Abstract: A socket apparatus for testing a semiconductor package includes a main body having a plurality of contact pins therein, a locking member disposed in the main body for securing the semiconductor package that is to be loaded into the main body, an unlocking member for releasing the package secured by the locking member, and a cover disposed above the locking member and the unlocking member. The socket apparatus improves a contactability between the external terminals of the package and the contact pins during the package testing and decreases production cost due to its simplified composition.