Patents by Inventor Louise Ann Malenfant

Louise Ann Malenfant has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package and method of preparing same
    Patent number: 6617674
    Abstract: A semiconductor package comprising a wafer having an active surface comprising at least one integrated circuit, wherein each integrated circuit has a plurality of bond pads; and a cured silicone layer covering the surface of the wafer, provided at least a portion of each bond pad is not covered with the silicone layer and wherein the silicone layer is prepare by the method of the invention.
    Type: Grant
    Filed: February 20, 2001
    Date of Patent: September 9, 2003
    Assignee: Dow Corning Corporation
    Inventors: Gregory Scott Becker, Geoffrey Bruce Gardner, Brian Robert Harkness, Louise Ann Malenfant, Satyendra Kumar Sarmah
  • Semiconductor package and method of preparing same
    Publication number: 20020158317
    Abstract: A semiconductor package comprising a wafer having an active surface comprising at least one integrated circuit, wherein each integrated circuit has a plurality of bond pads; and a cured silicone layer covering the surface of the wafer, provided at least a portion of each bond pad is not covered with the silicone layer and wherein the silicone layer is prepare by the method of the invention.
    Type: Application
    Filed: February 20, 2001
    Publication date: October 31, 2002
    Inventors: Gregory Scott Becker, Geoffrey Bruce Gardner, Brian Robert Harkness, Louise Ann Malenfant, Satyendra Kumar Sarmah