Patents by Inventor Linda Zhang
Linda Zhang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11962162Abstract: An accessory device is disclosed. The accessory device may include multiple pockets, or sleeves, designed to carry items, such as an electronic device and a user's personal items (e.g., credits cards, cash, etc.). The accessory device also includes a magnet embedded in a back section, with the magnet designed to align an inductive charging mechanism that can charge the electronic device's battery when the electronic device is positioned within the accessory device. To improve charging efficiency, the back section also includes a structural layer designed to keep the back section flat when the electronic device is positioned within the accessory device. The structural layer can hide/obscure the magnet and other structures. Also, the accessory device includes a wireless communication circuit that can communicate with a corresponding wireless communication circuit in the electronic device, and provide information (e.g., openings and dimensional information of the accessory device) to the electronic device.Type: GrantFiled: January 12, 2021Date of Patent: April 16, 2024Assignee: Apple, Inc.Inventors: Bryan A. Cloyd, Linda D. Benavente-Notaro, Chengrui Zhang, Sara Rusignuolo
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Patent number: 11944627Abstract: The present disclosure provides methods for treating hematological malignancies and Ewings sarcoma using menin inhibitors. Compositions for use in these methods are also provided.Type: GrantFiled: March 22, 2018Date of Patent: April 2, 2024Assignee: KURA ONCOLOGY, INC.Inventors: Francis Burrows, Linda V. Kessler, Liansheng Li, Pingda Ren, Yi Wang, Tao Wu, Jingchuan Zhang
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Patent number: 11917761Abstract: A surface mount device having features on contacts to prevent the surface mount device from tombstoning. The feature may be channel defined by the contact that helps balance a torque/force applied on each side of the surface mount device during a reflow soldering process. The feature may also be a solder mask that helps balance a torque/force applied on each side of the surface mount device during a reflow soldering process.Type: GrantFiled: March 7, 2022Date of Patent: February 27, 2024Assignee: Western Digital Technologies, Inc.Inventors: Joyce Chen, Lynn Lin, Emma Wang, Linda Huang, Cong Zhang, Zengyu Zhou, Juan Zhou
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Publication number: 20230418562Abstract: An interactive graphic design system design interface is described to enable design users to create a variant component that links multiple design elements as variants, where each variant represents a state or version of a run-time object, feature or user-interface.Type: ApplicationFiled: June 30, 2023Publication date: December 28, 2023Inventors: Rasmus Andersson, Sho Kuwamoto, Nikolas Klein, James Wong, Ryan Kaplan, Kelsey Whelan, Matthew Huang, Sawyer Hood, Andrew Heine, Jessica Liu, Marcin Wichary, Linda Zhang, Josh Shi, Golf Sinteppadon, Naomi Jung, Andrew Chan, Daniel Furse
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Patent number: 11733973Abstract: An interactive graphic design system design interface is described to enable design users to create a variant component that links multiple design elements as variants, where each variant represents a state or version of a run-time object, feature or user-interface.Type: GrantFiled: September 16, 2021Date of Patent: August 22, 2023Inventors: Rasmus Andersson, Sho Kuwamoto, Nikolas Klein, James Wong, Ryan Kaplan, Kelsey Whelan, Matthew Huang, Sawyer Hood, Andrew Heine, Jessica Liu, Marcin Wichary, Linda Zhang, Josh Shi, Golf Sinteppadon, Naomi Jung, Andrew Chan, Daniel Furse
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Publication number: 20230152431Abstract: An example method includes receiving point cloud information about a field of view of a lidar system. The point cloud information includes spatiotemporal and amplitude information about return light received. The method also includes determining, based on the point cloud information, a set of bright light returns from at least one highly reflective object. The bright light returns include return light having an amplitude above a photon threshold and a corresponding bright light return range. The method yet further includes determining, based on the point cloud information, a set of crosstalk returns. The crosstalk returns include return light having a corresponding crosstalk return range. The method includes adjusting, based on a normalized number of crosstalk returns, at least one of: a cleaning system, an operating mode of a lidar system, or an operating mode of a vehicle.Type: ApplicationFiled: November 17, 2021Publication date: May 18, 2023Inventors: Jingyuan Linda Zhang, Caner Onal
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Publication number: 20220390612Abstract: Aspects and implementations of the present disclosure address challenges of the existing technology by enabling lidar-assisted identification and characterization of visibility-reducing media (VRM) such as fog, rain, snow, dust in autonomous vehicle applications, using lidar sensing. VRM can be identified and characterized using a variety of techniques, including analyzing a spatial distribution of low-intensity lidar returns, detecting pulse elongation of VRM-returns associated with reflection from VRM, determining intensity of VRM-returns, determining reduction of intensity of returns from various reference objects, and other techniques.Type: ApplicationFiled: June 7, 2021Publication date: December 8, 2022Inventors: Yuchi Wang, Rui Wu, Jingyuan Linda Zhang
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Publication number: 20220083316Abstract: An interactive graphic design system design interface is described to enable design users to create a variant component that links multiple design elements as variants, where each variant represents a state or version of a run-time object, feature or user-interface.Type: ApplicationFiled: September 16, 2021Publication date: March 17, 2022Inventors: Rasmus Andersson, Sho Kuwamoto, Nikolas Klein, James Wong, Ryan Kaplan, Kelsey Whelan, Matthew Huang, Sawyer Todd, Andrew Heine, Jessica Liu, Marcin Wichary, Linda Zhang, Josh Shi, Golf Sintepaddon, Naomi Jung, Andrew Chan, Daniel Furse
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Patent number: 9666549Abstract: Generally discussed herein are systems and apparatuses that include an extended TSBA ball and techniques for making the same. According to an example, a technique can include forming a circuit substrate including forming a circuit on a substrate, the circuit exposed along an upper surface of the substrate, wherein the substrate is for coupling the circuit with a die along a lower surface of the circuit substrate. A molding can be formed onto an upper surface of the circuit substrate, over the circuit of the circuit substrate. An opening can be defined in the molding so that the opening can extend to a top surface of the molding to at least a portion of the circuit. Solder can be formed into the opening, including conforming the solder to the opening and the circuit substrate.Type: GrantFiled: October 9, 2015Date of Patent: May 30, 2017Assignee: Intel CorporationInventors: Chia-Pin Chiu, Xiaorong Xiong, Linda Zhang, Robert Nickerson, Charles Gealer
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Publication number: 20160045422Abstract: Provided are compositions comprising a gloss agent having a refractive index of 1.4 or greater, an emollient film facilitator having a viscosity of 300 cPs or greater, and a film-forming polymer, wherein the composition comprises a greater amount, on a weight percent basis, of emollient film facilitator than gloss agent. Also provided are methods of providing radiance to the skin by applying to the skin a composition of the present invention.Type: ApplicationFiled: May 14, 2012Publication date: February 18, 2016Applicant: Johnson & Johnson Consumer Companies, Inc.Inventors: Samuel HUANG, Lydia ZENG, Amigo GU, Linda ZHANG, Jiang WU
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Publication number: 20160043049Abstract: Generally discussed herein are systems and apparatuses that include an extended TSBA ball and techniques for making the same. According to an example, a technique can include forming a circuit substrate including forming a circuit on a substrate, the circuit exposed along an upper surface of the substrate, wherein the substrate is for coupling the circuit with a die along a lower surface of the circuit substrate. A molding can be formed onto an upper surface of the circuit substrate, over the circuit of the circuit substrate. An opening can be defined in the molding so that the opening can extend to a top surface of the molding to at least a portion of the circuit. Solder can be formed into the opening, including conforming the solder to the opening and the circuit substrate.Type: ApplicationFiled: October 9, 2015Publication date: February 11, 2016Inventors: Chia-Pin Chiu, Xiaorong Xiong, Linda Zhang, Robert Nickerson, Charles Gealer
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Patent number: 9159690Abstract: Generally discussed herein are systems and apparatuses that include an extended TSBA ball and techniques for making the same. A package can include a chip package situated below a lower surface of a first substrate, the package including a die situated on a top surface of a second substrate, a molding disposed over the upper surface of the second substrate, the molding extending over the second die and including an opening extending from an upper surface of the molding towards an upper surface of the second substrate, wherein the opening is configured to admit at least a portion of the solder ball, and a solder column electrically and mechanically coupled to the second substrate, situated in the opening, conforming to the cylinder, and including at least two layers of solder with flux therebetween.Type: GrantFiled: September 25, 2013Date of Patent: October 13, 2015Assignee: Intel CorporationInventors: Chia-Pin Chiu, Xiaorong Xiong, Linda Zhang, Robert Nickerson, Charles Gealer
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Publication number: 20150084192Abstract: Generally discussed herein are systems and apparatuses that include an extended TSBA ball and techniques for making the same. According to an example, a technique can include forming a circuit substrate including forming a circuit on a substrate, the circuit exposed along an upper surface of the substrate, wherein the substrate is for coupling the circuit with a die along a lower surface of the circuit substrate. A molding can be formed onto an upper surface of the circuit substrate, over the circuit of the circuit substrate. An opening can be defined in the molding so that the opening can extend to a top surface of the molding to at least a portion of the circuit. Solder can be formed into the opening, including conforming the solder to the opening and the circuit substrate.Type: ApplicationFiled: September 25, 2013Publication date: March 26, 2015Inventors: Chia-Pin Chiu, Xiaorong Xiong, Linda Zhang, Robert Nickerson, Charles Gealer
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Patent number: 8580477Abstract: Embodiments in accordance with the present invention encompass negative-tone, aqueous base developable, self-imageable polymer compositions useful for forming films that can be patterned to create structures for microelectronic devices, microelectronic packaging, microelectromechanical systems, optoelectronic devices and displays.Type: GrantFiled: September 21, 2009Date of Patent: November 12, 2013Assignee: Promerus LLCInventors: Brian Knapp, Edmund Elce, Andrew Bell, Cheryl Burns, Sridevi Kaiti, Brian Kocher, Hendra Ng, Yogesh Patel, Masanobu Sakamoto, Xiaoming Wu, Linda Zhang
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Publication number: 20110070543Abstract: Embodiments in accordance with the present invention encompass negative-tone, aqueous base developable, self-imageable polymer compositions useful for forming films that can be patterned to create structures for microelectronic devices, microelectronic packaging, microelectromechanical systems, optoelectronic devices and displays.Type: ApplicationFiled: September 21, 2009Publication date: March 24, 2011Applicant: PROMERUS LLCInventors: Brian Knapp, Edmund Elce, Andrew Bell, Cheryl Burns, Sridevi Kaiti, Brian Kocher, Hendra Ng, Yogesh Patel, Masanobu Sakamoto, Xiaoming Wu, Linda Zhang
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Patent number: 7875686Abstract: Polymeric compositions for semiconductor applications comprising 10 to 99 wt. % of norbornene-type cycloolefin monomers represented by one or more of Formula I(a), I(b), and optionally I(c) and/or I(d), 0.0005 to 0.5 wt. % of an addition polymerization procatalyst, and optionally: up to 0.5 wt. % of a cocatalyst, up to 59 wt. % of a crosslinking monomer, up to 50 wt. % of a viscosifier, up to 20 wt. % of a thixotropic additive(s), up to 80 wt. % of a filler, up to 10 wt. % of an antioxidant, and up to 0.6 wt. % of an antioxidant synergist, the total of the components of the formulation adding up to 100%. Such formulations are mass polymerized, or cured, to form polymeric compositions that have properties desirable for a variety of specific electronic, microelectronic, optoelectronic and micro-optoelectronic applications such as die attach adhesives, underfill materials, prepreg binders, encapsulants, protective layers, and other related applications.Type: GrantFiled: August 16, 2005Date of Patent: January 25, 2011Assignee: Promerus LLCInventors: Ramakrisha Ravikiran, Hendra Ng, Rajesh Raja Puthenkovilakom, Linda Zhang, Dino Amoroso, Brian Knapp, Andrew Bell, Larry F. Rhodes
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Publication number: 20060041093Abstract: Polymeric compositions for semiconductor applications comprising 10 to 99 wt. % of norbornene-type cycloolefin monomers represented by one or more of Formulae I(a), I(b), and optionally I(c) and/or I(d), 0.0005 to 0.5 wt. % of an addition polymerization procatalyst, and optionally: up to 0.5 wt. % of a cocatalyst, up to 59 wt. % of a crosslinking monomer, up to 50 wt. % of a viscosifier, up to 20 wt. % of a thixotropic additive(s), up to 80 wt. % of a filler, up to 10 wt. % of an antioxidant, and up to 0.6 wt. % of an antioxidant synergist, the total of the components of the formulation adding up to 100%. Such formulations are mass polymerized, or cured, to form polymeric compositions that have properties desirable for a variety of specific electronic, microelectronic, optoelectronic and micro-optoelectronic applications such as die attach adhesives, underfill materials, prepreg binders, encapsulants, protective layers, and other related applications.Type: ApplicationFiled: August 16, 2005Publication date: February 23, 2006Inventors: Ramakrisha Ravikiran, Hendra Ng., Rajesh Puthenkovilakom, Linda Zhang, Dino Amoroso, Brian Knapp, Andrew Bell, Larry Rhodes
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Patent number: 6693826Abstract: A method and apparatus for characterizing and sensing the stability of a magnetic memory element. The method comprises setting a reference threshold, reading the state signal of the memory element, and comparing the magnitude of the state signal to the reference threshold, such that a state signal exceeding the reference threshold is considered stable. The apparatus comprises a reference generator having an output that is compared, in a windowed comparator, to the state signal magnitude, such that an output signal of the windowed comparator can be used to characterize the stability of the memory element.Type: GrantFiled: July 29, 2002Date of Patent: February 17, 2004Assignee: Iowa State University Research Foundation, Inc.Inventors: William C. Black, Jr., Ruili (Linda) Zhang