Abstract: An apparatus for plating a magnetic film on a substrate includes: a track including a plurality of stopping points along the track; a permanent magnet placed on the track such that the permanent magnet can be moved along the track towards and away from the stopping points; at least one plating tank positioned on the stopping point; and a removable high permeability iron flux concentrator inserted into gaps between the substrate and inside walls of the plating tank, substantially surrounding the substrate and extending around and under the substrate.

Abstract: An apparatus for plating a magnetic film on a substrate includes: a track including a plurality of stopping points along the track; a permanent magnet placed on the track such that the permanent magnet can be moved along the track towards and away from the stopping points; at least one plating tank positioned on the stopping point; and a removable high permeability iron flux concentrator inserted into gaps between the substrate and inside walls of the plating tank, substantially surrounding the substrate and extending around and under the substrate.

Abstract: An apparatus for plating a magnetic film on a substrate includes: a track including a plurality of stopping points along the track; a permanent magnet placed on the track such that the permanent magnet can be moved along the track towards and away from the stopping points; at least one plating tank positioned on the stopping point; and a removable high permeability iron flux concentrator inserted into gaps between the substrate and inside walls of the plating tank, substantially surrounding the substrate and extending around and under the substrate.

Abstract: A method of forming a ferromagnetic liner on conductive lines of magnetic memory devices and a structure thereof. The ferromagnetic liner increases the flux concentration of current run through the conductive lines, reducing the amount of write current needed to switch magnetic memory cells. The conductive lines are formed in a plate-up method, and the ferromagnetic liner is selectively formed on the plated conductive lines. The ferromagnetic liner may also be formed over conductive lines and a top portion of vias in a peripheral region of the workpiece.

Abstract: An electroplating apparatus, in accordance with the present invention, includes a plurality of chambers. A first chamber includes an anode therein. The first chamber has an opening for delivering an electrolytic solution containing metal ions onto a surface to be electroplated. The surface to be electroplated is preferably a cathode. A second chamber is formed adjacent to the first chamber and has a second opening in proximity of the first opening for removing electrolytic solution containing metal ions from the surface to be electroplated. The plurality of chambers are adapted for movement in a first direction along the surface to be electroplated.

Abstract: A cobalt-iron alloy film having saturation magnetization of at least about 2.30 Telsa. The film alloy includes about 55 wt % to about 75 wt. % iron and the remainder cobalt. The film is made by a process in which the film is electrodeposited from an aqueous medium which includes one or more ferrous salts, one or more cobaltous salts, a buffer having a pKa of about 6 to about 8, at least one carboxylic acid having a pKa of between about 3.5 and about 5.5, an aromatic sulfinic acid or its salt and optionally, a halide salt and/or a surfactant. The alloy film is useful as a write head in magnetic recording.

Abstract: A structure and fabrication technology for a reflective, ambient light, low cost display is described incorporating a plurality of cells laid out side by side and stacked as many as three levels on top of each other. Each stack of three cells being driven by an array of TFT's positioned on the bottom layer. Each cell comprises a light transmitting front window, three levels of individual cells RGB (Red, Green, and Blue) stacked on top of each other, each level having its own individual electrode, each electrode being connected by vertical conducting via holes running through each transparent dielectric spacert and being connected to a individual TFT. The bottom panel having a reflective surface so as to provide maximum reflectivity of the ambient light. Placed under the reflective surface is an array of TFT's which provide the electrical impulses necessary to set each individual potential in each vertically stacked cell with respect to ground potential.

Abstract: An apparatus and a method for filling high aspect ratio holes in electronic substrates that can be advantageously used for filling holes having aspect ratios larger than 5:1 are disclosed. In the apparatus, a filler plate and a vacuum plate are used in conjunction with a connection means such that a gap is formed between the two plates to accommodate an electronic substrate equipped with high aspect ratio via holes. The filler plate is equipped with an injection slot while the vacuum plate is equipped with a vacuum slot such that when a substrate is sandwiched therein, via holes can be evacuated of air and injected with a liquid simultaneously from a bottom side and a top side of the substrate. The present invention novel apparatus and method allows the filling of via holes that have small diameters, i.e., as small as 10 &mgr;m, and high aspect ratios, i.e.

Abstract: A cobalt-iron alloy film having saturation magnetization of at least about 2.30 Telsa. The film alloy includes about 55 wt % to about 75 wt. % iron and the remainder cobalt. The film is made by a process in which the film is electrodeposited from an aqueous medium which includes one or more ferrous salts, one or more cobaltous salts, a buffer having a pKa of about 6 to about 8, at least one carboxylic acid having a pKa of between about 3.5 and about 5.5, an aromatic sulfinic acid or its salt and optionally, a halide salt and/or a surfactant. The alloy film is useful as a write head in magnetic recording.

Abstract: Disclosed is a multilayer integrated circuit structure joined to a chip carrier, and a process of making, in which the area normally occupied by a solid dielectric material in the IC is at least partially hollow. The hollow area can be filled with a gas, such as air, or placed under vacuum, minimizing the dielectric constant. Several embodiments and processing variants are disclosed. In one embodiment of the invention, the wiring layers, which are embedded in a temporary dielectric, alternate with via layers, also embedded in a temporary dielectric, in which the vias, besides establishing electrical communication between the wiring layers, also provide mechanical support for after the temporary dielectric is removed. Additional support is optionally provided by support structures though the interior levels and at the periphery of the chip. The temporary dielectric is removed subsequent to joining by dissolution or by ashing in an oxygen-containing plasma.

Abstract: Disclosed is a multilayer integrated circuit structure joined to a chip carrier, and a process of making, in which the area normally occupied by a solid dielectric material in the IC is at least partially hollow. The hollow area can be filled with a gas, such as air, or placed under vacuum, minimizing the dielectric constant. Several embodiments and processing variants are disclosed. In one embodiment of the invention, the wiring layers, which are embedded in a temporary dielectric, alternate with via layers, also embedded in a temporary dielectric, in which the vias, besides establishing electrical communication between the wiring layers, also provide mechanical support for after the temporary dielectric is removed. Additional support is optionally provided by support structures though the interior levels and at the periphery of the chip. The temporary dielectric is removed subsequent to joining by dissolution or by ashing in an oxygen-containing plasma.

Abstract: A structure and fabrication technology for a reflective, ambient light, low cost display is described incorporating a plurality of cells laid out side by side and stacked as many as three levels on top of each other. Each stack of three cells being driven by an array of TFT's positioned on the bottom layer. Each cell comprises a light transmitting front window, three levels of individual cells RGB (Red, Green, and Blue) stacked on top of each other, each level having its own individual electrode, each electrode being connected by vertical conducting via holes running through each transparent dielectric spacert and being connected to a individual TFT. The bottom panel having a reflective surface so as to provide maximum reflectivity of the ambient light. Placed under the reflective surface is an array of TFT's which provide the electrical impulses necessary to set each individual potential in each vertically stacked cell with respect to ground potential.

Abstract: An electroplating apparatus, in accordance with the present invention, includes a plurality of chambers. A first chamber includes an anode therein. The first chamber has an opening for delivering an electrolytic solution containing metal ions onto a surface to be electroplated. The surface to be electroplated is preferably a cathode. A second chamber is formed adjacent to the first chamber and has a second opening in proximity of the first opening for removing electrolytic solution containing metal ions from the surface to be electroplated. The plurality of chambers are adapted for movement in a first direction along the surface to be electroplated.

Abstract: An electroplating apparatus, in accordance with the present invention, includes a plurality of chambers. A first chamber includes an anode therein. The first chamber has an opening for delivering an electrolytic solution containing metal ions onto a surface to be electroplated. The surface to be electroplated is preferably a cathode. A second chamber is formed adjacent to the first chamber and has a second opening in proximity of the first opening for removing electrolytic solution containing metal ions from the surface to be electroplated. The plurality of chambers are adapted for movement in a first direction along the surface to be electroplated.

Abstract: An apparatus and a method for filling high aspect ratio holes in electronic substrates that can be advantageously used for filling holes having aspect ratios larger than 5:1 are disclosed. In the apparatus, a filler plate and a vacuum plate are used in conjunction with a connection means such that a gap is formed between the two plates to accommodate an electronic substrate equipped with high aspect ratio via holes. The filler plate is equipped with an injection slot while the vacuum plate is equipped with a vacuum slot such that when a substrate is sandwiched therein, via holes can be evacuated of air and injected with a liquid simultaneously from a bottom side and a top side of the substrate. The present invention novel apparatus and method allows the filling of via holes that have small diameters, i.e., as small as 10 &mgr;m, and high aspect ratios, i.e.

Abstract: An apparatus and a method for filling high aspect ratio holes in electronic substrates that can be advantageously used for filling holes having aspect ratios larger than 5:1 are disclosed. In the apparatus, a filler plate and a vacuum plate are used in conjunction with a connection means such that a gap is formed between the two plates to accommodate an electronic substrate equipped with high aspect ratio via holes. The filler plate is equipped with an injection slot while the vacuum plate is equipped with a vacuum slot such that when a substrate is sandwiched therein, via holes can be evacuated of air and injected with a liquid simultaneously from a bottom side and a top side of the substrate. The present invention novel apparatus and method allows the filling of via holes that have small diameters, i.e., as small as 10 &mgr;m, and high aspect ratios, i.e.

Abstract: An integrated data storage disk and disk drive assembly includes a rotatably supported magnetic disk for storing data. A rotor is fixedly joined to the disk for rotating the disk, and includes a plurality of rotor poles. A stator includes a plurality of stator poles positioned around the rotor for sequentially cooperating with respective ones of the rotor poles for rotating the rotor to rotate the disk. The disk and drive may be fabricated using lithographic and electroplating techniques, and a plurality of coaxial disks may be driven by a single disk drive in exemplary embodiments.

Abstract: An integrated microfile includes a rotatably supported magnetic disk for storing data and a micromotor for rotating the disk. The micromotor includes a rotor fixedly joined to the disk and having a plurality of rotor poles. A stator includes a plurality of stator poles positioned around the rotor for sequentially cooperating with respective ones of the rotor poles for rotating the rotor to rotate the disk. A selectively movable access head is disposed adjacent to the disk for selectively addressing the data on the disk. The microfile may be fabricated using lithographic and electroplating techniques in subform-factor sizes in an exemplary embodiment.

Abstract: A superconducting multilayer ceramic substrate is disclosed, prepared by firing a laminate of at least two polymer bonded cast sheets of a ceramic dielectric oxide powder, at least one sheet of which has a metallization pattern provided thereon, to thereby form a superconducting oxide reaction layer at the interface between the sintered ceramic material and the embedded metallic conductor lines of the metallization pattern.

Abstract: A thin film of low magnetostriction Permalloy 80% nickel - 20% iron .+-. 1% is electroplated in a bath having a ratio of about 1.8:1 to 24:1 g/liter ratio of Ni to Fe ions with a plating current density from 10 ma/cm.sup.2 - 200 ma/cm.sup.2 when plating in sheet form or an Ni/Fe ratio of 25:1 to 85:1 with a current density of 2 ma/cm.sup.2 - 110 ma/cm.sup.2 when plating through a mask. The fluid in the system is constantly mixed, replenished with fresh iron, acid, and other reagents, is adjusted in temperature and subjected to a continuous laminar regime of mixing. Fresh solution is added to the bath from a reservoir where the above adjustments are made. The inlet for the fresh solution is at the lower end of the plating chamber and directed at a bath mixer which includes a slot through which the fresh solution is directed to optimize mixing in the plating chamber. Complexing agents are avoided. High speed plating is obtained with about 24.4 g/l of Ni.sup.++, 1.05 g/l of Fe.sup.++, 25 g/l of H.sub.3 BO.sub.