Patents by Inventor Lisa K. Figge

Lisa K. Figge has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6743856
    Abstract: Novel processes for preparing hydridosiloxane and organohydridosiloxane resins are disclosed. The processes of the invention broadly provide for the steps of contacting a silane monomer with a phase transfer catalyst in the presence of a reaction mixture that includes a nonpolar, e.g., hydrocarbon, solvent, and a polar solvent, e.g., alcohol and water. The process is conducted under conditions effective to catalytically convert said silane monomer into hydridosiloxane and organohydridosiloxane resins. Recovery of the products is advantageously aided by the ease of separating the phase transfer catalyst from the dual phase reaction mixture by separating the immiscible polar solvent carrying the catalyst from the nonpolar solvent, that carries the product. Hydridosiloxane and organohydridosiloxane resins produced by the processes of the invention are also provided.
    Type: Grant
    Filed: February 16, 2000
    Date of Patent: June 1, 2004
    Assignee: Honeywell International Inc.
    Inventors: Nigel P. Hacker, Lisa K. Figge, Scott Lefferts
  • Patent number: 6361820
    Abstract: A method of making a dielectric film on a substrate from a composition containing an organohydridosiloxane resin is presented. The organohydridosiloxane resins have a cage conformation and 40 mole percent or greater of an organic substituent. The process of making a dielectric film includes forming a solution of a solvent and the organohydridosiloxane resin, dispensing the solution on a substrate, spinning the substrate, baking the substrate to remove the solvent, and curing the substrate to form the dielectric film. The dielectric films of the present invention exhibit dielectric constants of approximately 2.8 or lower.
    Type: Grant
    Filed: June 30, 2000
    Date of Patent: March 26, 2002
    Assignee: Honeywell International Inc.
    Inventors: Nigel P. Hacker, Scott P. Lefferts, Lisa K. Figge, Michael D. Slessor
  • Patent number: 6358559
    Abstract: A method of making a dielectric film on a substrate from a composition containing an organohydridosiloxane resin is presented. The organohydridosiloxane resins have a cage conformation and up to 40 mole percent of an organic substituent. The process of making a dielectric film includes forming a solution of a solvent and the organohydridosiloxane resin, dispensing the solution on a substrate, spinning the substrate, baking the substrate to remove the solvent, and curing the substrate to form the dielectric film. The dielectric films of the present invention exhibit dielectric constants of approximately 3 or lower.
    Type: Grant
    Filed: June 30, 2000
    Date of Patent: March 19, 2002
    Assignee: Honeywell International Inc.
    Inventors: Nigel P. Hacker, Scott P. Lefferts, Lisa K. Figge, Michael D. Slessor
  • Patent number: 6218020
    Abstract: A method of making a dielectric film on a substrate from a composition containing an organohydridosiloxane resin is presented. The organohydridosiloxane resins have a cage conformation and 40 mole percent or greater of an organic substituent. The process of making a dielectric film includes forming a solution of a solvent and the organohydridosiloxane resin, dispensing the solution on a substrate, spinning the substrate, baking the substrate to remove the solvent, and curing the substrate to form the dielectric film. The dielectric films of the present invention exhibit dielectric constants of approximately 2.8 or lower.
    Type: Grant
    Filed: January 7, 1999
    Date of Patent: April 17, 2001
    Assignee: AlliedSignal Inc.
    Inventors: Nigel P. Hacker, Scott P. Lefferts, Lisa K. Figge
  • Patent number: 6177199
    Abstract: A method of making a dielectric film on a substrate from a composition containing an organohydridosiloxane resin is presented. The organohydridosiloxane resins have a cage conformation and up to 40 mole percent of an organic substituent. The process of making a dielectric film includes forming a solution of a solvent and the organohydridosiloxane resin, dispensing the solution on a substrate, spinning the substrate, baking the substrate to remove the solvent, and curing the substrate to form the dielectric film. The dielectric films of the present invention exhibit dielectric constants of approximately 3 or lower.
    Type: Grant
    Filed: January 7, 1999
    Date of Patent: January 23, 2001
    Assignee: AlliedSignal Inc.
    Inventors: Nigel P. Hacker, Scott P. Lefferts, Lisa K. Figge
  • Patent number: 6043330
    Abstract: Novel processes for preparing hydridosiloxane and organohydridosiloxane resins are disclosed. The processes of the invention broadly provide for the steps of contacting a silane monomer with a phase transfer catalyst in the presence of a reaction mixture that includes a nonpolar, e.g., hydrocarbon, solvent, and a polar solvent, e.g., alcohol and water. The process is conducted under conditions effective to catalytically convert said silane monomer into hydridosiloxane and organohydridosiloxane resins. Recovery of the products is advantageously aided by the ease of separating the phase transfer catalyst from the dual phase reaction mixture by separating the immiscible polar solvent carrying the catalyst from the nonpolar solvent that carries the product. Hydridosiloxane and organohydridosiloxane resins produced by the processes of the invention are also provided.
    Type: Grant
    Filed: April 6, 1998
    Date of Patent: March 28, 2000
    Assignee: AlliedSignal Inc.
    Inventors: Nigel P. Hacker, Lisa K. Figge, Scott Lefferts