Patents by Inventor Linda E. Strauman

Linda E. Strauman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5877551
    Abstract: A semiconductor package is provided that has a rigid metal substrate and a dielectric layer covering a first portion of the rigid metal substrate, with a second portion of the rigid metal substrate being substantially free of the dielectric layer. A semiconductor device is electrically bonded to the second portion of the rigid metal substrate and metal circuit traces defining electrical paths are formed on the dielectric layer, at least one of which contacts the rigid metal substrate through at least one via in the dielectric layer. Additionally, a method is provided for grounding a semiconductor device and at least one circuit trace on a rigid metal substrate substantially covered by a dielectric layer, which includes creating at least one via in the dielectric layer using a laser and creating circuit traces on the dielectric layer, at least one of which contacts the rigid metal substrate through at least one of the vias.
    Type: Grant
    Filed: November 18, 1996
    Date of Patent: March 2, 1999
    Assignee: Olin Corporation
    Inventors: Salvador A. Tostado, George A. Brathwaite, Paul R. Hoffman, George A. Erfe, Serafin P. Pedron, Jr., Michael A. Raftery, Kambhampati Ramakrishna, German J. Ramirez, Linda E. Strauman
  • Patent number: 5239131
    Abstract: There is provided an electronic package assembly having a die attach paddle bonded to the package base by a compliant adhesive. A recessed channel formed in the base is partially overlapped by the die attach paddle. During package sealing, excess adhesive accumulates in the recessed channel, eliminating bridging of the adhesive to the leadframe.
    Type: Grant
    Filed: July 13, 1992
    Date of Patent: August 24, 1993
    Assignee: Olin Corporation
    Inventors: Paul R. Hoffman, Linda E. Strauman, Dexin Liang, Sonny S. Pareno, German J. Ramirez