD.Inventors: Yudiao Cheng, Weiyun Huang, Yuanyou Qiu, Jianchang Cai, Lili Du, Chi Yu
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Patent number: 12245478Abstract: The present disclosure is related to a display panel, a display device and a terminal device. The display panel includes a driving backplate, an interconnection layer and a light-emitting layer. Pixel circuits in a driving region include first and second pixel circuits. The driving backplate has first interconnection holes, and any one of the pixel circuits is connected to one of the first interconnection holes. An interconnection region of the interconnection layer includes two interconnection portions each of which has second interconnection holes. First and second interconnection holes connected to the same lead are located in the same hole row to form a hole group. First and second interconnection holes in one of two adjacent hole groups are located between first and second interconnection holes in the other hole group.Type: GrantFiled: May 13, 2021Date of Patent: March 4, 2025Assignees: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.Inventors: Lili Du, Yudiao Cheng, Yue Long, Weiyun Huang
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Publication number: 20250069546Abstract: The present disclosure discloses a display panel and a display device. The display panel includes a base substrate including a first display region and a second display region. Since pixel circuits for driving light-emitting elements in the second display region are only disposed in the first display region but not disposed in the second display region, the light transmittance of the second display region is ensured to be good. Correspondingly, the display panel in the present disclosure has a good display effect.Type: ApplicationFiled: November 15, 2024Publication date: February 27, 2025Inventors: Yudiao CHENG, Benlian WANG, Yao HUANG, Weiyun HUANG, Lili DU, Yue LONG
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Publication number: 20250065457Abstract: The present invention discloses an automatic assembly line for mattress spring, comprising a mattress spring conveying mechanism for conveying mattress springs; It also comprises a mattress spring frame assembly mechanism for installing frames on the mattress spring; It also comprises a mattress spring butterfly spring nailing mechanism for installing butterfly springs on the side of the mattress spring; This proposal designs an automatic assembly line for mattress spring, wherein the mattress spring frame assembly mechanism can automatically complete the loading of the frame, the transportation of the mattress spring frame assembly mechanism, the installation between the mattress spring and the frame, and the folding of non-woven fabric after the installation of the mattress spring frame; The entire automatic assembly line for mattress spring presents a high degree of automation without manual operation, which features high assembly efficiency and high assembly accuracy, thereby effectively improving the proType: ApplicationFiled: November 14, 2024Publication date: February 27, 2025Inventors: Wende Sun, Jiugang Zhang, Lili Yao, Yunlong Cheng
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Publication number: 20250037661Abstract: A display panel and a display device are provided. In the display panel, the data line includes a plurality of first-type data lines and a plurality of second-type data lines, each of the plurality of second-type data lines includes a first portion, a second portion, and a third portion, and the first portion and the second portion are connected by the third portion, the first portion and the second portion both extend in the second direction, and the third portion extends in the first direction, the third portion and the second portion are located in different layers, the third portion and the first portion are located in different layers, the first portion is closer to the base substrate than the third portion, and the second portion is closer to the base substrate than the third portion.Type: ApplicationFiled: October 17, 2024Publication date: January 30, 2025Applicants: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.Inventors: Yue LONG, Yao HUANG, Lili DU, Weiyun HUANG, Yuanjie XU, Binyan WANG, Yudiao CHENG
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Publication number: 20250029917Abstract: A semiconductor device includes a metal-insulator-metal capacitor disposed between a first metallization level and a second metallization level, the metal-insulator-metal capacitor comprising a first electrode, a second electrode and a third electrode. A first via is extended from and contacts a conductive line of the second metallization level, and a second via is extended from and contacts the first via. The second via contacts the first electrode and the third electrode of the metal-insulator-metal capacitor. A slope of a side surface of the first via is different from a slope of a side surface of the second via.Type: ApplicationFiled: July 21, 2023Publication date: January 23, 2025Inventors: Huimei Zhou, Lili Cheng, Baozhen Li, Chih-Chao Yang, Miaomiao Wang
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Patent number: 12144263Abstract: A semiconductor device, such as an MRAM device, includes a stepped contact within a memory region that has a greater number of different contact structures (i.e., contact structures formed in different fabrication stages) relative to a logic region contact. The stepped contact includes a lower stepped contact and an upper stepped contact. The inclusion of the lower stepped contact allows for a relatively shorter upper stepped contact compared to the logic region contact. The stepped contact may allow the use of a multi-layer encapsulation spacer upon the sidewalls of a memory cell that fill out tight spacing therebetween, which may decrease the propensity of void formation and resulting shorting between neighboring memory cell features.Type: GrantFiled: September 30, 2021Date of Patent: November 12, 2024Assignee: International Business Machines CorporationInventors: Ashim Dutta, Lili Cheng, Chih-Chao Yang
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Patent number: 12130849Abstract: The disclosure herein describes providing responses to natural language queries associated with transcripts at least by searching multiple indexes. A transcript associated with a communication among a plurality of speakers is obtained, wherein sets of artifact sections are identified in the transcript. A set of section indexes is generated from the transcript based on artifact type definitions. A natural language query associated with the transcript is analyzed using a natural language model and query metadata of the analyzed natural language query is obtained. At least one section index of the set of section indexes is selected based on the obtained query metadata and that selected at least one section index is searched. A response to the natural language query is provided including result data from the searched at least one search index, wherein the result data includes a reference to an artifact section referenced by the searched section index(es).Type: GrantFiled: April 19, 2023Date of Patent: October 29, 2024Assignee: Microsoft Technology Licensing, LLCInventors: Karen Master Ben-Dor, Lili Cheng, Adi Diamant, Raz Halaly, Eshchar Zychlinski, Thomas Matthew Laird-McConnell, Sonja Sabina Knoll, Daniel Dos Santos Marques, Shunfu Mao
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Patent number: 12120963Abstract: A semiconductor structure comprises a bottom electrode contact, and a memory device comprising a bottom electrode disposed on the bottom electrode contact, at least one memory element layer disposed on the bottom electrode, and a top electrode disposed on the at least one memory element layer. A bit line contact is disposed on the top electrode and extends around sides of the memory device and of the bottom electrode contact. An encapsulation layer is disposed between the bit line contact and the sides of the memory device and of the bottom electrode contact.Type: GrantFiled: September 24, 2021Date of Patent: October 15, 2024Assignee: International Business Machines CorporationInventors: Lili Cheng, Ashim Dutta, Chih-Chao Yang
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Publication number: 20240074336Abstract: A memory device and method of forming a projection liner under a mushroom phase change memory device with sidewall electrode process scheme to provide self-aligned patterning of resistive projection liner during sidewall electrode formation.Type: ApplicationFiled: August 24, 2022Publication date: February 29, 2024Inventors: Injo Ok, Timothy Mathew Philip, Jin Ping Han, Ching-Tzu Chen, Kevin W. Brew, Lili Cheng
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Patent number: 11736310Abstract: A computing system for real-time analyzing meeting conversations using artificial intelligence (AI) is configured to establish a meeting communication channel that facilitates a meeting among multiple client systems. Each of the multiple client systems corresponds to a meeting participant. In response to receiving communication from the multiple client systems, the computing system analyzes currently received communication via an AI engine while the meeting remains active. The currently received communication is communication received within a rolling time window ending at a current time. Based on the analysis, the computing system identifies an agenda item that has a highest correlation with the currently received communication and a sentiment of at least one participant. The computing system then determines a level of interest of the agenda item based on the sentiment of the participant and causes at least one client system to display a notification or an alert or make suggestions.Type: GrantFiled: May 5, 2022Date of Patent: August 22, 2023Assignee: Microsoft Technology Licensing, LLCInventors: Thomas Matthew Laird-Mcconnell, Steven Ickman, Christopher Lee Mullins, Lili Cheng
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Publication number: 20230252061Abstract: The disclosure herein describes providing responses to natural language queries associated with transcripts at least by searching multiple indexes. A transcript associated with a communication among a plurality of speakers is obtained, wherein sets of artifact sections are identified in the transcript. A set of section indexes is generated from the transcript based on artifact type definitions. A natural language query associated with the transcript is analyzed using a natural language model and query metadata of the analyzed natural language query is obtained. At least one section index of the set of section indexes is selected based on the obtained query metadata and that selected at least one section index is searched. A response to the natural language query is provided including result data from the searched at least one search index, wherein the result data includes a reference to an artifact section referenced by the searched section index(es).Type: ApplicationFiled: April 19, 2023Publication date: August 10, 2023Inventors: Karen MASTER BEN-DOR, Lili CHENG, Adi DIAMANT, Raz HALALY, Eshchar ZYCHLINSKI, Thomas Matthew LAIRD-MCCONNELL, Sonja Sabina KNOLL, Daniel DOS SANTOS MARQUES, Shunfu MAO
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Publication number: 20230172073Abstract: Embodiments of the invention include a method for fabricating a semiconductor device and the resulting structure. A substrate having an embedded memory area interconnect structure and an embedded non-memory area interconnect structure is provided, the memory area interconnect structure comprising metal interconnects formed in the substrate. A metal line on a metal interconnect of the non-memory area interconnect structure is formed. A first dielectric layer on exposed surfaces of the non-memory area is formed. A hardmask is formed on the dielectric layer. A second dielectric layer is formed on exposed surfaces of the memory area. A bottom metal contact is formed in a trench, a bottom surface of the bottom metal contact on a top surface of a first metal interconnect of the memory area interconnect structure. A memory element stack pillar is formed on the bottom metal contact.Type: ApplicationFiled: December 1, 2021Publication date: June 1, 2023Inventors: Ashim Dutta, Lili Cheng, Chih-Chao Yang
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Patent number: 11640418Abstract: The disclosure herein describes providing responses to natural language queries associated with transcripts at least by searching multiple indexes. A transcript associated with a communication among a plurality of speakers is obtained, wherein sets of artifact sections are identified in the transcript. A set of section indexes is generated from the transcript based on artifact type definitions. A natural language query associated with the transcript is analyzed using a natural language model and query metadata of the analyzed natural language query is obtained. At least one section index of the set of section indexes is selected based on the obtained query metadata and that selected section index is searched. A response to the natural language query is provided including result data from the searched at least one search index, wherein the result data includes a reference to an artifact section referenced by the searched section index(es).Type: GrantFiled: June 25, 2021Date of Patent: May 2, 2023Assignee: Microsoft Technology Licensing, LLCInventors: Karen Master Ben-Dor, Lili Cheng, Adi Diamant, Raz Halaly, Eshchar Zychlinski, Thomas Matthew Laird-Mcconnell, Sonja Sabina Knoll, Daniel Dos Santos Marques, Shunfu Mao
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Publication number: 20230109077Abstract: A semiconductor structure comprises a bottom electrode contact, and a memory device comprising a bottom electrode disposed on the bottom electrode contact, at least one memory element layer disposed on the bottom electrode, and a top electrode disposed on the at least one memory element layer. A bit line contact is disposed on the top electrode and extends around sides of the memory device and of the bottom electrode contact. An encapsulation layer is disposed between the bit line contact and the sides of the memory device and of the bottom electrode contact.Type: ApplicationFiled: September 24, 2021Publication date: April 6, 2023Inventors: Lili Cheng, Ashim Dutta, Chih-Chao Yang
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Publication number: 20230098122Abstract: A semiconductor device, such as an MRAM device, includes a stepped contact within a memory region that has a greater number of different contact structures (i.e., contact structures formed in different fabrication stages) relative to a logic region contact. The stepped contact includes a lower stepped contact and an upper stepped contact. The inclusion of the lower stepped contact allows for a relatively shorter upper stepped contact compared to the logic region contact. The stepped contact may allow the use of a multi-layer encapsulation spacer upon the sidewalls of a memory cell that fill out tight spacing therebetween, which may decrease the propensity of void formation and resulting shorting between neighboring memory cell features.Type: ApplicationFiled: September 30, 2021Publication date: March 30, 2023Inventors: Ashim Dutta, Lili Cheng, Chih-Chao Yang
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Publication number: 20220414130Abstract: The disclosure herein describes providing responses to natural language queries associated with transcripts at least by searching multiple indexes. A transcript associated with a communication among a plurality of speakers is obtained, wherein sets of artifact sections are identified in the transcript. A set of section indexes is generated from the transcript based on artifact type definitions. A natural language query associated with the transcript is analyzed using a natural language model and query metadata of the analyzed natural language query is obtained. At least one section index of the set of section indexes is selected based on the obtained query metadata and that selected at least one section index is searched. A response to the natural language query is provided including result data from the searched at least one search index, wherein the result data includes a reference to an artifact section referenced by the searched section index(es).Type: ApplicationFiled: June 25, 2021Publication date: December 29, 2022Inventors: Karen MASTER BEN-DOR, Lili CHENG, Adi DIAMANT, Raz HALALY, Eshchar ZYCHLINSKI, Thomas Matthew LAIRD-MCCONNELL, Sonja Sabina KNOLL, Daniel DOS SANTOS MARQUES, Shunfu MAO
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Publication number: 20220405068Abstract: The present disclosure relates to systems, methods and computer readable media for providing tools and features related to developing asset packages that may be incorporated within the framework of various bot packages. For example, systems disclosed herein can provide an asset development interface that enables a user of a computing device to develop various types of bot packages by adding and/or modifying asset packages. The systems provide a mechanism whereby a developer can obtain an asset package including one or more discrete action components that are pre-configured and pre-packaged in a way that enables the asset package to be incorporated into the framework of the bot or, alternatively, within the framework of another asset package. The systems described herein further enable content of the asset packages to be selectively accessible to users and associated computing devices that are authorized to view and use the asset packages.Type: ApplicationFiled: June 16, 2021Publication date: December 22, 2022Inventors: Benjamin Abraham BROWN, Steven Wayne ICKMAN, Christopher Lee MULLINS, Christopher Michael WHITTEN, Lili CHENG, Scott Jeff GELLOCK