Abstract: A soldering/desoldering apparatus has a handpiece with a handgrip portion from which a hot air tube extends, a vacuum pickup tube which extends through the handgrip portion and hot air tube, one end of which has a suction cup mounted thereon and an opposite end of which is connected to a flexible vacuum line. Furthermore, an adjustment knob for axially shifting the vacuum pickup tube is provided on the handgrip portion and the vacuum pickup tube is resiliently displaceably supported relative to a displacement mechanism formed by a slide rod fixed to an inner wall of the handgrip portion and a rack member slidably disposed on the slide rod and geared to the adjustment knob. The pickup tube is fixed to a slide bracket which is slidably disposed on the slide rod between the ends of the rack member and between a pair of coil springs which act to position the slide bracket in a neutral position between the ends of the rack member. Additionally, nozzles having a fixed vacuum pickup extension can be used.

Abstract: A control circuit for a vacuum desoldering apparatus includes a timing mechanism to ensure that vacuum is maintained for a necessary minimum amount of time, even if a vacuum actuation switch of the desoldering tool is prematurely deactivated by the operator. If the operator presses the vacuum actuator switch for a period of time longer than the predetermined minimum time, vacuum will flow until the switch is released. However, if the operator actuates the switch very briefly, that is, for less than the predetermined minimum vacuum actuation time, the vacuum supply is maintained in an activated state for the predetermined minimum time.

Abstract: A soldering iron including an insulator, a dissipator, and a hollow, cylindrical handle through which the electrical cable travels, and in which the wires, extending from the electrical cable and connected to the heater unit by individual plug and socket connectors, are able to move freely for making it easier to exchange the heating element but prevent the wires from being accidentally disconnected by pulling on the electrical cord during use. More specifically, a single electrical insulator body, which fits inside the dissipator, receives all of the electrical connectors. Furthermore, the insulator provides unidirectional strain relief by trapping the wires against an inside tapered portion of the dissipator when mounted within the dissipator and releases the wires in the opposite direction simply by the act of being removed from the dissipator.

Abstract: A handheld low voltage machining tool with which any one or more of drilling, milling, and abrading operations can be safely performed even on densely populated, multilayer, circuit boards. Provisions are made for preventing electrical overstress by isolating the tip of the machining tool from the drive motor as well as for preventing abrupt starting of the tool which can cause jerking, jumping or skipping of the tool off of the target. Still further, dynamic braking of the tool bit is achieved, both upon release of an operator actuated control switch and due to a selected conductive layer being reached. For the latter effect, a probe is provided by which a low voltage can be delivered to a component or conductor on the board, and circuitry detects grounding of this voltage by contact with the grounded bit of the machining tool.

Abstract: A thermocouple arrangement for developing, evaluating, monitoring and adjusting any process performed on or otherwise so as to thermally affect a printed circuit board assembly or other electronic assembly (including bare circuit board or boards in the manufacturing process), such as soldering/desoldering and various other production, rework and repair processes including cleaning, fluxing, preheating, thermocompression bonding and spot welding. In accordance with various embodiments, a layer of a first conductor material is applied on a first surface of an electrically insulative support, while a second layer of a second, dissimilar, conductor material is applied to at least one other surface of the support using conventional printed circuit board construction techniques.

Abstract: Apparatus for soldering and desoldering an electronic component to or from a printed circuit board includes an alignment station and a soldering/desoldering station. The printed circuit board is mounted upon an adjusable X-Y table which can be indexed between the alignment station and the soldering/desoldering station. To align an electronic component with respect to th PCB, a vacuum pickup device is operated at the alignment station to pickup and support the component within an optical field of view above the PCB and the X-Y table is adjusted in X, Y and .theta. directions with respect to the component. Upon alignment of the component, the pickup device is lowered to temporarily adhere the component to the PCB by an adhesive flux. Thereafter, the X-Y table is indexed to a preset position below a hot air soldering nozzle and the component soldered in a known manner. A rotary device for shearing a defective electronic device from a PCB is also attached to the bottom of the soldering/desoldering nozzle.

Abstract: A probe for use with circuitry for monitoring signals emanating from a heated electrical appliance, the probe including a planar member having three layers, the first layer including at least a first electrically conductive portion adapted to support a piece of solder, the second layer being an electrically insulating layer disposed between the first layer and a third layer, the third layer being electrically conductive. A novel method and circuit using the above probe are also disclosed wherein a heated soldering iron or solder extractor tip or the like melts the piece of solder to establish good electrical connection for the signals from the tip to the monitor circuit through the molten solder and the first portion of the first layer.

Abstract: This invention relates to a method and apparatus for removing and installing surface mounted devices (SMD's) with respect to a substrate such as a printed circuit board (PCB).

Abstract: A heater unit and control circuitry therefor, the heater unit typically being employed as a preheater or primary heater for the installation and removal of electronic components from a PCB or the like and having various means for accommodating (a) an uneven surface or the presence of other components on the underside of the board or (b) an unlevel board. Moreover, a heater unit for sequentially providing preheat and primary heat from different zones of the heater is disclosed. A probe for use with the heater for sensing the temperature at various points on the board is also disclosed. The circuitry is characterized by ease of calibration of the heater temperature, the temperature transducing circuits, and the temperature setting circuits thereof. Moreover, circuitry is provided to insure the same voltage out of each input source in response to the input source measuring or setting a common temperature.

Abstract: A heater unit and control circuitry therefor, the heater unit typically being employed as a preheater or primary heater for the installation and removal of electronic components from a PCB or the like and having various means for accommodating (a) an uneven surface or the presence of other components on the underside of the board or (b) an unlevel board. Moreover, a heater unit for sequentially providing preheat and primary heat from different zones of the heate is disclosed. A probe for use with the heater for sensing the temperature at various points on the board is also disclosed. The circuitry is characterized by ease of calibration of the heater temperature, the temperature transducing circuits, and the temperature setting circuits thereof. Moreover, circuitry is provided to insure the same voltage out of each input source in response to the input source measuring or setting a common temperature.

Abstract: A nozzle device is adjustably positionable over a component which is disposed on a substrate, for registering relatively precisely against the component relative to the substrate for delivering a flow of uniformly heated air. The heated air is directed to the sides of the component to melt solder associated with terminals thereon. A series of changeable nozzles can be used for various component and terminal configurations and can be moved into or out of registry with the component. A vacuum apparatus can be provided for contacting the component to remove the component from the substrate. Notched end portions of inwardly projecting walls on the nozzle provide accurate registration with upper edges of the component, and permit accurate spacing of a skirt portion of the device relatively evenly from the substrate and relatively evenly from the sidewalls of the component.

Abstract: A X-Y table is disclosed having a table rotatably mounted on a base for movement in the X-Y and .theta. directions. The device includes fine adjustments in both X and Y directions and a quick shear mechanism with means for automatically returning the table to its original position after the quick shear procedure. The table may be used as a stand above unit or particularly for use in installing and removing components from printed circuit boards.

Abstract: A desoldering method and apparatus for removal of molten solder from joined parts including a desoldering tool; a vacuum pump connected to the desoldering tool for applying vacuum thereto for removing the solder; a motor for energizing the pump; and circuitry for providing an initial, relatively high, voltage to the motor and for thereafter providing a relatively lower voltage to the motor so that, during the application of the high voltage to the motor, a relatively large pulse of the vacuum is applied to the joined parts to (a) effect removal of substantially all of the molten solder into the desoldering tool and (b) initiate cooldown of the parts and, during the application of the lower voltage to the motor, a relatively lower vacuum is continuously applied to maintain the cooldown of the parts.

Abstract: Measuring instrument which extracts and directly displays the vertical tracking angle of a phonograph pickup during playback of a known test record signal, and which also has the capability of measuring and directly displaying tracing distortion.