Patents by Inventor Logan Brook Hedin

Logan Brook Hedin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140020933
    Abstract: A printed circuit board that includes a dielectric polymer layer having a thermally conductive agglomerate filler and an electrically conductive layer bonded to the dielectric polymer layer is provided. Methods of producing the printed circuit board are also provided. The subject printed circuit board and methods find use in a variety of different applications, including electronics applications.
    Type: Application
    Filed: July 16, 2013
    Publication date: January 23, 2014
    Inventors: Nicholas Ryan Conley, Logan Brook Hedin, David Michael Miller
  • Publication number: 20100012354
    Abstract: A printed circuit board has a liquid crystalline polymer layer that is bonded to an electrically conductive layer that includes traces that electrically connect components mounted on the printed circuit board. The liquid crystalline polymer material is thermally conductive and dielectric. When the components produce heat, the liquid crystalline polymer layer absorbs and dissipates the heat produced by the electrical components mounted on the printed circuit board. The thermal equilibrium of the printed circuit board is lower than the maximum operating temperature of the components.
    Type: Application
    Filed: July 13, 2009
    Publication date: January 21, 2010
    Inventors: Logan Brook Hedin, David Michael Miller