Patents by Inventor Lorenzo Baldo

Lorenzo Baldo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170205065
    Abstract: A lighting device may be produced by providing a protected elongate light emitting module, including a substrate with at least one electrically-powered light radiation source, and at least one sealing mass protecting light radiation source(s), and by coupling to said light emitting module a channel-shaped cover member with a body portion including light permeable material and side portions, with the side portions of the cover member embracing and locking therebetween the light emitting module and with light radiation source(s) facing towards body portion of cover member, whereby the light permeable material provides a propagation path for the light radiation from light radiation source(s).
    Type: Application
    Filed: January 19, 2017
    Publication date: July 20, 2017
    Inventors: Alberto Zanotto, Simone Massaro, Thomas Rieger, Roberto Didone', Simon Bobbo, Lorenzo Baldo
  • Patent number: 9688531
    Abstract: A micro-electro-mechanical device formed in a monolithic body of semiconductor material accommodating a first buried cavity; a sensitive region above the first buried cavity; and a second buried cavity extending in the sensitive region. A decoupling trench extends from a first face of the monolithic body as far as the first buried cavity and laterally surrounds the second buried cavity. The decoupling trench separates the sensitive region from a peripheral portion of the monolithic body.
    Type: Grant
    Filed: June 23, 2016
    Date of Patent: June 27, 2017
    Assignee: STMicroelectronics S.r.l.
    Inventors: Lorenzo Baldo, Enri Duqi, Flavio Francesco Villa
  • Publication number: 20170144881
    Abstract: A micro-electro-mechanical device formed in a monolithic body of semiconductor material accommodating a first buried cavity; a sensitive region above the first buried cavity; and a second buried cavity extending in the sensitive region. A decoupling trench extends from a first face of the monolithic body as far as the first buried cavity and laterally surrounds the second buried cavity. The decoupling trench separates the sensitive region from a peripheral portion of the monolithic body.
    Type: Application
    Filed: June 23, 2016
    Publication date: May 25, 2017
    Inventors: Lorenzo Baldo, Enri Duqi, Flavio Francesco Villa
  • Patent number: 9628919
    Abstract: An assembly of a MEMS sensor device envisages: a first die, integrating a micromechanical detection structure and having an external main face; a second die, integrating an electronic circuit operatively coupled to the micromechanical detection structure, electrically and mechanically coupled to the first die and having a respective external main face. Both of the external main faces of the first die and of the second die are set in direct contact with an environment external to the assembly, without interposition of a package.
    Type: Grant
    Filed: April 29, 2014
    Date of Patent: April 18, 2017
    Assignee: STMICROELECTRONICS S.R.L.
    Inventors: Sebastiano Conti, Matteo Perletti, Roberto Carminati, Lorenzo Baldo, Alessandro Morcelli
  • Publication number: 20170013693
    Abstract: Various embodiments may relate to a lighting system including a string of light sources connected in series between a first terminal and a second terminal, wherein at least one electrical contact of the string of light sources is accessible. The system further includes a protection circuit that protects the light sources from an electrostatic discharge applied to the electrical contact that is accessible. In particular, the protection circuit includes at least one TVS diode or set of antiparallel diodes connected to the second terminal, and for each electrical contact a respective capacitor connected between the respective electrical contact and a TVS diode or set of antiparallel diodes, in such a way that an electrostatic event applied to an electrical contact is discharged through the respective capacitor and the respective TVS diode or set of antiparallel diodes towards the second terminal.
    Type: Application
    Filed: November 26, 2014
    Publication date: January 12, 2017
    Inventors: Alessio GRIFFONI, Lorenzo BALDO
  • Patent number: 9534974
    Abstract: A pressure sensor includes a body made of semiconductor material having a first type of conductivity and a pressure-sensitive structure having the first type of conductivity defining a suspended membrane. One or more piezoresistive elements having a second type of conductivity (P) are formed in the suspended membrane. The piezoresistive elements form, with the pressure-sensitive structure, respective junction diodes. A temperature sensing method includes: generating a first current between conduction terminals common to the junction diodes; detecting a first voltage value between the common conduction terminals when the first current is supplied; and correlating the detected first voltage value to a value of temperature of the diodes. The temperature value thus calculated can be used for correcting the voltage signal generated at output by the pressure sensor when the latter is operated for sensing an applied outside pressure which deforms the suspended membrane.
    Type: Grant
    Filed: February 1, 2013
    Date of Patent: January 3, 2017
    Assignee: STMICROELECTRONICS S.R.L.
    Inventors: Michele Vaiana, Mario Chiricosta, Mario Maiore, Lorenzo Baldo, Paul Georges Marie Rose
  • Publication number: 20160365656
    Abstract: In various embodiments, a connector for a lighting device is provided. The lighting device has a planar support with at least one electrical contact formation at an edge of the planar support. The connector includes a fork-shaped shell with a notch coupleable with said planar support edge with said planar support edge inserted in said notch, and an electrical contact structure on at least one side of said notch configured to provide electrical contact with an electrical contact formation on said edge inserted in said notch.
    Type: Application
    Filed: May 23, 2016
    Publication date: December 15, 2016
    Inventors: Simon Bobbo, Lorenzo Baldo, Alberto Zanotto
  • Patent number: 9518886
    Abstract: A pressure sensor includes a body made of semiconductor material having a first type of conductivity and a pressure-sensitive structure having the first type of conductivity defining a suspended membrane. One or more piezoresistive elements having a second type of conductivity (P) are formed in the suspended membrane. The piezoresistive elements form, with the pressure-sensitive structure, respective junction diodes. A temperature sensing method includes: generating a first current between conduction terminals common to the junction diodes; detecting a first voltage value between the common conduction terminals when the first current is supplied; and correlating the detected first voltage value to a value of temperature of the diodes. The temperature value thus calculated can be used for correcting the voltage signal generated at output by the pressure sensor when the latter is operated for sensing an applied outside pressure which deforms the suspended membrane.
    Type: Grant
    Filed: November 24, 2015
    Date of Patent: December 13, 2016
    Assignee: STMicroelectronics S.r.l.
    Inventors: Lorenzo Baldo, Michele Vaiana, Mario Chiricosta, Mario Maiore, Paul Georges Marie Rose
  • Publication number: 20160076962
    Abstract: A pressure sensor includes a body made of semiconductor material having a first type of conductivity and a pressure-sensitive structure having the first type of conductivity defining a suspended membrane. One or more piezoresistive elements having a second type of conductivity (P) are formed in the suspended membrane. The piezoresistive elements form, with the pressure-sensitive structure, respective junction diodes. A temperature sensing method includes: generating a first current between conduction terminals common to the junction diodes; detecting a first voltage value between the common conduction terminals when the first current is supplied; and correlating the detected first voltage value to a value of temperature of the diodes. The temperature value thus calculated can be used for correcting the voltage signal generated at output by the pressure sensor when the latter is operated for sensing an applied outside pressure which deforms the suspended membrane.
    Type: Application
    Filed: November 24, 2015
    Publication date: March 17, 2016
    Applicant: STMicroelectronics S.r.l.
    Inventors: Lorenzo Baldo, Michele Vaiana, Mario Chiricosta, Mario Maiore, Paul Georges Marie Rose
  • Patent number: 8901925
    Abstract: A magnetoresistive element formed by a strip of magnetoresistive material which extends on a substrate of semiconductor material having an upper surface. The strip comprises at least one planar portion which extends parallel to the upper surface, and at least one transverse portion which extends in a direction transverse to the upper surface. The transverse portion is formed on a transverse wall of a dig. By providing a number of magnetoresistive elements perpendicular to one another it is possible to obtain an electronic compass that is insensitive to oscillations with respect to the horizontal plane parallel to the surface of the Earth.
    Type: Grant
    Filed: September 10, 2012
    Date of Patent: December 2, 2014
    Assignee: STMicroelectronics S.r.l.
    Inventors: Benedetto Vigna, Simone Sassolini, Lorenzo Baldo, Francesco Procopio
  • Publication number: 20140319630
    Abstract: An assembly of a MEMS sensor device envisages: a first die, integrating a micromechanical detection structure and having an external main face; a second die, integrating an electronic circuit operatively coupled to the micromechanical detection structure, electrically and mechanically coupled to the first die and having a respective external main face. Both of the external main faces of the first die and of the second die are set in direct contact with an environment external to the assembly, without interposition of a package.
    Type: Application
    Filed: April 29, 2014
    Publication date: October 30, 2014
    Applicant: STMicroelectronics S.r.l.
    Inventors: Sebastiano Conti, Matteo Perletti, Roberto Carminati, Lorenzo Baldo, Alessandro Morcelli
  • Patent number: 8847340
    Abstract: Electronic device including a substrate provided with at least one passing opening, a MEMS device with a differential sensor provided with a first and a second surface having at least one portion sensitive to chemical and/or physical variations of fluids present in correspondence with a first and a second opposed active surface thereof. The first surface of the MEMS device leaves the first active surface exposed and the second surface being provided with a further opening which exposes said second opposed active surface, the electronic device being characterized in that the first surface of the MEMS device faces the substrate and is spaced therefrom by a predetermined distance, the sensitive portion being aligned to the passing opening of the substrate, and in that it also comprises a protective package, which incorporates at least partially the MEMS device and the substrate.
    Type: Grant
    Filed: May 31, 2013
    Date of Patent: September 30, 2014
    Assignee: STMicroelectronics S.r.l.
    Inventors: Lorenzo Baldo, Chantal Combi, Mario Francesco Cortese
  • Patent number: 8796059
    Abstract: Electronic device including a substrate provided with at least one passing opening, a MEMS device with a differential sensor provided with a first and a second surface having at least one portion sensitive to chemical and/or physical variations of fluids present in correspondence with a first and a second opposed active surface thereof. The first surface of the MEMS device leaving the first active surface exposed and the second surface being provided with a further opening which exposes said second opposed active surface, the electronic device being characterized in that the first surface of the MEMS device faces the substrate and is spaced therefrom by a predetermined distance, the sensitive portion being aligned to the passing opening of the substrate, and in that it also comprises a protective package, which incorporates at least partially the MEMS device and the substrate.
    Type: Grant
    Filed: January 25, 2012
    Date of Patent: August 5, 2014
    Assignee: STMicroelectronics S.r.l.
    Inventors: Lorenzo Baldo, Chantal Combi, Mario Francesco Cortese
  • Patent number: 8760156
    Abstract: Two suspended masses are configured so as to be flowed by respective currents flowing in the magnetometer plane in mutually transversal directions and are capacitively coupled to lower electrodes. Mobile sensing electrodes are carried by the first suspended mass and are capacitively coupled to respective fixed sensing electrodes. The first suspended mass is configured so as to be mobile in a direction transversal to the plane in presence of a magnetic field having a component in a first horizontal direction. The second suspended mass is configured so as to be mobile in a direction transversal to the plane in presence of a magnetic field having a component in a second horizontal direction, and the first suspended mass is configured so as to be mobile in a direction parallel to the plane and transversal to the current flowing in the first suspended mass in presence of a magnetic field having a component in a vertical direction.
    Type: Grant
    Filed: May 29, 2013
    Date of Patent: June 24, 2014
    Assignee: STMicroelectronics S.r.l.
    Inventors: Lorenzo Baldo, Francesco Procopio, Sarah Zerbini
  • Patent number: 8679887
    Abstract: A method for manufacturing a micro-electro-mechanical device, which has supporting parts and operative parts, includes providing a first semiconductor wafer, having a first layer of semiconductor material and a second layer of semiconductor material arranged on top of the first layer, forming first supporting parts and first operative parts of the device in the second layer, forming temporary anchors in the first layer, and bonding the first wafer to a second wafer, with the second layer facing the second wafer. After bonding the first wafer and the second wafer together, second supporting parts and second operative parts of said device are formed in the first layer. The temporary anchors are removed from the first layer to free the operative parts formed therein.
    Type: Grant
    Filed: April 26, 2012
    Date of Patent: March 25, 2014
    Assignee: STMicroelectronics S.r.l.
    Inventors: Simone Sassolini, Mauro Marchi, Marco Del Sarto, Lorenzo Baldo
  • Publication number: 20140077798
    Abstract: Two suspended masses are configured so as to be flowed by respective currents flowing in the magnetometer plane in mutually transversal directions and are capacitively coupled to lower electrodes. Mobile sensing electrodes are carried by the first suspended mass and are capacitively coupled to respective fixed sensing electrodes. The first suspended mass is configured so as to be mobile in a direction transversal to the plane in presence of a magnetic field having a component in a first horizontal direction. The second suspended mass is configured so as to be mobile in a direction transversal to the plane in presence of a magnetic field having a component in a second horizontal direction, and the first suspended mass is configured so as to be mobile in a direction parallel to the plane and transversal to the current flowing in the first suspended mass in presence of a magnetic field having a component in a vertical direction.
    Type: Application
    Filed: May 29, 2013
    Publication date: March 20, 2014
    Inventors: Lorenzo Baldo, Francesco Procopio, Sarah Zerbini
  • Patent number: 8575710
    Abstract: A capacitive semiconductor pressure sensor, comprising: a bulk region of semiconductor material; a buried cavity overlying a first part of the bulk region; and a membrane suspended above said buried cavity, wherein, said bulk region and said membrane are formed in a monolithic substrate, and in that said monolithic substrate carries structures for transducing the deflection of said membrane into electrical signals, wherein said bulk region and said membrane form electrodes of a capacitive sensing element, and said transducer structures comprise contact structures in electrical contact with said membrane and with said bulk region.
    Type: Grant
    Filed: April 13, 2012
    Date of Patent: November 5, 2013
    Assignee: STMicroelectronics S.r.l.
    Inventors: Flavio Francesco Villa, Gabriele Barlocchi, Pietro Corona, Benedetto Vigna, Lorenzo Baldo
  • Publication number: 20130264662
    Abstract: Electronic device including a substrate provided with at least one passing opening, a MEMS device with a differential sensor provided with a first and a second surface having at least one portion sensitive to chemical and/or physical variations of fluids present in correspondence with a first and a second opposed active surface thereof. The first surface of the MEMS device leaves the first active surface exposed and the second surface being provided with a further opening which exposes said second opposed active surface, the electronic device being characterized in that the first surface of the MEMS device faces the substrate and is spaced therefrom by a predetermined distance, the sensitive portion being aligned to the passing opening of the substrate, and in that it also comprises a protective package, which incorporates at least partially the MEMS device and the substrate.
    Type: Application
    Filed: May 31, 2013
    Publication date: October 10, 2013
    Inventors: Lorenzo BALDO, Chantal COMBI, Mario Francesco CORTESE
  • Patent number: 8546895
    Abstract: An electronic device includes a substrate provided with a passing opening and a MEMS device including an active surface wherein a portion of the MEMS device is integrated sensitive to chemical/physical variations of a fluid. The active surface of the MEMS device faces the substrate and is spaced therefrom, the sensitive portion being aligned to the opening. A protective package incorporates at least partially the MEMS device and the substrate, leaving at least the sensitive portion of the MEMS device, and the opening of the substrate exposed. A barrier element is positioned in an area which surrounds the sensitive portion to realize a protection structure for the MEMS device, so that the sensitive portion is free.
    Type: Grant
    Filed: October 17, 2011
    Date of Patent: October 1, 2013
    Assignees: STMicroelectronics S.r.l., STMicroelectronics (Malta) Ltd
    Inventors: Mario Cortese, Mark Anthony Azzopardi, Edward Myers, Chantal Combi, Lorenzo Baldo
  • Patent number: 8471557
    Abstract: Two suspended masses are configured so as to be flowed by respective currents flowing in the magnetometer plane in mutually transversal directions and are capacitively coupled to lower electrodes. Mobile sensing electrodes are carried by the first suspended mass and are capacitively coupled to respective fixed sensing electrodes. The first suspended mass is configured so as to be mobile in a direction transversal to the plane in presence of a magnetic field having a component in a first horizontal direction. The second suspended mass is configured so as to be mobile in a direction transversal to the plane in presence of a magnetic field having a component in a second horizontal direction, and the first suspended mass is configured so as to be mobile in a direction parallel to the plane and transversal to the current flowing in the first suspended mass in presence of a magnetic field having a component in a vertical direction.
    Type: Grant
    Filed: December 10, 2010
    Date of Patent: June 25, 2013
    Assignee: STMicroelectronics S.r.l.
    Inventors: Lorenzo Baldo, Francesco Procopio, Sarah Zerbini